http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
Morphological Segmentation Under Complex Backgrounds Using Enhanced Gray-Scale Hit-or-Miss Transform
정택근,주효남,류근호,임영신 한국정밀공학회 2010 International Journal of Precision Engineering and Vol.11 No.5
In the process of packaging for integrated circuits or flexible PCBs, special characters are printed to indicate the status of quality control. During the automated inspection process, these characters are detected and indentified by the inspection equipment. The characters are sometimes difficult to be segmented from the images due to the complex backgrounds, which are complex circuit patterns and other graphic features. In this paper, we develop character segmentation algorithm based on grayscale hit-or-miss morphological transformation. The character's width is assumed to be known. Performance of the proposed algorithm is extensively tested, and the results show successful accuracy.
반도체소자의 고속마킹검사를 위한 vision system 개발
노영동,주효남,김주식 湖西大學校 工業技術硏究所 2005 工業技術硏究所論文集 Vol.24 No.-
In this paper, we propose the high speed making/surface inspection algorithm, that use adaptive automatic acquisition algorithm and real time matching algorithm of model data. The proposed automatic acquisition algorithm to obtain the adaptive model data extracts the interesting regions to fit in semiconductor characteristics, and create models of several semiconductor regardless of position and type. The proposed teal time matching algorithm uses geometrical pattern matching method to minimize effect of external environment of making/surface and only use semiconductor characteristic information. The proposed system has faster processing time than the conventional method. Also the proposed one has a good performance.
BGA(Ball Grid Array) 높이 데이타의 고속 측정
조태훈,주효남,Cho Tai-Hoon,Joo Hyo-Nam 한국반도체디스플레이기술학회 2006 반도체디스플레이기술학회지 Vol.5 No.1
Recently, Ball Grid Arrays(BGAs) are getting used more frequently for a package type. The connectors on a BGA consist of a large number of small solder balls in a grid shape on its bottom side. However, since balls of BGAs mounted on PCBs are not visible, inspection before mounting them is indispensable. High speed non-contact 3D measurement technologies are necessary far real-time measurement of ball height, the most important inspection item. In this paper, an accurate 3D data acquisition system for BGAs is proposed that can acquire 3D profile at high speed using a 3D smart camera and laser slit ray projection. Some clipping and morphological filtering operations are employed to remove spiky error data, which occur due to reflections from some ball area to camera direction.
김준식,주효남,전병준,이상신 한국반도체디스플레이기술학회 2004 반도체디스플레이기술학회지 Vol.3 No.1
In this paper, we have developed the DC parameters test system which inspects the properties of DC parameters for semiconductor products. The developed system is interfaced by IBM-PC. It is consisted of CPLD part, ADC(Analog-to-Digital Converter), DAC(Digital-to-Analog Converter), voltage/current source, variable resistor and measurement part. In the proposed system, we have designed the constant voltage source and the constant current source in a part. In the comparison of results, the results of the simulation are very similar to the ones of the implementation.
QFN 반도체 패키지의 외형 결함 검사를 위한 효과적인 결함 분류 시스템 개발
김효준,이정섭,주효남,김준식,Kim, Hyo-Jun,Lee, Jung-Seob,Joo, Hyo-Nam,Kim, Joon-Seek 한국융합신호처리학회 2009 융합신호처리학회 논문지 (JISPS) Vol.10 No.2
There are many different types of surface defects on semiconductor Integrated Chips (IC's) caused by various factors during manufacturing process, such as cracks, foreign materials, chip-outs, chips, and voids. These defects must be detected and classified by an inspection system for productivity improvement and effective process control. Among defects, in particular, foreign materials and chips are the most difficult ones to classify accurately. A vision system composed of a carefully designed optical system and a processing algorithm is proposed to detect and classify the defects on QFN(Quad Flat No-leads) packages. The processing algorithm uses features derived from the defect's position and brightness value in the Maximum Likelihood classifier and the optical system is designed to effectively extract the features used in the classifier. In experiments we confirm that this method gives more effective result in classifying foreign materials and chips. 반도체 외관결함에는 발생 요인이 각각 다른 crack, foreign material, chip-out, chip, void 등이 있으며, 검사 시스템에서는 결함 유무 및 결함 분류를 수행하여 효과적인 공정관리가 가능하여야 한다. 본 논문에서는 QFN 패키지 결함의 분류를 위한 알고리즘 및 광학시스템을 제안한다. 제안한 방법에서 분류가 어려운 결함 중 하나인 foreign material 과 chip의 효과적인 분류를 위해 제안한 결함의 위치, 밝기의 특징정보(feature)를 사용한 ML(Maximum Likelihood ratio) 분류방법 및 특징정보 획득에 효과적인 광학계를 제안하였다. 실험 결과에서 분류가 어려운 foreign material과 chip에 대한 신뢰성 높은 분류성능을 보였다.
