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기업 내 구성원의 개인-조직 가치일치성과 목표일치성이 업무열의에 미치는 영향: 상사지원인식의 조절효과
서승호 ( Seo¸ Seungho ),김준희 ( Kim¸ Junhee ) 한국인력개발학회 2020 HRD연구 Vol.22 No.4
본 연구의 목적은 구성원의 개인-조직 가치일치성, 개인-조직 목표일치성, 상사지원인식, 업무열의 간 관계를 규명하는 것이다. 연구목적을 달성하기 위해서 수도권 중소기업이나 대기업에 근무하는 직장인들로부터 수집된 327부의 설문자료가 분석에 사용되었다. 확인적 요인분석과 위계적 회귀분석 등의 분석방법을 활용하였다. 연구결과는 첫째, 개인-조직 가치일치성과 개인-조직 목표일치성이 업무열의에 정(+)적인 영향을 미치는 것으로 나타났다. 둘째, 업무열의에 대한 개인-조직 가치일치성의 영향력이 개인-조직 목표일치성의 영향력보다 큰 것으로 밝혀졌다. 셋째, 개인-조직 가치일치성과 업무열의의 관계에서 상사지원인식의 조절효과는 없었다. 넷째, 개인-조직 목표일치성과 업무열의 간 관계에서 상사지원인식의 조절효과가 정(+)적인 것으로 밝혀졌다. 본 연구의 결과를 토대로 HRD 관점에서 기업 구성원의 업무열의를 높이기 위한 실천적 측면, 향후 연구 측면, 이론적 측면에서 시사점을 제시하였다. The purpose of the current study was to examine the relationships among employees' person-organization value congruence, person-organization goal congruence, perceived supervisor support, and work engagement. To achieve the research goal, we used quantitative data collected from 327 employees working for a small and medium-sized enterprise or large company in the Seoul Capital Area of South Korea. We performed a confirmatory factor analysis and hierarchical regression analysis to analyze the data. As a result, we found followings: (1) the employees' person-organization value congruence and person-organization goal congruence had positive impacts on work engagement; (2) the impact of employees' person-organization value congruence on work engagement was greater than that of person-organization goal congruence; (3) the employees' perceived supervisor support did not moderate the relationship between person-organization value congruence and work engagement; and (4) the employees' perceived supervisor support had a positive moderation effect on the relationship between person-organization goal congruence and work engagement. Based on the results, we provided implications for practice, research, and theory building in the work engagement area for the HRD field.
High Accuracy Concentration Analysis of Accelerator Components in Acidic Cu Superfilling Bath
Choe, Seunghoe,Kim, Myung Jun,Kim, Kwang Hwan,Kim, Hoe Chul,Jeon, Yongkeun,Kim, Tae Young,Kim, Soo-Kil,Kim, Jae Jeong The Electrochemical Society 2016 Journal of the Electrochemical Society Vol.163 No.2
<P>We have devised a modified cyclic voltammetry stripping (CVS) method to measure the concentrations of bis-(sulfopropyl) disulfide (SPS) and 3-mercapto-1-propane sulfonate (MPS) in Cu plating solutions. Though MPS, a breakdown product of SPS, enhances the Cu deposition rate on flat electrodes, it is not a superfilling-capable accelerator for the damascene structure, unlike SPS. Therefore, accurate measurement of SPS in damascene Cu plating baths is important. However, enhancement of the Cu deposition rate by MPS interferes with the electrochemical signal of SPS, leading to a significant error when using the modified linear approximation technique (MLAT)-CVS analysis method. To evaluate their concentrations individually, a two-step CVS analysis was performed in which the total accelerator concentration ([SPS] + 1/2[MPS]) and conversion ratio were separately determined. All MPS species in the bath were oxidized to SPS by controlling the plating solution pH. Subsequent MLAT-CVS analysis successfully revealed the total accelerator concentration in the Cu plating solution. Individual SPS and MPS concentrations were thereby calculated using the conversion ratio evaluated from the difference in their relative accelerating abilities. This modified method enabled determination of the SPS concentration with <10% error, suggesting a reliable and high accuracy tool to predict pattern filling capabilities of plating solutions. (C) The Author(s) 2015. Published by ECS.</P>
Kim, D.H.,Lee, Eunsook,Kim, Hyun Woo,Seong, Seungho,Yang, Seung-Mo,Park, Hae-Soo,Hong, JinPyo,Kim, Younghak,Kim, J.-Y.,Kang, J.-S. Elsevier 2017 Journal of magnetism and magnetic materials Vol.432 No.-
<P><B>Abstract</B></P> <P>We have investigated the angle-dependent orbital and spin magnetic moments of the [Co/Pd] multilayer (ML) films with intervening CoO layers under annealing by employing angle-dependent soft X-ray magnetic circular dichroism (XMCD). After annealing, the orbital magnetic moments of Co ions are found to be enhanced, with the maximum values along the perpendicular direction of [Co/Pd] ML, providing evidence for the origin of the improved perpendicular magnetic anisotropy (PMA) being the interface spin–orbit coupling. The induced Pd polarization was observed after annealing, demonstrating the strong Co-Pd hybridization arising from the Co-Pd alloy formation near the interface. The angle-dependent coercivity follows the 1 / cos θ behavior, suggesting that the magnetization reversal in the hysteresis curve in [Co/Pd] ML occurs mainly through the pinning mechanism.</P> <P><B>Highlights</B></P> <P> <UL> <LI> Angle-dependent XMCD were performed on hybrid [CoO/Pd]<SUB>2</SUB>[Co/Pd]<SUB>7</SUB> multilayers that exhibit enhanced PMA. </LI> <LI> The enhanced orbital magnetic moments indicates that the origin of the improved PMA is the interface spin–orbit coupling. </LI> <LI> The induced Pd polarization after annealing demonstrates the strong Co-Pd hybridization arising from the Co-Pd alloy formation near the interface. </LI> <LI> The angle-dependent coercivity suggests that the magnetization reversal in [Co/Pd] ML occurs mainly through the pinning mechanism. </LI> </UL> </P>
Kim, Hoe Chul,Kim, Myung Jun,Choe, Seunghoe,Lim, Taeho,Park, Kyung Ju,Kim, Kwang Hwan,Ahn, Sang Hyun,Kim, Soo-Kil,Kim, Jae Jeong The Electrochemical Society 2014 Journal of the Electrochemical Society Vol.161 No.14
<P>The adsorption mechanism of thiourea (TU) and its effect on Cu electrodeposition were verified using TU derivatization. Contrary to the previously reported behavior of TU as an inhibitor, TU either promoted or inhibited Cu reduction according to the derivatization time. During the short derivatization time, the adsorbed TU with low surface coverage was oxidized to spontaneously reduce Cu<SUP>2+</SUP> to Cu<SUP>+</SUP>, thereby, accelerating the Cu deposition. However, TU inhibited the Cu deposition as the coverage of TU-Cu<SUP>+</SUP> increased with the derivatization time. Furthermore, a deterioration in the resistivity of the Cu film, which occurred when TU was added, was largely improved by the derivatization method while maintaining an enhancement in the film hardness. TU derivatization resulted in a 9.2% enhancement in the film hardness and only a 26.0% deterioration in the film resistivity compared to those of Cu films deposited in the absence of TU, which were not simultaneously obtainable upon the direct addition of TU to the deposition bath.</P>