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배기 가스 정화용 금속 담체의 브레이징시 제조 변수의 영향
朴大鎭,金容奭 弘益大學校 科學技術硏究所 2000 科學技術硏究論文集 Vol.11 No.-
The effects of brazing temperature and time, and the thickness of filler metal on the joint microstructure of metallic catalytic convertor were investigated. Especially, the formation of brittle eutectic structure was examined. In general, it was found that processing conditions which promote the diffusion of Si in the filler metal reduce the formation of the eutectic structure. The condition includes the higher bonding temperature, longer brazing time, thinner filler metal. The higher bonding temperature and longer brazing time, however, led to extensive dissolution and degradation of the catalytic material. Thus, it was found that the brazing conditions using thinner filler metal at moderate brazing temperature and time are most effective in preventing the formation of the brittle eutectic structure in the brazed joint of the catalytic convertor.
무인항공기 개발비행시험을 위한 절차 및 항목에 대한 연구
박대진,양준모,김봉균,이상철,Park, Dea-Jin,Yang, Jun-Mo,Kim, Bong-Gyun,Lee, Sang-Chul 한국항공운항학회 2016 한국항공운항학회지 Vol.24 No.4
Unmanned aerial vehicles(UAVs) are increasingly used in civilian areas as well as in military areas due to the technological advancement of UAVs. In response to the increasing demand in UAVs, many studies are under way to integrate the airspace between manned aircraft and UAV. The development of flight test can secure the performance and flight characteristics of the designed aircraft. And the capability of research and development can be expanded through the accumulation of technical data. It is also essential to verify the correct performance and characteristics of development aircraft themselves. In this paper, we propose development flight test procedures and items for civilian UAVs.
핫스팟 접근영역 인식에 기반한 바이너리 코드 역전 기법을 사용한 저전력 IoT MCU 코드 메모리 인터페이스 구조 연구
박대진,Park, Daejin 대한임베디드공학회 2016 대한임베디드공학회논문지 Vol.11 No.2
Microcontrollers (MCUs) for endpoint smart sensor devices of internet-of-thing (IoT) are being implemented as system-on-chip (SoC) with on-chip instruction flash memory, in which user firmware is embedded. MCUs directly fetch binary code-based instructions through bit-line sense amplifier (S/A) integrated with on-chip flash memory. The S/A compares bit cell current with reference current to identify which data are programmed. The S/A in reading '0' (erased) cell data consumes a large sink current, which is greater than off-current for '1' (programmed) cell data. The main motivation of our approach is to reduce the number of accesses of erased cells by binary code level transformation. This paper proposes a built-in write/read path architecture using binary code inversion method based on hot-spot region detection of instruction code access to reduce sensing current in S/A. From the profiling result of instruction access patterns, hot-spot region of an original compiled binary code is conditionally inverted with the proposed bit-inversion techniques. The de-inversion hardware only consumes small logic current instead of analog sink current in S/A and it is integrated with the conventional S/A to restore original binary instructions. The proposed techniques are applied to the fully-custom designed MCU with ARM Cortex-M0$^{TM}$ using 0.18um Magnachip Flash-embedded CMOS process and the benefits in terms of power consumption reduction are evaluated for Dhrystone$^{TM}$ benchmark. The profiling environment of instruction code executions is implemented by extending commercial ARM KEIL$^{TM}$ MDK (MCU Development Kit) with our custom-designed access analyzer.