Effect of Brush Treatment and Brush Contact Sequence on Cross Contaminated Defects during CMP in-situ Cleaning

Hong Jin Kim 한국트라이볼로지학회 2015 한국트라이볼로지학회지 (Tribol. Lubr.) Vol.31 No.6

Chemical mechanical polishing (CMP) is one of the most important processes for enabling sub-14 nm semiconductor manufacturing. Moreover, post-CMP defect control is a key process parameter for the purpose of yield enhancement and device reliability. Due to the complexity of device with sub-14 nm node structure, CMP-induced defects need to be fixed in the CMP in-situ cleaning module instead of during post ex-situ wet cleaning. Therefore, post-CMP in-situ cleaning optimization and cleaning efficiency improvement play a pivotal role in post-CMP defect control. CMP in-situ cleaning module normally consists of megasonic and brush scrubber processes. And there has been an increasing effort for the optimization of cleaning chemistry and brush scrubber cleaning in the CMP cleaning module. Although there have been many studies conducted on improving particle removal efficiency by brush cleaning, these studies do not consider the effects of brush contamination. Depending on the process condition and brush condition, brush cross contamination effects significantly influence post-CMP cleaning defects. This study investigates brush cross contamination effects in the CMP in-situ cleaning module by conducting experiments using 300mm tetraethyl orthosilicate (TEOS) blanket wafers. This study also explores brush pre-treatment in the CMP tool and proposes recipe effects, and critical process parameters for optimized CMP in-situ cleaning process through experimental results.

Effect of Brush Treatment and Brush Contact Sequence on Cross Contaminated Defects during CMP in-situ Cleaning

Kim, Hong Jin Korean Tribology Society 2015 한국윤활학회지(윤활학회지) Vol.4 No.1

Chemical mechanical polishing (CMP) is one of the most important processes for enabling sub-14 nm semiconductor manufacturing. Moreover, post-CMP defect control is a key process parameter for the purpose of yield enhancement and device reliability. Due to the complexity of device with sub-14 nm node structure, CMP-induced defects need to be fixed in the CMP in-situ cleaning module instead of during post ex-situ wet cleaning. Therefore, post-CMP in-situ cleaning optimization and cleaning efficiency improvement play a pivotal role in post-CMP defect control. CMP in-situ cleaning module normally consists of megasonic and brush scrubber processes. And there has been an increasing effort for the optimization of cleaning chemistry and brush scrubber cleaning in the CMP cleaning module. Although there have been many studies conducted on improving particle removal efficiency by brush cleaning, these studies do not consider the effects of brush contamination. Depending on the process condition and brush condition, brush cross contamination effects significantly influence post-CMP cleaning defects. This study investigates brush cross contamination effects in the CMP in-situ cleaning module by conducting experiments using 300mm tetraethyl orthosilicate (TEOS) blanket wafers. This study also explores brush pre-treatment in the CMP tool and proposes recipe effects, and critical process parameters for optimized CMP in-situ cleaning process through experimental results.

시엠피(The Connected Mathematics Project)에 대한 고찰

김해규 ( Hae Gyu Kim ) 한국수학교육학회 2011 수학교육논문집 Vol.25 No.1

최근 연구가 진행되고 있는 2009 수학과 교육과정 개발 연구에 시사점을 제공할 목적으로 본 연구에서는 1990년대 이후에 미국에서 추진되고 있는 수학교육 개혁 프로그램 중의 하나인 ``The Connected Mathematics Project(이하, CMP)``에 대하여 고찰한다. 연구 내용들은 CMP를 추진하게 된 배경, 1991년에서 1996년 사이에 수행된 CMP(이하, CMP1)에서 개발된 교과서(이하, CMP1 교과서)에 대한 논란, CMP1을 수정·보완하기 위하여 2000년에서 2006년 사이에 수행된 CMP(이하, CMP2)의 교육과정이며, 문헌연구 방법을 통하여 살펴본 결과, CMP2 교육과정에서는 CMP1 교과서에 대해 제기된 논란을 일부 반영하여, 기본적인 기능 습득을 위한 절차를 도입하고 과다한 수업량과 시수를 감축할 뿐만 아니라 대수를 강조하고 자료 분석 내용들을 강화하였다. We study on the Connected Mathematics Project(CMP), one of the American mathematics education reform projects which have been promoted since the 1990s, so that we can provide some suggestions for the recent research of developing the 2009 Korean Mathematics Curriculum. In this paper, we examine the background of the CMP, the controversies over the textbooks [CMP1 textbooks] developed by CMP[CMP1] implemented from 1991 till 1996, and the curriculum of the CMP[CMP2] revised from CMP1 and carried from 2000 till 2006. Through the literature study, we can see that the CMP2 curriculum has reflected some of those controversies of the CMP1 textbooks by introducing procedures for students` acquiring basic skills, reducing the number of lessons and the contents supposed to be learned in each lesson, putting more stress on algebra and adding data analysis contents more.

