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      • KCI등재

        동축 구조의 인쇄회로기판을 사용한 테스트 소켓의 S-파라미터 추출

        김문정 한국소프트웨어감정평가학회 2022 한국소프트웨어감정평가학회 논문지 Vol.18 No.2

        To cope with various pitches and pin arrangements, S-parameter analysis of test sockets utilizes printed circuit boards. It is known that a de-embedding process is required to remove parasitic components of a printed circuit board. In general, a wiring design process of a printed circuit board applies a transmission line having a microstrip structure. However, in this paper, a printed circuit board is designed using a coaxial transmission line, and a test fixture is constructed by assembling the test socket and the printed circuit boards in the vertical direction. The vertical assembly method of the test socket and the printed circuit boards in this paper can shorten the signal transmission path and minimize the parasitic components of the fixture. In this paper, the diameters of the signal pad, the ground pad, and the via and printed circuit board thickness are designed. The S-parameters are calculated using 3-dimensional electromagnetic field simulation. It is expected that the coaxial structure design of the printed circuit board using the placement of the via structure and the fixture structure of the vertical assembly method can be utilized as an S-parameter extraction method for the test socket.

      • KCI등재

        RF 통신 시스템의 면적 축소를 위한 8층 시스템-인-보드 임베디드 인쇄회로기판

        정진우(Jinwoo Jeong),이재훈(Jae-Hoon Yi),전국진(Kukjin Chun) 大韓電子工學會 2011 電子工學會論文誌-SD (Semiconductor and devices) Vol.48 No.2

        삼중대역(2.3/2.5/3.5㎓) m-WiMAX 시스템의 제작을 위한 8층의 인쇄회로기판을 제작하였다. 고주파 동작시에도 우수한 성능을 확보하기 위하여 저유전율을 사용한 인쇄회로기판을 제작하였다. 또한 시스템 전체의 크기를 축소하기 위하여 수동소자를 삽입시킨 임베디드 인쇄회로기판을 제작하였다. 그 결과 시스템 면적의 9%를 줄일 수 있었다. 제작된 인쇄회로기판을 사용하여 삼중대역 m-WiMAX 시스템이 제작되었으며, 인터넷 연결 테스트를 성공적으로 수행하였다. 개발된 임베디드 인쇄회로기판은 시스템의 면적 축소와 저신호 손실 RF 통신 시스템에 효과적인 대응을 가능하게 할 것이다. 8-layer printed circuit board is designed and implemented for triple band(2.3/2.5/3.5㎓) m-WiMAX system. In order to maintain excellent RF performance, low dielectric constant material is used for implementation of the printed circuit board. Also, embedded printed circuit board which embed passive devices is manufactured to reduce total system area. As a result, total system area is cut off by 9%. Triple band m-WiMAX system is produced using embedded printed circuit board. Furthermore, internet connecting test is performed and proved successful running of the system. The developed embedded printed circuit board will provide a effective solution for system area reduction and low loss signal RF communication system.

      • KCI등재

        스마트 분전반 제작을 위한 작업 공정도 개발에 관한 연구

        이병설 ( Byung-seol Lee ),최충석 ( Chung-seog Choi ) 한국안전학회 2017 한국안전학회지 Vol.32 No.3

        This study presented the strength of the materials and parts for smart distribution board fabrication, and developed a work operation process chart for smart distribution board fabrication. This work operation process chart for smart distribution board fabrication complied with SPS-KEMC regulations, and the applicable range and object are less than 1,000 V and 1,000 Hz for the AC distribution board and less than 1,500 V for the DC distribution board. The power supply is 3 phase 4 wires (3Φ 4W), divided into a single phase circuit and a 3 phase circuit. In addition, the circuit was configured so that the leakage current flowing through the distribution line of the load could be monitored in real time by using the sensor module installed at the rear end of the circuit breaker. Therefore, the administrator can easily find the risk factor of the load since engineer can check the leakage current of each distribution line. In addition, if a leakage current greater than standard value flows, it is possible to generate an alarm against a short circuit and cut off the leakage current. The work operation process chart for the smart distribution board fabrication consists of the following steps: raw and subsidiary materials, sheet metal work, tube making, welding, painting, busbar fabrication, assembly and wiring, product inspection, shipment, etc. Moreover, symbols, △, ▽, O, ⇒, etc. were used according to the type of work and work progress so that workers can easily understand the progress of the work.

      • KCI등재

        열화상 이미지를 통한 회로보드의 상태예측 모델

        신건호,허장욱 한국기계가공학회 2023 한국기계가공학회지 Vol.22 No.4

        In the military, PHM technology is being studied to solve the frequent suspension of equipment operation andhigh costs incurred by frequent replacement of components. In the case of applying PHM to electronicequipment that is already in operation, a device capable of observing the state of the circuit board must beattached, and circuit damage occurs frequently in attachment process. In this study we made the deeplearning model for condition prognostic of circuit boards with data collected by FLIR camera that does notcontact or damage circuit boards. The ConvLSTM based deep learning model was exploited to predict futuretemperature profile of circuit board and the loss value of the trained model was 0.0893. But the model has ashort predictable interval. It is expected to be applied to the actual system and be able to predict RUL infuture work.

