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폐 정보통신기기(스마트폰, 노트북 PC)의 자원화 가치 분석
박승수,정민욱,김성민,한성수,정인상,박지환,박재구,Park, Seungsoo,Jung, Minuk,Kim, Seongmin,Han, Seongsoo,Jung, Insang,Park, Jihwan,Park, Jaikoo 한국자원리싸이클링학회 2018 資源 리싸이클링 Vol.27 No.3
In this study, metal and nonmetal contents and their economic values in ICT devices such as smart phones and laptop computers were evaluated. The electronic devices made by LG and Samsung were disassembled into 5 parts, which are printed circuit board assembly, battery, display, case and other electronic components. Metal and nonmetal contents in these parts were analyzed, and their economic values were calculated via multiplying the materials' contents by metal price obtained from KOMIS or nonmetal exchange price acquired from Korean recycling markets. Finally, the materials' contents and values according to each electronic parts and electronic devices were calculated. The results showed that the value of the smartphones and laptop computers of LG are 4,449.6 KRW (28,506 KRW/kg) and 6,830.2 KRW (7,053 KRW/kg), and those of Samsung are 1,849.3 KRW (13,499 KRW/kg) and 6,667.5 KRW (4,831 KRW/kg), respectively. It was also found that most of the value was concentrated in batteries and printed circuit board assemblies. In addition, Co, Au and Cu were found to be the most valuable resources in the devices.
리튬이온전지의 전해액 자체 난연성 평가시 측정변수 및 실제 전지 환경 모사에 따른 영향
박승수(Seungsoo Park),김건영(Gunyoung Kim),이홍경(Hongkyung Lee) 한국전지학회 2023 한국전지학회지 Vol.3 No.2
This study emphasizes the importance of realistically simulating the actual cell environment, which can be overlooked in fire resistance evaluations, and underscores the lack of standardization in measurement variables. We investigated variables that should be considered to minimize deviations during measurements. Additionally, we simulated the cell environment to observe changes under higher O₂/Ar ratios and conducted research on Solid-Electrolyte Interphase (SEI) components contributing to fire resistance. Furthermore, we explored the effects of graphite anode degradation on measurement variations and provided insights into various considerations essential for fire resistance assessments.
권석제,박승수,김성민,조아람,송유진,박풍원,박재구,Kwon, Seokje,Park, Seungsoo,Kim, Seongmin,Joe, Aram,Song, Youjin,Park, Poongwon,Park, Jaikoo 한국자원리싸이클링학회 2016 資源 리싸이클링 Vol.25 No.1
노트북 실장인쇄회로기판(Printed Circuit Board Assembly, PCBA)으로부터 탄탈럼을 회수하기 위한 선별실험을 실시하였다. 우선 노트북 실장인쇄회로기판에 실장된 전자부품(Electronic Components, ECs)을 자체개발한 실험장치를 이용하여 기판으로부터 분리하였다. 분리된 전자부품을 체분리하여 -6.35+2.80 mm구간에서 전체 탄탈럼 캐퍼시터의 약 93.2 wt.%를 회수할 수 있었다. 회수된 탄탈럼 캐퍼시터를 해머밀로 분쇄 후, 자력선별기를 통해 자력세기 300 가우스에서 분쇄물 중의 전극을 제거하였다. 전극이 제거된 자력선별 산물을 대상으로 넬슨 선별기(Knelson concentrator)를 이용한 선별 실험 결과 Bowl의 회전수 200 rpm, 유동층수 유량 7 L/min에서 76.9%의 최대 선별효율을 보였으며, 이때 품위 및 회수율은 각각 약 81.1%, 약 78.8%를 나타내었다. The study to obtain tantalum concentration from electronic components (ECs) on Printed circuit board assembly (PCBA) of laptop was conducted. Electronic components on laptop PCBA were detached from boards by using self-developed experimental apparatus. The detached electronic components were sieved and 93.2 wt.% of tantalum capacitors were concentrated from the size interval from 2.80 mm to 6.35 mm. The tantalum capacitors were pulverized by hammer mill and electrodes (anode and cathode) were removed from the grinding products by using magnetic separators under the magnetic force of 300 Gauss. Finally, tantalum concentrate was concentrated from the magnetic separator products by using Knelson concentrator, and the maximum efficiency of 76.9% was achieved under the operating condition of bowl rotating speed of 200 rpm, and fluidizing water flowrate of 7 L/min. The grade and recovery of Ta concentrate under the condition were 81.1% and 78.8%, respectively.