생분해성 Calcium Metaphosphate골이식재의 골조직재생효과에 관한 연구

채한승,이용무,양승민,천성수,김석영,구영,정종평,한수부,최상묵,류인철,Chae, Han-seung,Lee, Yong-Moo,Yang, Seung-Min,Chun, Sung-Soo,Kim, Suk-Young,Ku, Young,Choung, Chong-Pyoung,Han, Soo-Boo,Choi, Sang-Mook,Rhyu, In-Chul 대한치주과학회 2003 Journal of Periodontal & Implant Science Vol.33 No.1

Periodontal regeneration therapy with bone-substituting materials has gained favorable clinical efficacy by enhancing osseous regeneration in periodontal bony defect. As bone-substituting materials, bone powder, calcium phosphate ceramic, modified forms of hydroxyapatite, and hard tissue replacement polymer have demonstrated their periodontal bony regenerative potency. Bone-substituting materials should fulfill several requirements such as biocompatibility, osteogenecity, malleability, biodegradability. The purpose of this study was to investigate biocompatibility, osteo-conduction capacity and biodegradability of $Na_2O$, $K_2O$ added calcium metaphosphate(CMP). Beta CMP was obtained by thermal treatment of anhydrous $Ca_2(H_2PO_4)_2$. $Na_2O$ and $K_2O$ were added to CMP. The change of weight of pure CMP, $Na_2O$-CMP, and $K_2O$-CMP in Tris-buffer solution and simulated body fluid for 30 days was measured. Twenty four Newzealand white rabbits were used in negative control, positive control(Bio-Oss), pure CMP group, 5% $Na_2$-CMP group, 10% $Na_2O$-CMP goup, and 5% $K_2O$-CMP group. In each group, graft materials were placed in right and left parietal bone defects(diameter 10mm) of rabbit. The animals were sacrificed at 3 months and 6 months after implantation of the graft materials. Degree of biodegradability of $K_2O$ or $Na_2O$ added CMP was greater than that of pure CMP in experimental condition. All experimental sites were healed with no clinical evidence of inflammatory response to all CMP implants. Histologic observations revealed that all CMP grafts were very biocompatible and osseous conductive, and that in $K_2O$-CMP or $Na_2O$-CMP implanted sites, there was biodegradable pattern, and that in site of new bone formation, there was no significant difference between all CMP group and DPBB(Bio-Oss) group. From this result, it was suggested that all experimental CMP group graft materials were able to use as an available bone substitution.

웨이퍼 레벨 Cu 본딩을 위한 Cu/SiO² CMP 공정 연구

이민재,김사라은경,김성동,Lee, Minjae,Kim, Sarah Eunkyung,Kim, Sungdong 한국마이크로전자및패키징학회 2013 마이크로전자 및 패키징학회지 Vol.20 No.2

Chemical mechanical polishing (CMP) has become one of the key processes in wafer level stacking technology for 3D stacked IC. In this study, two-step CMP process was proposed to polish $Cu/SiO_2$ hybrid bonding surface, that is, Cu CMP was followed by $SiO_2$ CMP to minimize Cu dishing. As a result, Cu dishing was reduced down to $100{\sim}200{\AA}$ after $SiO_2$ CMP and surface roughness was also improved. The bonding interface showed no noticeable dishing or interface line, implying high bonding strength. 본 연구에서는 웨이퍼 레벨 Cu 본딩을 이용한 3D 적층 IC의 개발을 위해 2단계 기계적 화학적 연마법(CMP)을 제안하고 그 결과를 고찰하였다. 다마신(damascene) 공정을 이용한 $Cu/SiO_2$ 복합 계면에서의 Cu dishing을 최소화하기 위해 Cu CMP 후 $SiO_2$ CMP를 추가로 시행하였으며, 이를 통해 Cu dishing을 $100{\sim}200{\AA}$까지 낮출 수 있었다. Cu 범프의 표면거칠기도 동시에 개선되었음을 AFM 관찰을 통해 확인하였다. 2단 CMP를 적용하여 진행한 웨이퍼 레벨 Cu 본딩에서는 dishing이나 접합 계면이 관찰되지 않아 2단 CMP 공정이 성공적으로 적용되었음을 확인할 수 있었다.

