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이우영 한국기술교육대학교 1994 論文集 Vol.1 No.1
This paper studies the experimental and numerical analysis of the residual stresses on the surfaces of the high strength thick plate with 20mm thickness or more which undergoes the working of plastic bending. The hole drilling method is used for measuring the residual stress experimentally at several conditions considering the rolling directions of the plate, bending angles and bending axes. Also for comparing with the experimental results and developing the modeling technique the finite element analysis using the ANSYS package has performed. Using the result, the design for reducing the manufacturing time and cost can be achieved by changing the processes from welding to bending.
반도체 Package용 Seam Seal Welding System 개발
이우영,진경복,오장환,김경수 호서대학교 반도체제조장비국산화연구센터 2003 학술대회 자료집 Vol.2003 No.1
Seam seal welding on the semi-conductor package is a process for sealing the packages of semi-conductors, crystal parts, saw filters, oscillators with lid plate by seam welding. This paper present the development process of automatic seam seal welding system. In this process, the process algorithm, high precision welding current control, design of welding head, high speed and high precision feeding mechanism, user interface process control program technologies are included.
이우영,신동훈,이재문,한승호 대한체질인류학회 2002 해부·생물인류학 (Anat Biol Anthropol) Vol.15 No.4
Anthropometry of a Male Child Mummy from a Tomb of Joseon Dynasty Period in KoreaU-Young Lee, Dong -Hoon Shin1, Jae-Moon Lee2, Seung-Ho Han