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Silicon 기반 IC 디바이스에서의 층간 절연막 특성 분석 연구
권순형,표성규,Kwon, Soon Hyeong,Pyo, Sung Gyu 한국마이크로전자및패키징학회 2016 마이크로전자 및 패키징학회지 Vol.23 No.4
Along the few nano sizing dimensions of integrated circuit (IC) devices, acceptable interlayer material for design is inevitable. The interlayer which include dielectric, interconnect, barrier etc. needs to achieve not only electrical properties, but also mechanical properties for endure post manufacture process and prolonging life time. For developing intermetallic dielectric (IMD) the mechanical issues with post manufacturing processes were need to be solved. For analyzing specific structural problem and material properties Raman spectroscopy was performed for various researches in Si semiconductor based materials. As improve of the laser and charge-coupled device (CCD) technology the total effectiveness and reliability was enhanced. For thin film as IMD developed material could be analyzed by Raman spectroscopy, and diverse researches of developing method to analyze thin layer were comprehended. Also In-situ analysis of Raman spectroscopy is introduced for material forming research.
최은미,표성규,Choi, Eunmi,Pyo, Sung Gyu 한국마이크로전자및패키징학회 2016 마이크로전자 및 패키징학회지 Vol.23 No.4
The semiconductor industry has been developed mainly by micronization process due to many advantages of miniaturization of devices. Mass production of semiconductors of 10 nm class has been started recently, and it is expected that the technology generation of 5 nm & 7 nm technology will come. However, excessive linewidth reduction affects physical limits and device reliability. To solve these problems, new process technology development and new concept devices are being studied. In this review, we introduce the next generation technology and introduce the advanced research for the new concept device.
OLED공정에서 사용되는 섀도마스크의 습식 세정 후 세정표면 및 세정용액 분석에 관한 연구
최은화,표성규,Cui, Yinhua,Pyo, Sung Gyu 한국마이크로전자및패키징학회 2016 마이크로전자 및 패키징학회지 Vol.23 No.4
The post cleaning method for clean the shadow mask using in OLED (organic light emitting diode) emitter layer is always reforming. The cleaning solution and analysis method of shadow mask is still lack and not optimized. We use the simple and useful analytical method to determine the quantity and quality of organic and inorganic residue on surface of shadow mask. Finally analyze the cleaning solution using Raman spectroscopy efficiently.
삼차원집적공정에서 원자현미경을 활용한 Wafer Bonding Strength 측정 방법의 신뢰성에 관한 연구
최은미,표성규,Choi, Eunmi,Pyo, Sung Gyu 한국마이크로전자및패키징학회 2013 마이크로전자 및 패키징학회지 Vol.20 No.2
The wafer bonding process becomes a flexible approach to material and device integration. The bonding strength in 3-dimensional process is crucial factor in various interface bonding process such as silicon to silicon, silicon to metals such as oxides to adhesive intermediates. A measurement method of bonding strength was proposed by utilizing AFM applied CNT probe tip which indicated the relative simplicity in preparation of sample and to have merit capable to measure regardless type of films. Also, New Tool was utilized to measure of tip radius. The cleaned $SiO_2$-Si bonding strength of SPFM indicated 0.089 $J/m^2$, and the cleaning result by RCA 1($NH_4OH:H_2O:H_2O_2$) measured 0.044 $J/m^2$, indicated negligible tolerance which verified the possibility capable to measure accurate bonding strength. And it could be confirmed the effective bonding is possible through SPFM cleaning.
Hyunchul Kang(강현철),Kibum Hwang(황기범),Eunseon Shin(신은선),Jaekwang Kim(김재광),Sung Gyu Pyo(표성규),Songhun Yoon(윤성훈) 한국고분자학회 2021 폴리머 Vol.45 No.3
양이온계 계면활성제와 실리케이트 용액의 자기조립 반응을 이용하여 기공 형성의 주형으로 이용하고 여기에 레소시놀-포름알데하이드를 투여한 후 고분자화 반응을 통하여 계면활성제/실리케이트/고분자 나노 복합체를 제조하였다. 제조된 나노 복합체를 고온에서 탄화하고 이를 불산으로 에칭하여 메조다공성 나노막대형 탄소 재료를 성공적으로 제조하였다. 제조된 메조다공성 나노 막대 탄소 재료를 전기이중층 캐패시터 전극으로 적용하였으며, 다양한 전기화학 실험을 통하여 그 성능을 평가하였다. 이 결과 잘 발달된 메조 기공 내부의 원활한 이온 전달 특성 및 나노 막대에서의 최적화된 기공 길이로 인해, 기존의 활성탄 재료보다 매우 우수한 속도 특성(낮은 기공 저항) 및 높은 면적당 캐패시턴스(17.4 μF cm<SUP>-2</SUP>)를 갖는 전기이충층 캐패시터 전극 재료를 제조할 수 있었다. Using the self-assembly reaction between cationic surfactant and silicate solution, a direct templating method was investigated. After the addition of resorcinol and formaldehyde into the solution, the polymerization reaction was conducted and surfactant/silicate/polymer nanocomposite was prepared. After carbonization and following hydrofluoric acid etching, mesoporous carbon nanorod (MPCNR) particles were prepared. As-prepared material was applied into electrode in electric double-layer capacitors and various electrochemical analysis was carried out using the electrodes. Due to the well-developed mesoporosity and nanosized rod particles, a highly improved rate performance (low resistance in pores) and large double layer capacitance per area (17.4 μF cm<SUP>-2</SUP>) than the commercialized activated carbon electrode were observed, which was attributed to easy penetration through mesopores and optimized pore length for electrolyte transport.