慢性疲勞 症候群 환자의 經絡機能 檢査結果에 관한 分析

安圭錫,李奭遠 대한동의병리학회 1999 동의생리병리학회지 Vol.13 No.1

경락기능검사를 통하여 다음과 같은 두가지 소견을 얻었다. 첫째는 경락기능검사의 한의학적 판독은 CMP와 BAP의 평균값을 산출한 후 먼저 동일 경락의 좌 우 CMP값이 평균값의 5% 이상의 차이를 이루고 있는 경락을 불균형 경락이라 정의하여야 하며, 이 중 좌 우값 중 하나는 정상 다른 하나는 항진의 경우에는 항진 불균형이라, 좌 우값 모두가 항진 되면서 불균형을 이루는 경우에는 진성 항진 불균형이라 하여야 한다는 것이다. 또한, 좌 우값 중 하나는 정상 다른 하나는 저하의 경우에는 저하 불균형이라, 좌 우값 모두가 저하되면서 불균형을 이루는 경우에는 진성 저하 불균형이라 하여야 한다. 좌 우값 모두가 정상 범위에 있는 경우에는 정상 불균형이라, 좌 우값 중 하나는 항진 다른 하나는 저하된 경우에는 비정상 불균형이라 정의하여야 한다. 또한, CMP와 BAP의 평균값을 중심으로 +5% 이상의 값을 갖는 경락을 기능 항진 경락이라 하고, 이 중 좌 우값 모두가 항진 된 경우를 진성 항진이라, 좌 우값 중 하나는 정상 다른 하나는 항진 된 경우를 가성 항진이라 하여야 한다. 그리고, -5% 이상의 값을 갖는 경락을 기능 저하 경락이라 하고, 이 중 좌 우값 모두가 저하된 경우를 진성 저하 경락이라 하고, 좌 우값 중 하나는 정상 다른 하나는 저하된 경우를 가성 저하 경락이라 하여야 한다. 둘째는 만성 피로 증후군의 경락기능검사의 가장 두드러진 특징은 대장, 신경변성, 순환(심포)의 진성 저하와 간의 진성 항진이다. 이는 현대인들이 육체적인 노동으로 인한 피로보다는 정신적 자극에 인한 피로가 유발되는 경향이 높아서 자율신경기능의 실조로 인해 간 기능이 항진, 신경변성의 저하로 나타나고 이는 순환(심포)에 영향을 주게 되며 이로 인해 대장의 기능도 저하되는 것으로 추측된다. CMP 평균값이 50미만의 경우는 다른 군과 달리 불균형 상태를 나타내는 경락이 많다. 림프, 기관조직변성, 관절변성, 결합조직변성, 피부 등의 경락에서 불균형 현상이 나타나고 있다. 반면, CMP 평균값이 65초과의 경우에는 손에 분포한 경락에서는 저하 현상이 두드러지고, 발에 분포한 경락에서는 항진이 두드러지게 나타나고 있다. 1. The mean values of CMP and BAP measured by EAV(Electro-puncture According to Voll) are used to interpret the Meridian Function Test according to Oriental medicine. Meridians with over 5% of difference in the mean values of CMP on the identical left and right are defined as 'unbalanced meridians': those with the mean values normal on one side and higher on the other side are defined as 'unbalanced hyperactive'; those with the mean values higher on both sides, as 'true unbalanced hyperactive'; those normal on one side and lower on the other side, as 'unbalanced hypoactive'; and those lower on both sides, as 'true unbalanced hypoactive'. Meridians of which the CMP mean values are normal in range but associated with pathologic conditions are defined as 'normal unbalanced'; those with the mean values of CMP higher on one side and lower on the other side, as 'abnormal unbalanced'. In terms of the mean values in CM and BAP, meridians with over +5% of difference are described as hyperactive, among them ones with both sides higher in range called 'true hyperactive' and ones with one side normal and the other side higher called false hyperactive. Meridians with over -5% of difference of mean value are defined as 'hypoactive', and similarly ones with the mean values on both sides lower are called 'true hypoactive' and ones with one side normal and the other side lower, then called 'false hypoactive'. 2. The most remarkable features of chronic fatigue syndrome are hyperactivity of the Liver meridian and hypoactivity of the Large intestines, the Neuro-degeneration and the Circulative meridians. The failure of the autonomous nervous system leads to the degeneration of the nerves and the hyperactivity of the liver, affecting the circulative system(Shimpo, 心包) and therefore weakening the large intestines. This indicates that the fatigue of our subjects is due to psychiatric causes rather than physical ones. With the mean value of CMP less than 50, the number of unbalanced meridians tends to be increasing compared to that of over 50, and this is evident particularly in the articulo-degeneration, the connective tissue-degeneration, and the skin meridians. On the other hand, with the mean value of CMP over 65, meridians running around the hands tend to be hypoactive and those around the feet to be hyperactive.

