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Seed 금속의 종류와 두께에 따른 구리 전착층의 표면형상에 미치는 영향
우태규,박일송,설경원,Woo, Tae-Gyu,Park, Il-Song,Seol, Kyeong-Won 한국재료학회 2007 한국재료학회지 Vol.17 No.5
This study aimed to investigate the effects of the seed layer with copper electroplating on the surface morphology of copper foil. Three kinds of seed metal such as platinum, palladium, Pt-Pd alloy were used in this study. Electrodeposition was carried out with the constant current density of 200 $mA/cm^2$ for 68 seconds. Electrochemical experiments, in conjunction with SEM, XRD, AFM and four-point probe, were performed to characterize the morphology and mechanical characteristics of copper foil. Large particles were observed on the surface of the copper deposition layer when a copper foil was electroplated on the 130 nm thickness of Pd, Pt-Pd seed layer. However, a homogeneous surface, low resistivity was obtained when the 260 nm thickness of Pt, Pt-Pd alloy seed layer was used. The minimum value of resistivity was 2.216 ${\mu}{\Omega}-cm$ at the 260 nm thickness of Pt-Pd seed layer.
우태규,박일송,정광희,설경원,Woo, Tae-Gyu,Park, Il-Song,Jung, Kwang-Hee,Seol, Kyeong-Won 한국재료학회 2010 한국재료학회지 Vol.20 No.10
This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/$cm^2$. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/$cm^2$. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/$cm^2$ considering the productivity and mechanical properties of copper foil.
티타늄 기지을 이용한 구리 전해도금 시 Arabic Gum 첨가제의 영향
우태규,박일송,이현우,설경원,Woo, Tae-Gyu,Park, Il-Song,Lee, Hyun-Woo,Seol, Kyeong-Won 한국재료학회 2006 한국재료학회지 Vol.16 No.12
The purpose of this study is to identify the effect of additives during copper electrodeposition. Additives such as arabic gum, chloride ions and glue were used in this study. Electrochemical experiments allied to SEM and roughness examination were performed to characterize of the copper foil in the presence of additives. In the production of electrodeposited copper foil, the surface roughness and grain size of the copper foil can be controlled by addition additives. on this study, the more uniform and hemispherical copper crystals are during the initial stages, the smaller crystal size and surface roughness of copper foil are. The surface roughness of copper foil electrodeposited at the current density of 500 $mA/cm^2$ under galvanostatic mode for 60 seconds has a minimum value of 0.136 ${\mu}$m when adding 2 ppm of arabic gum.
고전류밀도 구리도금공정에서 알시안블루(Alcian Blue) 농도와 기계적 특성과의 상관관계
우태규,Woo, Tae-Gyu 한국재료학회 2020 한국재료학회지 Vol.30 No.4
The current density in copper electroplating is directly related with the productivity; then, to increase the productivity, an increase in current density is required. This study is based on an analysis of changes in surface characteristics and mechanical properties by applying the addition of Alcian Blue (AB, C<sub>56</sub>H<sub>68</sub>Cl<sub>4</sub>CuN<sub>16</sub>S<sub>4</sub>). The amount of Alcian Blue in the electrolytes is changed from 0 to 100 ppm. When Alcian Blue is added at 20 ppm, a seed layer is formed homogeneously on the surface at the initial stage of nucleation. However, crystals electroplated in electrolytes with more than 40 ppm of Alcian Blue are observed to have growth in the vertical direction on the surface and the shapes are like pyramids. This tendency of initial nucleation formation causes protrusions when the thickness of copper foil is 12 ㎛. Thereafter, a lot of extrusions are observed on the group of 100 ppm Alcian Blue. Tensile strength of groups with added Alcian Blue increased by more than 140% compare to no-addition group, but elongation is reduced. These results are due to the decrease of crystal size and changes of prior crystal growth plane from (111) and (200) to (220) due to Alcian Blue.