      • KCI등재

        논문 : 초보자의 전자회로 프로토타이핑을 위한 회로제작방식 제안

        유효라(주저자) ( Hyo Ra Yu ),박승호(교신저자) ( Seung Ho Park ) 디자인융복합학회 2015 디자인융복합연구 Vol.14 No.5

        최근 예술 설치물과 서비스디자인, 제품 디자인에서 사용자들과의 상호작용이 증가하며 이를 설계하는 디자이너와 예술가의 역할이 기술적 구현의 범위까지 확대되었다. 더불어 협업 플랫폼의 발달로 전자공작 및 제품의 D.I.Y운동이 확산되면서 전자회로 프로토타이핑에 대한 비전공자의 접근들이 증가하고 있다. 이에 따라 피지컬 컴퓨팅 등과 같이 초보자와 비전공자를 위한 교육과정들이 증가하고 있지만 이에 활용되는 도구들은 여전히 그한계를 지니고 있다. 따라서 본 연구에서는 초보자의 전자회로제작과정의 특징 선행연구들을 중심으로 일반적 회로제작 방식과 도구, 초보자를 위한 대안적 회로제작 방식과 도구를 비교 분석한다. 이를 통해 나타난 문제점들을 해결하기 위해 보조적 회로제작도구 및 방식을 제안하고 사례를 들어 적용하고자 하였다. 최종적으로 제안된 NUDDY BOARD는 투명성, 배선의 단순화, 분리의 3 가지 디자인으로 회로도 전체구성을 쉽게 파악하고, 배선을 간소화하며, 도면보관의 보관 및 복구가 용이함의 장점을 가진다. 따라서 이는 초보자가 기존도구를 활용할 때 갖는 어려움을 극복하고 더욱 쉽게 전자회로 프로토 타이핑에 접할 수 있도록 돕는다. In the era of installation art, service design and product design, the interaction with users is more important than ever. So the designers and artists have to know the technological implementation including electronic and computer engineering. Also due to the development of system helps a collaborative work, D.I.Y. movement is invigorated, which affects people who want to make a working prototype with electronic circuit by themselves. Therefore many kinds of education course have been increased, like physical computing, but still tools are not easy to use for the beginners. Therefore, the goal of this research is to propose a new type of a bread board kit named NUDDY BOARD which is easier for the beginners. To do that, I studied the process and features of making electronic circuit. And I compared prototyping tools for the general users and for the beginners based on previous research. There were several problems to solve. So I designed NUDDY BOARD which has transparent body, easy wiring system and separable physical structure. With this concepts, it is easy to understand and make a physical electronic circuit system and also easy to store or restore them. After all, it can be helpful for novices to make a working prototype by themselves.

      • KCI등재

        초보자의 전자회로 프로토타이핑을 위한 회로제작방식 제안

        유효라,박승호 디자인융복합학회(구.한국인포디자인학회) 2015 디자인융복합연구 Vol.14 No.5

        In the era of installation art, service design and product design, the interaction with users is more important than ever. So the designers and artists have to know the technological implementation including electronic and computer engineering. Also due to the development of system helps a collaborative work, D.I.Y. movement is invigorated, which affects people who want to make a working prototype with electronic circuit by themselves. Therefore many kinds of education course have been increased, like physical computing, but still tools are not easy to use for the beginners. Therefore, the goal of this research is to propose a new type of a bread board kit named NUDDY BOARD which is easier for the beginners. To do that, I studied the process and features of making electronic circuit. And I compared prototyping tools for the general users and for the beginners based on previous research. There were several problems to solve. So I designed NUDDY BOARD which has transparent body, easy wiring system and separable physical structure. With this concepts, it is easy to understand and make a physical electronic circuit system and also easy to store or restore them. After all, it can be helpful for novices to make a working prototype by themselves. 최근 예술 설치물과 서비스디자인, 제품 디자인에서 사용자들과의 상호작용이 증가하며 이를 설계하는 디자이너와 예술가의 역할이 기술적 구현의 범위까지 확대되었다. 더불어 협업 플랫폼의 발달로 전자공작 및 제품의 D.I.Y운동이 확산되면서 전자회로 프로토타이핑에 대한 비전공자의 접근들이 증가하고 있다. 이에 따라 피지컬 컴퓨팅 등과 같이 초보자와 비전공자를 위한 교육과정들이 증가하고 있지만 이에 활용되는 도구들은 여전히 그 한계를 지니고 있다. 따라서 본 연구에서는 초보자의 전자회로제작과정의 특징 선행연구들을 중심으로 일반적 회로제작 방식과 도구, 초보자를 위한 대안적 회로제작 방식과 도구를 비교 분석한다. 이를 통해 나타난 문제점들을 해결하기 위해 보조적 회로제작도구 및 방식을 제안하고 사례를 들어 적용하고자 하였다. 최종적으로 제안된 NUDDY BOARD는 투명성, 배선의 단순화, 분리의 3가지 디자인으로 회로도 전체구성을 쉽게 파악하고, 배선을 간소화하며, 도면보관의 보관 및 복구가 용이함의 장점을 가진다. 따라서 이는 초보자가 기존도구를 활용할 때 갖는 어려움을 극복하고 더욱 쉽게 전자회로 프로토타이핑에 접할 수 있도록 돕는다.

