http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
대간간학회지 제6차 춘계학술대회 초록집 : 포스터 발표 ; 간이식후 발생한 척추결핵 1예
이연정 ( Lee Yeon Jeong ),박영민 ( Park Yeong Min ),정은선 ( Jeong Eun Seon ),신제현 ( Sin Je Hyeon ),배시현 ( Bae Si Hyeon ),변병훈 ( Byeon Byeong Hun ),윤승규 ( Yun Seung Gyu ),양진모 ( Yang Jin Mo ),한준열 ( Han Jun Yeol ),안 대한간학회 2000 Clinical and Molecular Hepatology(대한간학회지) Vol.6 No.1(S)
수원 일부지역 중년여성들의 슬관절 등속성 운동능력에 관한 연구
李仁模,趙錡衡,金時延 동남보건대학 2001 論文集-東南保健大學 Vol.19 No.1
Maximal voluntary muscular Peak Torque, Total Work, Endurance Ratio of the quadriceps and hamstring muscles during isokinetic exercise was studied in order to obtain the isokinetic normative data of the right knee joint. The results are as follows: 1. Peak Torque of right knee joint flexor in 60˚/sec on Body Weight Group are shown significantly(P <0.05), while the rest Group are not significantly. 2. Peak Torque of right knee joint extensor in 60˚/sec on Sports Item, Age Group are shown significantly(P <0.05), while the rest Group are not significantly. 3. Total Work of right knee joint flexor in 180˚/sec on All Group are not shown significantly. 4. Total Work of right knee joint extensor in 180˚/sec on Sports Item, Age and Body Weight Group are shown significantly(P <0.05), while the rest Group are not significantly. 5. Endurance Ratio of right knee joint flexor in 240˚/sec on All Group are not shown significantly(P <0.05). 6. Endurance Ratio of right knee joint extensor in 240˚/sec on Body Weight are shown significantly(P <0.05), while the rest Group are not shown significantly.
Jeongho Yang,Dongseok Kang,Si Mo Yeon,Yong Son,Sang-Hu Park 한국정밀공학회 2024 International Journal of Precision Engineering and Vol.25 No.5
The powder bed fusion (PBF) process using Ti–6Al–4V powder has the specific application in additive manufacturing of a high-performance structural parts in the aerospace and medical industries. The PBF involves the repeated accumulation of laser melted layers. Consequently, high anisotropic residual stresses and local temperature accumulation occur during the rapid melting and cooling in the process. These factors affect the mechanical properties of the as-built structure. In particular, we revealed the effective interval island laser-scanning strategy with less grain size, thermal effect and anisotropic residual stresses of the additively manufactured structure, compared to those of the strip and continuous laser-scanning strategies. Through the cantilever experiment, it was confirmed that the interval island laser-scanning strategy reduced deformation by up to 7.7% compared to that of the conventional strip laser-scanning strategy due to the reduction of anisotropic residual stresses.
Kim, Sang Hoon,Yeon, Si-Mo,Kim, Jin Hak,Park, Seong Je,Lee, Ji Eun,Park, Suk-Hee,Choi, Joon-Phil,Aranas, Clodualdo,Son, Yong American Chemical Society 2019 ACS APPLIED MATERIALS & INTERFACES Vol.11 No.18
<P>A novel In-Sn-Bi solder with a low electrical resistivity of 14.3 × 10<SUP>-6</SUP> Ω cm and a melting temperature of 99.3 °C was produced for use in adhesive joining on a flexible poly(ethylene terephthalate) substrate. We determined that the fine microstructure of the In-based solder (which had an average phase size of 62.2 nm) strongly influenced its superplasticity and toughness at diffusive temperatures of 55-85 °C because the late-forming BiIn intermetallic compound (IMC) suppressed the growth of two other IMCs, In<SUB>3</SUB>Sn and In<SUB>0.2</SUB>Sn<SUB>0.8</SUB>, which formed earlier in the soldering process. Thus, an elongation of 858.3% and toughness of 36.0 MPa were obtained at a temperature of 85 °C and a strain rate of 0.0020 s<SUP>-1</SUP>. However, due to phase boundary fracturing, the phase-refined solder exhibited a slightly more brittle nature (with an elongation of 74.3%) at room temperature compared with a standard In-Sn solder consisting only of the In<SUB>3</SUB>Sn and In<SUB>0.2</SUB>Sn<SUB>0.8</SUB> IMCs, which had a slightly larger phase size of 84.9 nm and higher ductility (with an elongation of 80.7%). In terms of superplastic deformation, the conventional fracture system based on the Hall-Petch effect transformed into phase boundary sliding at the solder operating temperature, significantly enhancing ductility.</P> [FIG OMISSION]</BR>