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Micro Sensor Actuator Systems and Three-dimensional Microfabrication
ESASHI, Masayoshi 경북대학교 센서기술연구소 1994 센서技術學術大會論文集 Vol.5 No.1
Packaged micromechanical sensors were fabricated using bonded glass-silicon microstructures. These are integrated, resonant or force-balancing sensors. Two-dimensional optical scanner, distributed electrostatic microactuator (DEMA) and three-dimentional microfabrication methods were developed.
Micromachined Si cantilever arrays for parallel AFM operation
안유민,Takahito Ono,Masayoshi Esashi 대한기계학회 2008 JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY Vol.22 No.2
Silicon cantilever arrays with a very small pitch for parallel AFM operations were studied. We fabricated 1x104 in eight groups and 1x30 Si probe arrays and produced a smaller pitch (15 m) between probe tips by using Si anisotropic etching with a vertical wall shaped oxide mask. The vertical controls of Si probes were able to operate individually or in a group by integrating electrostatic actuators into the cantilevers of the probes. The fabricated Si cantilever arrays showed reasonable dynamic characteristics for the probe cantilever and reliable parallel operation of AFM.
INTEGRATED COMMUNICATION AND CONTROL CIRCUIT FOR MULTI-LINK ACTIVE CATHETER
Park, Ki-Tae,Minami, Kazuyiki,Esashi, Masayoshi 경북대학교 센서기술연구소 1995 센서技術學術大會論文集 Vol.6 No.1
This paper reports on an integrated communication and control circuit designed for multi-link active catheter. The communication and control functions are distributed over multiple links and common three lead wires are used. A link is selected and SMA (Shape Memory Alloy) actuator is driven by the integrated communication and control circuitry in the link. The circuitry is realized by 5 μm CMOS technology and the chip size is 1.8 mm wide by 3.0 mm long. Link addressing and actuator switching functions of the circuitry have been successfully demonstrated.
김형훈,윤성환,고정상,안철희,Shuji Tanaka,Masayoshi Esashi,고상춘,장원익 한국정밀공학회 2012 International Journal of Precision Engineering and Vol.13 No.9
This paper presents a new method to fabricate a multi-layered PZT microcantilever with a large upward initial deflection and the application for energy harvesting. The upward initial deflection is obtained by asymmetrically distributed residual stresses in the thin multilayer. The numerical analysis is carried out to simulate the upward deflection only based on the temperature history of process. In particular, the proposed method using the metal etching of the adhesion layer of tantalum and the plasma ashing of parylene-C is compared with that using the dry etching of polycrystalline silicon as a sacrificial layer to release the microcantilever from the substrate in fabrication simplicity and process time. An experimental evaluation confirmed that the proposed fabrication method is very simple and effective. The feasibility of the electricity generation is also measured on the PZT vibration test bed. A nano-watt electrical output is obtained, much higher than noise level. Also, a large output is obtained at a large length of the microcantilever with a large initial deflection.
Yo-Tak Song,Hai-Young Lee,Masayoshi Esashi 한국전자파학회JEES 2006 Journal of Electromagnetic Engineering and Science Vol.6 No.2
This paper presents the theory, design, fabrication and characterization of the novel low actuation voltage capacitive shunt RF-MEMS switch using a corrugated membrane with HRS MEMS packaging. Analytical analyses and experimental results have been carried out to derive algebraic expressions for the mechanical actuation mechanics of corrugated membrane for a low residual stress. It is shown that the residual stress of both types of corrugated and flat membranes can be modeled with the help of a mechanics theory. The residual stress in corrugated membranes is calculated using a geometrical model and is confirmed by finite element method(FEM) analysis and experimental results. The corrugated electrostatic actuated bridge is suspended over a concave structure of CPW, with sputtered nickel(Ni) as the structural material for the bridge and gold for CPW line, fabricated on high-resistivity silicon(HRS) substrate. The corrugated switch on concave structure requires lower actuation voltage than the flat switch on planar structure in various thickness bridges. The residual stress is very low by corrugating both ends of the bridge on concave structure. The residual stress of the bridge material and structure is critical to lower the actuation voltage. The Self-alignment HRS MEMS package of the RF-MEMS switch with a 15 Ωㆍ㎝ lightly-doped Si chip carrier also shows no parasitic leakage resonances and is verified as an effective packaging solution for the low cost and high performance coplanar MMICs.