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The Assessment Method for the Strategic Potential of Personnel with the Example of JTI Kazakhstan
Samal Tazhiyeva,Aigul Otarbayeva 한국유통과학회 2016 The Journal of Industrial Distribution & Business( Vol.7 No.2
Purpose – The purpose of this article is to review the key features and benefits with different methods which is suitable for a particular organization (in this article JTI Kazakhstan) as well as for assessing the capacity of a staff and identification. Research design, data and methodology – Current approaches were used to assess a staff capacity and classify groups. By comparing each other and marked different application methods, this article developed the method for the employment of personal potential and control management process. Results – Through this analysis, assessing labor capacity functioned as an evaluation and assessment for employee competence. Examples suggested practical recommendations for assessing employees labor potential. Conclusions – It is important not just to bring together several techniques but adapt the conditions with existing organization with the professionalism and experience of specialists in managing the evaluation process. In terms of the implementation of this task, it is necessary to have knowledge in the field of psychology as well as business processes, objectives, and specificities of companies including the relevant personal qualities.
Samal, S.,Lee, J.,Jeong, D.Y.,Kim, H. Elsevier 2015 Thermochimica acta Vol.604 No.-
The thermal properties of SiO<SUB>2</SUB>-Al<SUB>2</SUB>O<SUB>3</SUB>-Y<SUB>2</SUB>O<SUB>3</SUB> glasses were investigated within a temperature range of 25-800<SUP>o</SUP>C. This found that glass with a composition of 24Y<SUB>2</SUB>O<SUB>3</SUB>.21Al<SUB>2</SUB>O<SUB>3</SUB>.55SiO<SUB>2</SUB> exhibits a thermal conductivity of 1.04W/mK at room temperature, and thermal conductivity increases with temperature due to an increase in the amount of bridging oxygen. The thermal conductivity of glasses with a composition of xY<SUB>2</SUB>O<SUB>3</SUB>.21Al<SUB>2</SUB>O<SUB>3</SUB>.(79-x)SiO<SUB>2</SUB>, on the other hand, decreased with an increase in either the Y<SUB>2</SUB>O<SUB>3</SUB> content or Al<SUB>2</SUB>O<SUB>3</SUB>/SiO<SUB>2</SUB> ratio. This decrease in thermal conductivity was analyzed with respect to the decrease in phonon mean free path resulting from the increased non-bridging oxygen content, which revealed 24Y<SUB>2</SUB>O<SUB>3</SUB>.21Al<SUB>2</SUB>O<SUB>3</SUB>.55SiO<SUB>2</SUB> to have the maximum thermal conductivity of 1.7W/mK at 800<SUP>o</SUP>C. Glass systems incorporating yttria can therefore be considered suitable sintering additives for highly thermally conducting ceramics such as silicon nitride.
Machine Learning Based Variation Modeling and Optimization for 3D ICs
Samal, Sandeep Kumar,Chen, Guoqing,Lim, Sung Kyu The Korea Institute of Information and Commucation 2016 Journal of information and communication convergen Vol.14 No.4
Three-dimensional integrated circuits (3D ICs) experience die-to-die variations in addition to the already challenging within-die variations. This adds an additional design complexity and makes variation estimation and full-chip optimization even more challenging. In this paper, we show that the industry standard on-chip variation (AOCV) tables cannot be applied directly to 3D paths that are spanning multiple dies. We develop a new machine learning-based model and methodology for an accurate variation estimation of logic paths in 3D designs. Our model makes use of key parameters extracted from existing GDSII 3D IC design and sign-off simulation database. Thus, it requires no runtime overhead when compared to AOCV analysis while achieving an average accuracy of 90% in variation evaluation. By using our model in a full-chip variation-aware 3D IC physical design flow, we obtain up to 16% improvement in critical path delay under variations, which is verified with detailed Monte Carlo simulations.
A Journey from Bulk MOSFET to 3 nm and Beyond
Asharani Samal,Suman Lata Tripathi,Sushanta Kumar Mohapatra 한국전기전자재료학회 2020 Transactions on Electrical and Electronic Material Vol.21 No.5
To overcome scaling issues such as controlling gate leakage, drain induced barrier lowering, higher subthreshold conduction, polysilicon gate depletion, and other short channel eff ects various engineering proposed. The gate dielectric, metal work function, and device structural engineering enabled the semiconductor industry to make a transition from the conventional planar MOSFET towards a revolutionary 3D tri-gate structure called FinFET. FinFET is one of the fundamental invention in the semiconductor industry, which replaced the planar CMOS technology around 22 nm technology. By following Moore’s law, it accelerated the scaling to 7 nm, but at 5 nm, in the same way, GAAFET replaced FinFET due to technological hurdles. Nanosheet, which is one type of GAAFET are in the recent trend. But researchers are trying to explore the possibilities to continue the miniaturization beyond 3 nm by combining the eff ect of non-silicon channel material such as Ge, InGaAs, or 2D materials with nanosheet, which will improve the functionality of the device while going down in the technology node. In this survey, an attempt has been made for the structure present till 7 nm process. Also, a few new proposals in research to take the scaling up to 3 nm and beyond are included. The future innovations may put an intercept on the slowing down of Moore’s law, and bring the miniaturization back in the track.
Transfer Dysphagia Due To Focal Dystonia
Priyanka Samal,Vinay Goyal,Govind K Makharia,Chandan J. Das,Sankar Prasad Gorthi,Vishnu V Y,Mamta Bhushan Singh,M V Padma Srivastava 대한파킨슨병및이상운동질환학회 2018 Journal Of Movement Disorders Vol.11 No.3
Objective The inability to propel a bolus of food successfully from the posterior part of the oral cavity to the oropharynx is defined as transfer dysphagia. The present case series describes the varied presentation of transfer dysphagia due to focal dystonia and highlights the importance of early detection by following up on strong suspicions. Methods We describe seven cases of transfer dysphagia due to focal dystonia. Transfer dysphagia as a form of focal dystonia may appear as the sole presenting complaint or may present with other forms of focal dystonia. Results Four out of seven patients had pure transfer dysphagia and had previously been treated for functional dysphagia. A high index of suspicion, barium swallow including videofluoroscopy, associated dystonia in other parts of the body and response to drug therapy with trihexyphenidyl/tetrabenazine helped to confirm the diagnosis. Conclusion Awareness of these clinical presentations among neurologists and non-neurologists can facilitate an early diagnosis and prevent unnecessary investigations.