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Repair Circuit of TSVs in a 3D Stacked Memory IC
Yuki Ikiri,Masaki Hashizume,Hiroyuki Yotsuyanagi,Hiroshi Yokoyama,Tetsuo Tada,Shyue-Kung Lu 대한전자공학회 2015 ITC-CSCC :International Technical Conference on Ci Vol.2015 No.6
A repair circuit for TSVs (Through Silicon Vias) in a 3D stacked memory IC is proposed in this paper. The circuit is made of a switch circuit and a switch control circuit so as for a defective TSV to be connected to a defect-free TSV. The circuit is evaluated by Spice simulation. The results show us that a TSV is connected to a defect-free one with small area overhead and additional delay.