구리 전해도금 시 표면형상과 기계적 특성에 미치는 HEC효과
우태규,박일송,이현우,설경원,Woo, Tae-Gyu,Park, Il-Song,Lee, Hyun-Woo,Seol, Kyeong-Won 한국재료학회 2006 한국재료학회지 Vol.16 No.11
The purpose of this study is to identify the effect of additives and composition on copper surface morphology and mechanical characteristics by copper electrodeposition. Additives such as hydroxy ethyl cellulose(HEC), chloride ion were used in this study. Electrochemical experiments allied to SEM, XRD, AFM and four- point probe were performed to characterize the morphology and mechanical characters of copper in the presence of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 200 mA/$cm^2$ for 68 seconds with 2 ppm of HEC. The minimum value of surface roughness(Rms) was 107.6 nm. It is copper foil is good for electromigration inhibition due to preferential crystal growth of Cu (111) deposited in the electrolyte containing chloride ions(10 ppm) and HEC(1 ppm).
우태규 ( Tae Gyu Woo ),박일송 ( Il Song Park ),박은광 ( Eun Kwang Park ),정광희 ( Kwang Hee Jung ),이현우 ( Hyun Woo Lee ),설경원 ( Kyeong Won Seol ) 대한금속·재료학회 2009 대한금속·재료학회지 Vol.47 No.9
The effects of additives on the surface morphology and physical properties of copper electrodeposited on polyimide(PI) film were investigated here. Two kinds of additives, an activator(additive A) and a leveler(additive B), were used in this study. Electrochemical experiments, in conjunction with scanning electron microscopy(SEM), X-ray diffraction(XRD) and a four-point probe, were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the presence of the additives. The surface roughness, crystal growth orientation and resistivity could be controlled using various quantities of additive B. High resistivity and lower peel strength were observed on the surface of the copper layer electroplated onto the electrolyte with no additive B. However, a uniform surface, lower resistivity and high flexibility were obtained with a combination of 20 ppm of additive A and 100 ppm of additive B.
전해 동박의 표면 형상 및 기계적 물성에 미치는 SPS 첨가제 영향
우태규 ( Tae-gyu Woo ) 대한금속재료학회(구 대한금속학회) 2016 대한금속·재료학회지 Vol.54 No.9
In this study the effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) on the elongation, surface morphology and crystal structure of electrolytic copper foil were investigated. Additives HEC (hydroxyethyl cellulose) (A), SPS(B), Coll-A(C) were used in the study, and the additive used as D was a Cl- ion. The study results show that there are large differences in surface roughness and elongation depending on the amount of SPS added, from 0 ppm ~ 40 ppm. In this study, it was verified that the SPS additive plays the role of an accelerating agent, and makes it possible to control grain sizes. Also, the elongation rate increased, with increasing amounts of SPS. In addition, it was determined that SPS improves both the grain size and elongation rate due to its effect on the crystal structure. The addition of 40 ppm SPS resulted in a low surface roughness of less than 1 μm, and the sample showed both low tensile strength and large grain size. Here, the elongation was 9.0%, (Received October 13, 2015; Accepted March 29, 2016)
우태규 ( Tae Gyu Woo ),박일송 ( Il Song Park ),이만형 ( Man Hyung Lee ),설경원 ( Kyeong Won Seol ) 대한금속재료학회(구 대한금속학회) 2014 대한금속·재료학회지 Vol.52 No.6
The effect of additives, current density and plated temperature on the surface morphology and physical property, during copper electrodeposition on polyimide (PI) film was investigated. Two kinds of additives, Cl and leveler (additive B), were used in this study. Electrochemical experiments were performed in conjunction with SEM, XRD and four-point probe to characterize the morphology and mechanical characteristics of copper electrodeposited in the presence of the additives. The surface roughness, crystal growth orientation and resistivity was controlled by the concentration of additive B. High resistivity and lower peel strength were observed on the surface of the copper layer electroplated in the electrolyte without additive B. However, a uniform surface, lower resistivity and high flexibility were obtained with a combination of 20 ppm Cl and 100 ppm additive B. Large particles were observed on the surface of the copper layer electroplated using a current density of 25 mA/cm2, but a uniform surface and lower resistivity were obtained using a current density of 10 mA/cm2. One of the required important properties of FCCL is flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density, rather than a high current density. Moreover, a reasonable current density is 20 mA/cm2, considering the productivity and mechanical properties of copper foil. (Received June 28, 2013)