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장현만,오상수,조전욱,조영식,하홍수,하동우,성기철,권영길,류강식,김상현,Jang, Hyeon-Man,O, Sang-Su,Jo, Jeon-Uk,Jo, Yeong-Sik,Ha, Hong-Su,Ha, Dong-U,Seong, Gi-Cheol,Gwon, Yeong-Gil,Ryu, Gang-Sik,Kim, Sang-Hyeon 한국초전도저온공학회 2000 한국초전도저온공학회논문지 Vol.2 No.2
1.5 kA class HTS current leads for a SMES magnet, which are connected to a conventional vapor cooled copper leads, were designed. The HTS leads are composed of Bi-2223/Ag-Au tapes and a stainless stell tube. The estimated critical current of the lead is about 1.6 kA at 77.3 K and in a self magnetic field, and the heat input to the liquid helium from the cold end of the 35 cm lead is 0.4 W/lead. It has been made clear that the heat input decreases with increase of the lead length and decrease of the warm end temperature and Ag-Au/SC ratio.
장현만,류수림,선우명훈,Chang, Hyun-Man,Ryu, Su-Rim,Sunwoo, Myung-Hoon 대한전자공학회 1999 電子工學會論文誌, C Vol.c36 No.6
본 논문에서는 무선 LAN 표준안 IEEE 802.11의 직접대역확산(Direct Sequence Spread Spectrum) 물리계층을 지원하는 기저대역 모뎀 ASIC 칩의 아키텍쳐와 설계에 대해 기술한다. 구현된 모뎀 칩은 크게 송신부와 수신부로 구성되어 있으며, CRC 부호화/복호화기, 차동 부호화/복호화기, 주파수 옵셋 보상기(frequency offset compensator) 및 타이밍 복구 회로를 포함한다. 구현된 모뎀 칩은 4, 2 및 1Mbps의 다양한 데이타 전송률을 지원하고, DBPSK와 DQPSK의 변조방식을 사용한다. 구현한 모뎀 아키텍쳐는 $SAMSUNG^{TM}$ $0.6{\mu}m$ 게이트 어레이 라이브러리(gate array library)를 사용하여 논리합성을 수행하였으며, 칩의 전체 게이트 수는 53,355개이다. 칩의 동작 주파수는 44MHz이며, 칩의 패키지는 100-pin QFP이고, 전력소모는 44MHz에서 1.2watt이다. 구현된 모뎀 아키텍쳐는 상용화된 HSP3824 칩 보다 우수한 BER성능을 나타낸다. This paper presents the architecture and design of a DSSS MODEM ASIC chip for wireless local area networks (WLAN). The implemented MODEM chip supports the DSSS physical layer specifications of the IEEE 802.11. The chip consits of a transmitter and a receiver which contain a CRC encoder/decoder, a differential encoder/decoder, a frequency offset compensator and a timing recovery circuit. The chip supports various data rates, i.e., 4,2 and 1Mbps and provides both DBPSK and DQPSK for data modulation. We have performed logic synthesis using the $SAMSUNG^{TM}$ $0.6{\mu}m$ gate array library and the implemented chip consists of 53,355 gates. The MODEM chip operates at 44MHz, the package type is 100-pin QFP and the power consumption is 1.2watt at 44MHz. The implemented MODEM architecture shows lower BER compared with the Harris HSP3824.
장현만,선우명훈 대한전자공학회 1998 電子工學會論文誌, C Vol.c35 No.2
This paper describes architectures and design of a SIMD type parallel image processing chip called SliM-II. The chiphas a linear array of 64 processing elements (PEs), operates at 30 MHz in the worst case simulation and gives at least 1.92 GIPS. In contrast to existing array processors, such as IMAP, MGAP-2, VIP, etc., each PE has a multiplier that is quite effective for convolution, template matching, etc. The instruction set can execute an ALU operation, data I/O, and inter-PE communication simulataneously in a single instruction cycle. In addition, during the ALU/multiplier operation, SliM-II provides parallel move between the register file and on-chip memory as in DSP chips, SliM-II can greatly reduce the inter-PE communication overhead, due to the idea a sliding, which is a technique of overlapping inter-PE communication with computation. Moreover, the bandwidth of data I/O and inter-PE communication increases due to bit-parallel data paths. We used the COMPASS$^{TM}$ 3.3 V 0.6.$\mu$m standrd cell library (v8r4.10). The total number of transistors is about 1.5 muillions, the core size is 13.2 * 13.0 mm$^{2}$ and the package type is 208 pin PQ2 (Power Quad 2). The performance evaluation shows that, compared to a existing array processors, a proposed architeture gives a significant improvement for algorithms requiring multiplications.s.