고강도 7075 Al 합금의 가공 열처리와 미세조직의 상관관계연구
표성규,김재중,김낙준 대한금속재료학회(대한금속학회) 1999 대한금속·재료학회지 Vol.37 No.8
The main objective of the present investigation is to study the effect of the thermomechanical treatment on the structure-property relationships of 7075 plate. Particular emphasis has been placed on clarifying the origin of the anisotropy of mechanical properties. It shows that the application of thermomechanical treatment improves the microstructure and overall tensile properties of 7075 plate. Grain size becomes finer and the morphology of coarse intermetallic particles become favorable as the 7075 plate is thermomechanically processed. This improvement of microstructure directly influences the tensile properties of 7075 plate. While the thermomechanically treated (TMT) 7075 plate don't show any significant change in tensile properties with specimen orientation, there exists a large variation of tensile properties, in especially elongation, of heat treated (HT) 7075 plate with specimen orientation. HT 7075 plate in LT orientation has a much lower elongation than that in I. orientation. Detailed fractographic study reveals that poor ductility in LT oriented specimen is due to the large effective grain size and also due to the occurrence of cleavage fracture of coarse intermetallic particles along grain boundaries. In short, it has been found that the application of thermomechanical treatment improves the tensile properties of 7075 plate and it can be directly applied for the alloy processing for forged harts.
열간압연으로 제조된 Ti Aluminide 다층판재의 미세조직 : Ⅱ. 금속간화합물의 성장거동 Part Ⅱ: Growth Behavior of Intermetallic Phases
吳振根,表成奎,李聖鶴,金洛俊 대한금속재료학회 2002 대한금속·재료학회지 Vol.40 No.4
The present study is to investigate the growth behavior of intermetallic phases in multilayered Ti/TiAl_3 sheets fabricated by hot rolling. When these sheets were heat-treated at 1000℃, interfacial phases such as Ti_3Al, TiAl, and TiAl_2 were grown consuming Ti and TiAl_3. As the heat treatment proceeded, TiAl was grown consuming TiAl_2, thereby finally fabricating multilayered sheets composed of Ti_3Al and TiAl. Conventional lamellar structure composed of Ti_3Al and TiAl could also be fabricated by heat treatment of multilayered Ti/TiAl_3 sheets at 1400℃. The growth rate and activation energy of interfacial phases were obtained from their growth behavior. The results indicated that the growth of intermetallic phases was mainly controlled by volume diffusion than by grain boundary diffusion. The formation process of the multilayered sheets and the formation mechanism of interfacial phases were elucidated, and an idea to fabricate multilayered or bulk Ti aluminide sheets by hot rolling and heat treatment was eventually suggested in this study.
이성학,김낙준,표성규 대한금속재료학회(대한금속학회) 1991 대한금속·재료학회지 Vol.29 No.11
A study has been made of the superplastic behavior of a rapidly solidified AL-3Li-1Cu-0. 5Mg-0.5Zr(wt.%) alloy. Although rapidly solidified Al-Li alloys have the very fine grain structure desirable for the improved superplasticity, unfavorable oxide morphology often prevents them from being superplastic. The results of superplastic deformation indicate chat the proper thermomechanical treatment (TMT) of the alloy results in a much improved superplastic ductilities, e.g., elongat.ion of approximately 530%, in spite of the unfavorable oxide morphology. In the case of testing at. 520℃, optimum strain rate of forming is 4 × 10^(-2)/s, tvhich is one or two orders of magnitude higher than that of ingot cast Al-Li alloys. Such a high strain rate is thought to be quite advantageous for the practical application of superplastic deformation of the alloy. It can also he seen chat, the microstructure of the deformed specimens is similar to that in the as-received or the TMT conditions since continuous recrystallization is accomplished by subgrain growth and the growth of the primary grains is prevented by the fine β'(Al₃ Zr) particles.
조성 변화에 따른 2상 (α2+γ) TiAl 합금의 미세조직 및 기계적 성질의 변화
김낙준,장영원,표성규 대한금속재료학회(대한금속학회) 1994 대한금속·재료학회지 Vol.32 No.7
The purpose of this study is to investigate the effect of composition on the microstructure and mechanical properties of TiAl alloys. The composition ranges studied were Ti-xAl(x=43.7, 45.6, 47)-yMn(y=0.3). The mechanical properties have been characterized and correlated with microstructure, tetragonality, and deformation behavior. Two phase (α₂+γ) alloys have single γ grains and lamellar grains, which consist of twin-related L1。γ Phase and α₂phase. Addition of Mn promotes the formation of twin-related structure and the refinement of lameller structure and grain size. Increase in Ti/Al ratio promotes the refinement of grain size, but increases lamellar spacing. The modification of microstructure directly influences the compression properties and deformation mode of TiAl alloys. It has been found that Mn addition and increase of Ti/Al ratio enhance the plasticity of two phase (α₂+γ) alloys. The ductilization effect of Mn is partly due to its ability to promote the formation of deformation twins and dislocation generation at the twin intersections.