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두께 균일도 향상을 위한 LPCVD 챔버 내 웨이퍼 온도 분포 분석
강승환(Seung-Hwan Kang),김병훈(Byeong Hoon Kim),공병환(Byung Hwan Kong),이재원(Jae Won Lee),고한서(Han Seo Ko) 한국가시화정보학회 2016 한국가시화정보학회지 Vol.14 No.2
The wafer temperature and its uniformity inside the LPCVD chamber were analyzed. The temperature uniformity at the end of the wafer load depends on the heat-insulating cap. The finite difference method was used to investigate the radiation and conduction heat transfer mechanisms, and the temperature field and heat diffusion in the LPCVD chamber was visualized. It was found that the temperature uniformity of the wafers could be controlled by the size and distance of the heat-insulating cap.
웨이퍼 배치 구조를 갖는 CVD 챔버 내부의 유동 분석
강승환(Seung-Hwan Kang),이재원(Jae Won Lee),고한서(Han Seo Ko) 대한기계학회 2018 大韓機械學會論文集B Vol.42 No.1
반도체 생산 설비인 CVD 챔버 내부 웨이퍼 사이의 유동을 분석하였다. 검사체적은 튜브 안쪽 공간으로 가정하였고, 수치해석 방법을 통해 2차원 및 3차원의 내부 유동을 계산하였다. 반도체를 만드는 과정에서 웨이퍼 위에 박막의 증착률 및 균일도를 증가시키기 위해 웨이퍼 내부로의 원활한 유동이 필수적이므로, 그 방법으로 편심 웨이퍼 배치 및 기울어진 웨이퍼 배치 구조를 제안하였다. 웨이퍼 배치를 편심시켜 통로 폭의 차이를 만들거나, 웨이퍼를 기울여 웨이퍼 내부의 압력 차이를 형성시켰을 때 일정한 방향으로의 내부 유동을 발생시킬 수 있음을 밝혔다. Gas flow between wafers inside a tube of a chemical vapor deposition chamber, which is a semiconductor fabrication equipment, was analyzed. A control volume was assumed to be limited in the tube, and the two- and threedimensional internal flows were calculated numerically. To increase the deposition rate and uniformity on the wafer in the process of fabrication of the semiconductor, the active gas flow should be indispensable between the wafers; thus, it is proposed to manufacture both eccentric wafer batch and inclined wafer batch structures. This research shows that the internal gas flow was uniform and unidirectional and its velocity increased when the wafer batch was eccentric for the difference in passage width, and the wafer batch was inclined for the pressure difference within the wafer spacing.