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김신일,김길수,이승진 한국약제학회 1994 Journal of Pharmaceutical Investigation Vol.24 No.4
The stability of red ginseng saponin in aqueous solution was studied with the acceleration test method. The degradation rate constant of ginsenoside Rb1, an index component of red ginseng saponin, was 2.371×10^(-4) day^(-1) at 20℃, and the shelf-life was about 570 days. The pH-rate profile demonstrated that the most stable range was pH 6-8. Mannitol and benzyl alcohol, common excipients for injection, exerted no influence on the degradation reaction of ginsenoside Rb1.
김신일 한국교육사회학회 2000 한국교육사회학회 학술대회 발표 자료 Vol.2000 No.-
한국교육사회학회 이번 연차 학술대회의 주제 “한국교육의 탈맥락적 현실과 포스트 모던적 재구성”은 많은 사람의 주목을 끌기에 충분하다. 우선 이 주제는 한국교육이 탈맥락이라고 지적한다. 탈맥락이라는 비판은 그동안 수없이 제기되었는데, 그 비판은 교육현실에 대하여 뿐만 아니라 교육학에 대하여도 마찬가지로 빈번히 제기되어 왔다. 교육정책과 교육학이 역사적, 사회적 맥락을 벗어났다는 것인데, 흥미롭게도 이러한 비판은 어느 일부 집단만 제기하는 것이 아니라 서로
Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding
김신일,유동열,김윤찬,손준혁,Dongjin Byun,Jung-Hwan Bang 대한용접접합학회 2023 대한용접·접합학회지 Vol.41 No.4
Conventional hot air reflow soldering is one of major bonding technology when bonding is proceeded on automotive electronics applications. However, here we focus on modifying the bonding process and composition of solder to enhance mechanical and thermal properties. This study experimentally investigated the mechanism of how laser- assisted bonding (LAB) form a small size of initial intermetallic compounds (IMC), and 0.2 wt% Cr element was added to Sn-0.7Cu eutectic solder to suppress the IMC growth. As a result, Sn-0.7Cu and Sn-0.7Cu-0.2Cr initial grain refinement was achieved by LAB. Isothermal aging was conducted to observe the mechanical and thermal properties depending on the IMC growth under 100, 125, 150 ℃ respectively. Sn-0.7Cu-0.2Cr tended to inhibit the growth of IMC at solder matrix and interface compared to Sn-0.7Cu throughout all aging temperature and time. The shear test was proceeded and Sn-0.7Cu-0.2Cr shear force was achieved 18% higher than Sn-0.7Cu. Even after isothermal aging, Sn-0.7Cu-0.2Cr showed lower reduction rate of shear force compared to Sn-0.7Cu.