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VoiceID: 딥러닝 기반 음성인식을 통한 모바일 보안 솔루션
현진(Jin Hyun),류동헌(Dongheon Ryu),정강민(Kangmin Jeong),이영주(Youngjoo Lee) 대한전자공학회 2021 대한전자공학회 학술대회 Vol.2021 No.6
In this paper, we introduce a mobile security solution named VoiceID, which utilizes lightweight deep neural networks (DNNs) for speech signal processing. The proposed VoiceID uses a new frame-level speaker embedding from the existing DNN model, which can be trained with the softmax cross entropy. The fine-tuning training is newly added with the triplet loss function, enhancing the quality of user-level identification. The word-level identification is also realized to provide the access right for each user, empowered by using the Cosine distance between bedded voice vectors. Evaluation results show that our VoiceID system successfully restricts 99.93% of unregistered users with simple yet efficient DNN-based processing steps, which can be used for the lightweight security solutions.
The Magnetism of Metal–Organic Frameworks for Spintronics
Lee Kangmin,Park Jumin,Song Intek,Yoon Seok Min 대한화학회 2021 Bulletin of the Korean Chemical Society Vol.42 No.9
Metal–organic frameworks (MOFs) consist of metal nodes and organic linkers by coordinative bonding, which have diverse and fascinating applications including gas storage/separation, catalysis, sensor, and so on. Recent achievements in enhancing MOFs’ electrical conductivity have lead MOFs to be also applied toward electronic and energy devices. MOF magnets have been also developed in conjunction with the improved electrical conductivity, and MOFs have been in the limelight as attractive materials for spintronics, which is an emerging field for next-generation nanoelectronics to reduce their power consumption and increase memory-processing capabilities. Thanks to the MOFs’ chemically tunable porous structures and rationally designable structures with strong p-d hybridization, MOFs can be a significant component in spintronic devices to support long-lifetime and long-range alignment of spin-polarized electrons. This account gives an overview of the magnetism of MOFs and the recent progress in developing MOFs-based spintronics, and the challenges and future perspectives of MOF-based spintronics are discussed.
Lee, Nohyun,Cho, Hye Rim,Oh, Myoung Hwan,Lee, Soo Hong,Kim, Kangmin,Kim, Byung Hyo,Shin, Kwangsoo,Ahn, Tae-Young,Choi, Jin Woo,Kim, Young-Woon,Choi, Seung Hong,Hyeon, Taeghwan American Chemical Society 2012 JOURNAL OF THE AMERICAN CHEMICAL SOCIETY - Vol.134 No.25
<P>Multimodal imaging is highly desirable for accurate diagnosis because it can provide complementary information from each imaging modality. In this study, a sol–gel reaction of tantalum(V) ethoxide in a microemulsion containing Fe<SUB>3</SUB>O<SUB>4</SUB> nanoparticles (NPs) was used to synthesize multifunctional Fe<SUB>3</SUB>O<SUB>4</SUB>/TaO<SUB><I>x</I></SUB> core/shell NPs, which were biocompatible and exhibited a prolonged circulation time. When the NPs were intravenously injected, the tumor-associated vessel was observed using computed tomography (CT), and magnetic resonance imaging (MRI) revealed the high and low vascular regions of the tumor.</P><P><B>Graphic Abstract</B> <IMG SRC='http://pubs.acs.org/appl/literatum/publisher/achs/journals/content/jacsat/2012/jacsat.2012.134.issue-25/ja3016582/production/images/medium/ja-2012-016582_0006.gif'></P><P><A href='http://pubs.acs.org/doi/suppl/10.1021/ja3016582'>ACS Electronic Supporting Info</A></P>
High-performance electrothermal and anticorrosive transparent heating stickers
Lee, Kangmin,Park, Jeonghwan,Kim, Hyungwoo,Park, Han-Saem,Song, Hyun-Kon,Kim, Ka-Hyun,Seo, Kwanyong The Royal Society of Chemistry 2018 Journal of Materials Chemistry A Vol.6 No.25
<P>In this study, the fabrication of a high-performance electrothermal and anticorrosive transparent heating sticker employing a novel Ni/Ag hybrid microgrid electrode is reported. The proposed sticker not only exhibits an excellent optoelectronic performance (a sheet resistance of 4.3 Ω sq<SUP>−1</SUP> at a transmittance of 96%) but also has a uniform heat distribution over its entire area owing to the electrical uniformity of the honeycomb-structured microgrid electrode. The transparent heating sticker reveals outstanding thermal and chemical stability with no electrode damage even in harsh environments such as high temperatures (300 °C) and atmospheres containing sulfur in excess, due to the anti-corrosion properties of nickel (Ni). The transparent heating sticker also exhibits a high saturation temperature of over 100 °C even at a low operating voltage (5 V) because highly thermally/electrically conductive silver (Ag) is employed as a base electrode material underneath Ni. Furthermore, a successful defogging test is demonstrated with an automobile side-view mirror using the transparent heating sticker, confirming its practical applicability. Accordingly, the proposed transparent heating sticker presents a unique opportunity for developing transparent heaters with superior chemical stability and a high electrothermal performance.</P>
Low-power network-on-chip for high-performance SoC design
Kangmin Lee,Se-Joong Lee,Hoi-Jun Yoo IEEE 2006 IEEE transactions on very large scale integration Vol.14 No.2
<P>An energy-efficient network-on-chip (NoC) is presented for possible application to high-performance system-on-chip (SoC) design. It incorporates heterogeneous intellectual properties (IPs) such as multiple RISCs and SRAMs, a reconfigurable logic array, an off-chip gateway, and a 1.6-GHz phase-locked loop (PLL). Its hierarchically-star-connected on-chip network provides the integrated IPs, which operate at different clock frequencies, with packet-switched serial-communication infrastructure. Various low-power techniques such as low-swing signaling, partially activated crossbar, serial link coding, and clock frequency scaling are devised, and applied to achieve the power-efficient on-chip communications. The 5 ×5 mm<SUP>2</SUP> chip containing all the above features is fabricated by 0.18-μm CMOS process and successfully measured and demonstrated on a system evaluation board where multimedia applications run. The fabricated chip can deliver 11.2-GB/s aggregated bandwidth at 1.6-GHz signaling frequency. The chip consumes 160 mW and the on-chip network dissipates less than 51 mW.</P>