Soluble Production of CMP-Neu5Ac Synthetase by Co-expression of Chaperone Proteins in Escherichia coli

최화영 ( Hwa Young Choi ),이령 ( Ling Li ),조승기 ( Seung Kee Cho ),이원흥 ( Won Heong Lee ),서진호 ( Jin Ho Seo ),한남수 ( Nam Soo Han ) 한국미생물생명공학회(구 한국산업미생물학회) 2014 한국미생물·생명공학회지 Vol.42 No.2

CMP-Neu5Ac synthetase는 sialyated 된 glycoconjugates의 전구체로 사용되는 CMP-Neu5Ac를 합성하는데 관여하는 주요 효소이다. Escherichia coli K1에서 유래한 CMP-Neu5Ac synthetase 유전자 (neuA)는 평소 E. coli BL21(DE3)에서 비수용성으로 생성되는데, 이를 수용성 단백질로 생산하고자 여러 가지 샤페론 단백질 동시 발현기술을 이용하였다. 이를 위해, GroEL-ES와 DnaK-DnaJ-GrpE를 암호화하는 pG-KJE8 plasmid와 neuA를 동시 형질전환 시켰고 0.01 mM IPTG와 0.005 mg/ml의 L-arabinose로 유도하여20oC에서 발현시켰다. 그 결과, E. coli에서의 수용성 CMP-Neu5Ac Synthetase 생산이 현저하게 증가하였다. CMP-Neu5Ac synthetase is a key enzyme for the synthesis of CMP-Neu5Ac, which is an essential precursor of sialylated glycoconjugates. For the soluble expression of the CMP-Neu5Ac synthetase gene (neuA) from Escherichia coli K1, various heat shock proteins were coexpressed in E. coli BL21 (DE3) Star. In order to do this, a pG-KJE8 plasmid encoding genes for GroEL-ES and DnaK-DnaJ-GrpE was co-transformed with neuA and was expressed at 20°C by addition of 0.01 mM IPTG and 0.005 mg/mL L-arabinose. The coexpression of various heat shock proteins resulted in remarkably improved production of soluble CMP-Neu5Ac synthetase in E. coli.

웨이퍼 레벨 3D Integration을 위한 Ti/Cu CMP 공정 연구

김은솔,이민재,김성동,김사라은경,Kim, Eunsol,Lee, Minjae,Kim, Sungdong,Kim, Sarah Eunkyung 한국마이크로전자및패키징학회 2012 마이크로전자 및 패키징학회지 Vol.19 No.3

