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Dual-anchor anti-corrosion coating of copper foil for high-speed interconnects
Huijuan Shi,Guoyun Zhou,Qin Zhang,Pengju Wang,Yan Hong,Wei He,Shouxu Wang,Chong Wang,Zhiwei Han 한국공업화학회 2023 Journal of Industrial and Engineering Chemistry Vol.126 No.-
In this experiment, two similar molecules with bifunctional groups have been characterized to prove theadvantages of dual-anchor molecular coating in the interfacial modification of the copper foil. The physicochemicalproperties of the modified copper foils have been studied. The obtained results indicate thatthe anti-corrosion performance and peeling strength were significantly improved for the copper foil treatedwith (2-(Methylthio)pyrimidin-4-yl)methanamine (MET), whose bonding information was analyzedvia the density functional theory calculation. It was found that the S-Cu and N-Cu bonds were bothformed on the Cu (1 1 1) surface for MET coating, and the adsorption of the double anchor pointsimproves the stability of the interface. The peeling test exhibits the function of MET coating as the adhesionpromotor between low-surface profile copper and resin for high-speed signal transmission.
서기정(Kijeong Seo),한승우(Seungwoo Han),김완두(Wandoo Kim),이학주(Hakjoo Lee),이현우(Hyunwoo Lee),신재호(Jaeho Shin),이재준(Jaejoon Lee) 대한기계학회 2006 대한기계학회 춘추학술대회 Vol.2006 No.6
The mechanical properties and the fatigue-life behavior of two layers thin copper foils onto elastic polyimide substrates were characterized for two different products, namely a rolled copper foil (18 ㎛ thick Cu/25 ㎛ thick PI) and a electrodeposited (ED) copper foil (12 ㎛ thick Cu/20 ㎛ thick PI). The results indicated that the ultimate tensile strength σ<SUB>u</SUB> and the life cycles to failure N<SUB>f</SUB>, under both monotonic tensile and tensile-tensile high cycle fatigue conditions, are lower for the rolled foil than for the ED foil.
Ting-Ting Su,Wen-Feng Ren,Jiang-Meng Yuan,Ke Wang,Bing-Yu Chi,Run-Cang Sun 한국공업화학회 2022 Journal of Industrial and Engineering Chemistry Vol.109 No.-
The commercial application of silicon (Si) anodes with high theoretical capacity is hampered by the poorcyclic stability because the huge volume change of Si during discharge/charge processes results in thepulverization of electrode materials and the electric contact loss of electrode materials with copper(Cu) foils. Binders play an important role for adhering active materials and conductive additives togetheronto Cu foils. Herein, we design and develop a three-dimensional networked composite binder (PAA-co-SN) via an amidation reaction between polyacrylic acid (PAA) and thiourea (SN). The granular anchors(CuxS) are constructed at the interface between PAA-co-SN binders and Cu foils, resulting from the reactionof S and Cu during the drying processes of Si electrodes. When used as binders for Si nanoparticles,they exhibit stable cyclic performance (1580 mAh g1 after 500 cycles). The anchoring mechanismbetween composite binders and Cu foils provides a strategy for the improvement of electrochemicalproperties of Si-based anodes for lithium-ion batteries.
A Study on the Optimization of Welding Parameters for Titanium Drums Using Optimization Algorithms
오원빈,이보람,Bong Yong Kang,Ji-Yeon Shim,Gi-Hoon Lee,Ill-Soo Kim 대한용접접합학회 2023 대한용접·접합학회지 Vol.41 No.3
An electrolytic copper foil uses titanium drums, which exhibit excellent corrosion resistance and can produce thin electrodeposited copper foils. The appropriate technology for producing thin copper foils is required as electronic products become lighter, thinner, shorter, and smaller. Thus, the importance of titanium drum manufacturing technology, which affects the specifications of electrolytic copper foils, is emphasized. In this study, thermo-elastic-plastic analysis is performed to select an appropriate range of welding process parameters for titanium drums. In addition, using a range of welding process variables derived from analysis, GBO and GPS algorithms, which are optimization algorithms, are developed to derive objective and restriction functions as well as to select the optimal algorithm.
O<sub>2</sub> / Ar 플라즈마를 이용한 구리호일 표면 개질에 관한 연구
이종찬,손진영,김문근,권광호,이현우,Lee, Jongchan,Son, Jinyoung,Kim, Moonkeun,Kwon, Kwang-Ho,Lee, Hyunwoo 한국전기전자재료학회 2013 전기전자재료학회논문지 Vol.26 No.11
In this study, the surface modification of copper foil using an inductively coupled $O_2$ / Ar plasma as $O_2$ gas fraction (0~100%) was investigated in order to improve the surface characteristics. After plasma treatment, the measurement of the surface roughness, surface contact angle and surface energy were performed for the surface analysis of copper foil. As a result, the surface roughness and the surface energy were increased. And plasma diagnostics was performed by a double Langmuir probe (DLP) and optical emission spectroscopy (OES). Using these results, the plasma surface modification mechanism was investigated.