코로나 방전 정전선별기 내 PCB 입자의 이동궤도 시뮬레이션
한성수,박승수,김성민,박재구,Han, Seongsoo,Park, Seungsoo,Kim, Seongmin,Park, Jaikoo 한국자원리싸이클링학회 2014 資源 리싸이클링 Vol.23 No.6
코로나 방전 정전선별기 내에서 인쇄회로기판(Printed Circuit Board, PCB) 분쇄 입자의 이동궤도를 전산 모사하였다. 여기서 PCB입자는 전자부품 분리된 기판을 파쇄한 것으로, 대부분 구리와 FR-4(Flame Retardant Level-4)로 이루어져있다. 우선 입자가 선별기내 회전전극으로부터 탈착 지점을 계산하였으며, 중력, 원심력, 정전기력의 평형으로부터 유도되었다. 한편 탈착 후 이동궤도는 입자의 운동방정식으로부터 구한 가속도를 시간 적분하여 계산하였다. 시뮬레이션 변수는 입자의 크기, 공급전압의 세기, 회전전극속도 및 유도전극 각도로 하였다. 입자 이동궤도에 미치는 영향은 구리 입자의 경우에는 회전속도가 주요 변수였으나, 반면 FR-4 입자의 경우에는 상기 모든 변수에 영향을 받는 것으로 나타났다. The trajectories of PCB(Printed Circuit Board) particles in the corona discharge electrostatic separation was simulated. The PCB particles are prepared by crushing bare board, which disassembled from electronic components, consist mostly of copper and FR-4(Flame Retardant Level-4) Firstly, a model was established for calculating of detachment points of PCB particles from the rotating electrode in separator. The model of detachment points was derived from equilibrium of force such as gravity force, centrifugal force, electrostatic force. The trajectories of particles after detachment was calculated by acceleration derived from time-integrating method of motion equation. In this simulation, particle size, supplied voltage, rotation speed of rotating roll electrode and angle of induction electrode were adopted as variables. While the trajectories of FR-4 particles were affected by all variables, rotation speed of rotating roll electrode was dominant variables affecting trajectories of copper particles.
조아람,박승수,김보람,박재구,Joe, Aram,Park, Seungsoo,Kim, Boram,Park, Jaikoo 한국자원리싸이클링학회 2016 資源 리싸이클링 Vol.25 No.6
본 연구에서는 F-PGA 타입의 CPU 칩과 W-BGA 타입의 CPU 칩을 대상으로 금(Au)의 함량 및 분포 상태를 확인하였다. 그 결과 F-PGA 칩의 경우, 금의 80.8%가 칩 터미널(terminal)부분에, W-BGA 칩의 경우에는 베어다이(bare die)에 금이 89.8% 편재되어 있는 것을 확인하였다. 이와 같이 대부분의 금이 칩의 특정 부분에 존재하는 사실로부터 CPU 칩의 해체장치를 고안하게 되었다. CPU 칩 해체실험의 조작변수는 롤러 회전속도, IR 히터의 가열 온도, 가열 시간으로 하였다. F-PGA 칩의 경우에는 가열 온도 $300^{\circ}C$, 가열 시간 90초 조건, 그리고 W-BGA 칩의 경우에는 롤러속도 90 rpm, 가열온도 $300^{\circ}C$, 가열 시간 180초 조건에서 칩 터미널과 베어다이를 각각 완전하게 분리/회수할 수 있었다. In this study, Au distribution in F-PGA chip and W-BGA chip were examined to recover Au effectively from CPU chips. The result showed that 80.8% and 89.8% of Au exist in terminal of F-PGA chip and bare die of W-BGA chip, respectively. Based on the fact that Au exists in specific parts of the chips, an CPU chip dismantling apparatus was developed. The experimental variables were roller rotating speed, heat temperature of IR heater and heating time. Terminals of F-PGA chips were completely recovered under the temperature of $300^{\circ}C$ and the residence time of 90 s. Bare dies of W-BGA chips were completely recovered as well under the temperature of $300^{\circ}C$, the roller rotating rate of 90 rpm and the residence time of 90 s.
김보람,박승수,김병우,박재구,Kim, Boram,Park, Seungsoo,Kim, Byeongwoo,Park, Jaikoo 한국자원리싸이클링학회 2018 資源 리싸이클링 Vol.27 No.1
Physical property changes of printed circuit board (PCB) according to heat treatment conditions were investigated. The heat treatment was carried out in air and nitrogen atmosphere at temperature range from $200^{\circ}C$ to $325^{\circ}C$. Thermogravimetric analysis showed that the PCB was pyrolyzed in two steps. The thickness of PCB expanded by 11~28% at about $300^{\circ}C$ in both air and nitrogen atmosphere as layer disintegration occurred. Mechanical strength of PCB decreased from 338.4 MPa to 20.3~40.2 MPa due to the delamination caused by the heat treatment. The heated printed circuit boards were crushed and sieved for analysis of density distribution and liberation degree of copper according to particle size. As a result of the density distribution measurement, non metallic particles and copper particles were concentrated into different size range, respectively. The liberation degree of copper was improved from 9.3% to 100% at size range of $1,400{\sim}2,000{\mu}m$ by heat treatment.