Cu 본딩을 이용한 웨이퍼 레벨 적층 기술은 고밀도 DRAM 이나 고성능 Logic 소자 적층 또는 이종소자 적층의 핵심 기술로 매우 중요시 되고 있다. Cu 본딩 공정을 최적화하기 위해서는 Cu chemical mechanical polishing(CMP)공정 개발이 필수적이며, 본딩층 평탄화를 위한 중요한 핵심 기술이라 하겠다. 특히 Logic 소자 응용에서는 ultra low-k 유전체와 호환성이 좋은 Ti barrier를 선호하는데, Ti barrier는 전기화학적으로 Cu CMP 슬러리에 영향을 받는 경우가 많다. 본 연구에서는 웨이퍼 레벨 Cu 본딩 기술을 위한 Ti/Cu 배선 구조의 Cu CMP 공정 기술을 연구하였다. 다마싱(damascene) 공정으로 Cu CMP 웨이퍼 시편을 제작하였고, 두 종류의 슬러리를 비교 분석 하였다. Cu 연마율(removal rate)과 슬러리에 대한 $SiO_2$와 Ti barrier의 선택비(selectivity)를 측정하였으며, 라인 폭과 금속 패턴 밀도에 대한 Cu dishing과 oxide erosion을 평가하였다. The wafer level stacking with Cu-to-Cu bonding becomes an important technology for high density DRAM stacking, high performance logic stacking, or heterogeneous chip stacking. Cu CMP becomes one of key processes to be developed for optimized Cu bonding process. For the ultra low-k dielectrics used in the advanced logic applications, Ti barrier has been preferred due to its good compatibility with porous ultra low-K dielectrics. But since Ti is electrochemically reactive to Cu CMP slurries, it leads to a new challenge to Cu CMP. In this study Ti barrier/Cu interconnection structure has been investigated for the wafer level 3D integration. Cu CMP wafers have been fabricated by a damascene process and two types of slurry were compared. The slurry selectivity to $SiO_2$ and Ti and removal rate were measured. The effect of metal line width and metal density were evaluated.

Cu CMP에서의 연마 균일성에 관한 기계적 해석

이현섭,박범영,정해도,김형재,Lee, Hyun-Seop,Park, Boum-Young,Jeong, Hae-Do,Kim, Hyoung-Jae 한국전기전자재료학회 2007 전기전자재료학회논문지 Vol.20 No.1

Most studies on copper Chemical Mechanical Planarization (CMP) have focused on material removal and its mechanisms. Although many studies have been conducted on the mechanism of Cu CMP, a study on uniformity in Cu CMP is still unknown. Since the aim of CMP is global and local planarization, the approach to various factors related to uniformity in Cu CMP is essential to elucidate the Cu CMP mechanism as well. The main purpose of the experiment reported here was to investigate and mechanically analyze the roles of slurry components in the formation of the uniformity in Cu CMP. In this paper, Cu CMP was performed using citric acid($C_{6}H_{8}O_{7}$), hydrogen peroxide($H_{2}O_{2}$), colloidal silica, and benzotriazole($BTA,\;C_{6}H_{4}N_{3}H$) as a complexing agent, an oxidizer, an abrasive, and a corrosion inhibitor, respectively. All the results of this study showed that within-wafer non-uniformity(WIWNU) of Cu CMP could be controlled by the contents of slurry components.

Effect of Trichloroacetic Acid on the Solubility of Caseinomacropeptide

Shin, Sung-Chul,Jang, Hae-Dong The Korean Society of Food Science and Nutrition 2002 Preventive Nutrition and Food Science Vol.7 No.1

Crude caseinomacropeptide (CMP) was prepared from Na-caseinate using a commercial renneting enzyme. Most of the crude CMP was released from the Na-caseinate by hydrolyzing with the enzyme for 40 min. The hydrolysis of the k-casein with carbohydrate was slower than that of the k-casein without carbohydrate, as shown by the analyses of the sialic acid content and the tricine-SDS-polyacrylamide gel electrophoresis. The yield of crude CMP from Na-caseinate was 3.7%. Cation exchange chromatography showed that the crude CMP consisted of 40.5% CMP and 59.5% caseinogylcomacropetide (CGP). The effect of the TCA concentration on the solubility of CMP and CGP was determined by using crude CMP. The amounts of crude CMP and sialic acid decreased in the proportion to the increase of trichloroacetic acid (TCA) concentration from 2 to 12%, suggesting that the CGP containing carbohydrate, as well as the CMP having no carbohydrate, was precipitated in a range of 4 to 12%, depending on the TCA concentration. This result supports the hypothesis that the different non-glycosylated and glycosylated forms of CMP have different sensitivities to TCA precipitation.