Effect of Additives on the Elongation and Surface Properties of Copper Foils
우태규,박일송,설경원 대한금속·재료학회 2013 ELECTRONIC MATERIALS LETTERS Vol.9 No.3
We report on the effects of additives on the mechanical properties of electrodeposited copper foils. Additives A (leveler), B (brightener) and C (Coll-A) are used in this study, and additive D is used as a Cl− ion. The study results show that there are large differences in surface roughness and elongation, according to whether the additives are added singly or in combination. In the case of additive D, its addition exhibits a high tendency to grow crystals in a (220) direction, and leads to increased elongation; however, it also exhibits the disadvantage of increasing surface roughness. The addition of all four additives results in a low surface roughness of less than 1 um, and shows low tensile strengths and uniform grain sizes. Here,the elongation is 15.6%, which represents an increase in elongation by 34% when compared to that of not adding additives.
우태규,박일송,정광희,손규송,송람,이만형,황영규,설경원 대한금속·재료학회 2012 대한금속·재료학회지 Vol.50 No.3
The objective of this study is to investigate the effect of additives on the mechanical and electrical characteristics of electrodeposited copper foils. Additives A(leveler) and B(brightener) were used in this study and Cl ions were used as an accelerator. In case of using these additives A and B, it showed a disadvantage that decreased the elongation of electrodeposited layer due to decreased grain sizes and increased tensile strength. On the other hand, the Cl ions decreased the specific resistance of the copper layer and increased elongation owing to increasing grain sizes. The highest elongation and lowest resistivity were measured in the group added only Cl ions, whose values were 21.9% and 3.11 μΩ-cm, respectively.
Yu, Hak Ki,Balasubramanian, Kannan,Kim, Kisoo,Lee, Jong-Lam,Maiti, Manisankar,Ropers, Claus,Krieg, Janina,Kern, Klaus,Wodtke, Alec M. American Chemical Society 2014 ACS NANO Vol.8 No.8
<P>We present a simple approach to improving the quality of CVD grown graphene, exploiting a Cu(111) foil catalyst. The catalyst is epitaxially grown by evaporation on a single crystal sapphire substrate, thickened by electroplating, and peeled off. The exposed surface is atomically flat, easily reduced, and exclusively of (111) orientation. Graphene grown on this catalyst under atmospheric CVD conditions and without wet chemical prereduction produces single crystal domain sizes of several hundred micrometers in samples that are many centimeters in size. The graphene produced in this way can easily be transferred to other substrates using well-established techniques. We report mobilities extracted using field-effect (as high as 29 000 cm<SUP>2</SUP> V<SUP>–1</SUP> s<SUP>–1</SUP>) and Hall bar measurement (up to 10 100 cm<SUP>2</SUP> V<SUP>–1</SUP> s<SUP>–1</SUP>).</P><P><B>Graphic Abstract</B> <IMG SRC='http://pubs.acs.org/appl/literatum/publisher/achs/journals/content/ancac3/2014/ancac3.2014.8.issue-8/nn503476j/production/images/medium/nn-2014-03476j_0007.gif'></P><P><A href='http://pubs.acs.org/doi/suppl/10.1021/nn503476j'>ACS Electronic Supporting Info</A></P>
티타늄 기지을 이용한 구리 전해도금 시 Arabic Gum 첨가제의 영향
우태규,박일송,이현우,설경원,Woo, Tae-Gyu,Park, Il-Song,Lee, Hyun-Woo,Seol, Kyeong-Won 한국재료학회 2006 한국재료학회지 Vol.16 No.12
The purpose of this study is to identify the effect of additives during copper electrodeposition. Additives such as arabic gum, chloride ions and glue were used in this study. Electrochemical experiments allied to SEM and roughness examination were performed to characterize of the copper foil in the presence of additives. In the production of electrodeposited copper foil, the surface roughness and grain size of the copper foil can be controlled by addition additives. on this study, the more uniform and hemispherical copper crystals are during the initial stages, the smaller crystal size and surface roughness of copper foil are. The surface roughness of copper foil electrodeposited at the current density of 500 $mA/cm^2$ under galvanostatic mode for 60 seconds has a minimum value of 0.136 ${\mu}$m when adding 2 ppm of arabic gum.