BGA 소자의 결함검출을 위한 2차원 비젼 검사알고리즘에 관한 연구
김준식,김기순,주효남,Kim, Joon-Seek,Kim, Kee-Soon,Joo, Hyo-Nam 한국조명전기설비학회 2005 조명·전기설비학회논문지 Vol.19 No.7
본 논문에서는 비젼 시스템을 사용하여 마이크로 BGA 소자의 2차원 결함을 검사하는 알고리즘을 제안하였다. 제안한 방법은 정밀도를 높이기 위해 부화소 알고리즘을 사용하였으며, 입력된 영상에서 패키지 영역을 추출하고, 추출된 영역에서 볼 탐색창 방법을 사용하여 볼 영역을 추출한다. 이렇게 추출된 볼 영역에 대해 결함검사에 필요한 파라미터들을 추출하고, 이들을 사용하여 소자의 불량 유무를 판정한다. 모의실험을 통해 볼 검사 정밀도의 평균 오차가 17[${\mu}m$]가 됨을 확인하였다. In this paper, we proposed the 2-dimensional inspection algorithm for micro-BGA(Ball Grid Array) device using a vision system. The reposed method uses the subpixel algorithm for high precision. The proposed algorithm preferentially extracts the package area of device in the input image. After the extraction of package area, each ball areas are extracted by ball search window method. The parameters for inspection are calculated for the extracted ball area. In the simulation results, we have the average error within 17[${\mu}m$].
Low Contrast 특성을 갖는 LCD 편광필름 결함의 크기 자동 검출
박덕천(Duckchun Park),주효남(Hyonam Joo),류근호(Keun-Ho Rew) 제어로봇시스템학회 2008 제어·로봇·시스템학회 논문지 Vol.14 No.5
In this paper, segmenting and classifying low contrast defects on flat panel display is one of the key problems for automatic inspection system in practice. Problems become more complicated when the quality of acquired image is degraded by the illumination irregularity. Many algorithms are developed and implemented successfully for the defects segmentation. However, vision algorithms are inherently prone to be dependent on parameters to be set manually. In this paper, one morphological segmentation algorithm is chosen and a technique using frequency domain analysis of input images is developed for automatically selection the morphological parameter. An extensive statistical performance analysis is performed to compare the developed algorithms.
Mura 검출을 위한 Model Fitting 및 Least Square Estimator의 비교
오창환(Chang-Hwan Oh),주효남(Hyo-nam Joo),류근호(Keun-Ho Rew) 제어로봇시스템학회 2008 제어·로봇·시스템학회 논문지 Vol.14 No.5
Detecting and correcting defects on LCD glasses early in the manufacturing process becomes important for panel makers to reduce the manufacturing costs and to improve productivity. Many attempts have been made and were successfully applied to detect and identify simple defects such as scratches, dents, and foreign objects on glasses. However, it is still difficult to robustly detect low-contrast defect region, called Mura or blemish area on glasses. Typically, these defect areas are roughly defined as relatively large, several millimeters of diameter, and relatively dark and/or bright region of low Signal-to-Noise Ratio (SNR) against background of low-frequency signal. The aim of this article is to present a robust algorithm to segment these blemish defects. Early 90"s, a highly robust estimator, known as the Model-Fitting (MF) estimator was developed by X. Zhuang et. al. and have been successfully used in many computer vision application. Compared to the conventional Least-Square (LS) estimator the MF estimator can successfully estimate model parameters from a dataset of contaminated Gaussian mixture. Such a noise model is defined as a regular white Gaussian noise model with probability $1-\varepsilon$ plus an outlier process with probability $varepsilon$. In the sense of robust estimation, the blemish defect in images can be considered as being a group of outliers in the process of estimating image background model parameters. The algorithm developed in this paper uses a modified MF estimator to robustly estimate the background model and as a by-product to segment the blemish defects, the outliers.
반도체 패키지의 마크문자 회전량 측정을 위한 고속 라돈 변환에 관한 연구
신균섭 ( Gyunseob Shin ),주효남 ( Hyonam Joo ),김상민 ( Sangmin Kim ),이정섭 ( Jung-seob Lee ) 한국정보처리학회 2010 한국정보처리학회 학술대회논문집 Vol.17 No.1
반도체 패키지 제조공정 중에는 제품에 일련번호를 인쇄하는 마킹공정이 있다. 마킹 공정에서 새겨진 문자는 해당 관리기준에 따라 관리되고 있는데 최근 반도체 패키지의 소형화에 따라 인쇄된 마크문자의 틀어짐 정도가 관리기준에 미달되는 문제가 발생되고 있다. 본 논문에서는 마크문자의 검사 항목 중 tilted mark(angle mark) 검사를 위한 회전량 측정방법으로 golden section searching 방법을 적용한 고속 라돈 변환(radon transform)방법을 제안한다. 실험에서는 제안한 방법이 일반적인 라돈 변환에 비해 최대 약 21 배의 회전량 측정속도가 향상되는 것을 확인하였다.