      • SCOPUS

        Development of Build-up Printed Circuit Board Manufacturing Process Using Rapid Prototyping Technology and Screen Printing Technology

        Im, Yong-Gwan,Cho, Byung-Hee,Chung, Sung-Il,Jeong, Hae-Do Korean Society for Precision Engineering 2003 International Journal of the Korean Society of Pre Vol.4 No.4

        Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

      • KCI등재

        Stretchable strain-tolerant soft printed circuit board: a systematic approach for the design rules of stretchable interconnects

        조현,이윤택,이병문,변정환,정승준,홍용택 한국정보디스플레이학회 2020 Journal of information display Vol.21 No.1

        Reported herein is a stretchable strain-tolerant soft printed circuit board (SPCB) following optimized circuit design rules. Inkjet-printed interconnects with a wrinkled structure and rigid epoxy patterns allow the outstanding stretchability and strain distribution controllability of the SPCB, respectively. The prototype circuits show reliable operation under various mechanical deformations, even in the 180° folding state and the irregular deformed state with 25% tensile strain. This research paves a promising route for the realization of highly reliable soft printed circuits with a high degree of design freedom, which can thus be used for driver chip mounting or driver board interconnection for the stretchable display applications.

      • KCI등재

        Difference of Potential Range Formed at the Anode Between Water Drop Test and Temperature Humidity Bias Test to Evaluate Electrochemical Migration of Solders for Printed Circuit Board

        ( Young Ran Yoo ),( Young Sik Kim ) 한국부식방식학회 2023 Corrosion Science and Technology Vol.22 No.3

        Two types of accelerated tests, Water Drop Test (WDT) and Temperature-Humidity-Bias Test (THBT), can be used to evaluate the susceptibility to electrochemical migration (ECM). In the WDT, liquid water is directly applied to a specimen, typically a patterned conductor like a printed circuit board. Time to failure in the WDT typically ranges from several seconds to several minutes. On the other hand, the THBT is conducted under elevated temperature and humidity conditions, allowing for assessment of design and life cycle factors on ECM. THBT is widely recognized as a more suitable method for reliability testing than WDT. In both test methods, localized corrosion can be observed on the anode. Composition of dendrites formed during the WDT is similar to that formed during THBT. However, there is a lack of correlation between the time to failure obtained from WDT and that obtained from THBT. In this study, we investigated the relationship between electrochemical parameters and time to failure obtained from both WDT and THBT. Differences in time to failure can be attributed to actual anode potential obtained in the two tests.

      • KCI등재

        ARM을 이용한 카메라 시스템 보드 개발에 관한 연구

        최영규 한국정보전자통신기술학회 2018 한국정보전자통신기술학회논문지 Vol.11 No.6

        In modern society, CCTV, which is the eye of surveillance, is being used to collect image data in various ways in daily life. CCTV is used not only for security, surveillance, and crime prevention but also in many fields such as automobile and black box. In this paper, we have developed a STM32F407 ARM chip based camera system for various applications. In order to develop camera system, modeling of camera system based on 3D structure was carried out in SolidWorks environment. The PCB board design was developed to extract the PCB parts from the camera system modeling files into iges files, convert them from the Altium Designer tool into 3D and 2D boards, After designing the camera system circuit and PCB, we have been studying the implementation of the stable system by using TRM (Thermal Risk Management) tool to cope with the heat simulation generated on the board. 현대 사회는 감시의 눈이라 하는 CCTV가 일상생활 속에서 다양한 방법으로 영상데이터를 수집하기 위해 사용되고 있다. 치안 및 감시, 방범용으로 CCTV를 활용할 뿐만 아니라 자동차에 블랙박스 등 많은 분야에서 활용되고 있다. 본 논문에서는 STM32F407 ARM 칩을 기반으로 다양한 분야에 응용할 수 있는 카메라 시스템을 개발하기 위해 연구를 진행하였다. 카메라 시스템 개발을 위해 솔리드 웍스 환경에서 전체적인 구조를 3D를 기반으로 카메라 시스템을 모델링을 진행하였다. PCB 보드 설계는 카메라 시스템 모델링 파일에서 PCB 부품을 iges 파일로 추출하여 Altium Designer 툴에서 3D와 2D 보드로 변환하여 PCB 설계 진행함으로써 완성도 높은 조립성을 가질 수 있도록 진행하였다. 카메라 시스템 회로 및 PCB를 설계한 후, TRM(Thermal Risk Management) 툴을 활용해서 보드에서 발생하는 발열 시뮬레이션을 진행을 통해 대처할 수 있도록 함으로써 안정적인 시스템 구현에 관한 연구를 진행하였다.

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