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Choi, Junhwan,Joo, Munkyu,Seong, Hyejeong,Pak, Kwanyong,Park, Hongkeun,Park, Chan Woo,Im, Sung Gap American Chemical Society 2017 ACS APPLIED MATERIALS & INTERFACES Vol.9 No.24
<P>A series of high-k, ultrathin copolymer gate dielectrics were synthesized from 2-cyanoethyl acrylate (CEA) and di(ethylene glycol) divinyl ether (DEGDVE) monomers by a free radical polymerization via a one-step, vapor-phase, initiated chemical vapor deposition (iCVD) method. The chemical composition of the copolymers was systematically optimized by tuning the input ratio of the vaporized CEA and DEGDVE monomers to achieve a high dielectric constant (k) as well as excellent dielectric strength. Interestingly, DEGDVE was nonhomopolymerizable but it was able to form a copolymer with other kinds of monomers. Utilizing this interesting property of the DEGDVE cross-linker, the dielectric constant of the copolymer film could be maximized with minimum incorporation of the cross-linker moiety. To our knowledge, this is the first report on the synthesis of a cyanide-containing polymer in the vapor phase, where a high-purity polymer film with a maximized dielectric constant was achieved. The dielectric film with the optimized composition showed a dielectric constant greater than 6 and extremely low leakage current densities (< 3 X 10(-8) A/cm(2) in the range of +/- 2 MV/cm), with a thickness of only 20 nm, which is an outstanding thickness for down-scalable cyanide polymer dielectrics. With this high-k dielectric layer, organic thin-film transistors (OTFTs) and oxide TFTs were fabricated, which showed hysteresis-free transfer characteristics with an operating voltage of less than 3 V. Furthermore, the flexible OTFTs retained their low gate leakage current and ideal TFT characteristics even under 2% applied tensile strain, which makes them some of the most flexible OTFTs reported to date. We believe that these ultrathin, high-k organic dielectric films with excellent mechanical flexibility will play a crucial role in future soft electronics.</P>
Thermally Fast-Curable, “Sticky” Nanoadhesive for Strong Adhesion on Arbitrary Substrates
Joo, Munkyu,Kwak, Moo Jin,Moon, Heeyeon,Lee, Eunjung,Choi, Siyoung Q.,Im, Sung Gap American Chemical Society 2017 ACS APPLIED MATERIALS & INTERFACES Vol.9 No.46
<P>Demand of adhesives that are strong but ultrathin with high flexibility, optical transparency, and longterm stability has been rapidly growing recently. Here, we suggest a thermally curable, 'sticky' nanoadhesive with outstanding adhesion strength accomplished by single-side deposition of the nanoadhesive on arbitrary substrates. The sticky nanoadhesive is composed of an ionic copolymer film generated from two acrylate monomers with tertiary amine and alkyl halide functionalities, formed by a solvent-free method, initiated chemical vapor deposition (iCVD). Because of the low glass transition temperature (T-g) of the copolymer (-9 degrees C), the ionic copolymer shows a viscoelastic behavior that makes the adhesive attachable to various substrates, regardless of the substrate materials. Moreover, the copolymer film is thermally curable via a cross-linking reaction between the alkyl halide and tertiary amine functionalities, which substantially increased the adhesion strength of the 500 nm thick nanoadhesive greater than 25 N/25 mm within 5 min of curing at 120 degrees C. The adhesive thickness can further be reduced to 50 nm to achieve greater than 35 N/25 mm within 30 min at 120 degrees C. The nanoadhesive layer can form uniform adhesion in a large area substrate (up to 130 x 100 mm(2)) with the deposition of the adhesive only on one side of the substrates to be laminated. Because of its ultrathin nature, the nanoadhesive is also optically transparent as well as highly flexible, which will play a critical role in fabrication and the lamination of future flexible/wearable devices.</P>
Byungjun Min,Munkyu Choi,Seunggyu Oh,Nakwon Chang,Kinam Kim,Byunggil Jeon 한국물리학회 2004 Current Applied Physics Vol.4 No.1
In order to fabricate nonvolatile 4 Mb ferroelectric random access memory (FRAM) for the application to portable electronicdevices, we proposed two noble techniques; (1) shared sense amplier arrangement structure for reducing a chip size, active current,and power consumption, and (2) address transition detection (ATD) control scheme for asynchronous operation and limited addressskew-free. We successfully developed 4 Mb FRAM with the address access time of 90 ns, read/write cycle time of 100 ns, and limitedaddress skew-free of 20 ns at 2.7 V and 85˚C.
반도체 수율 향상을 위한 통계적 공정 제어에 전문가 시스템의 적용에 관한 연구
윤건상,최문규,김훈모,조대호,이칠기 성균관대학교 1998 학술회의지원논문목록집 Vol.1998 No.-
The evolution of semiconductor manufacturing technology has accelerated the reduction of device dimensions and the increase of integrated circuit density. In order to improve yield within a short turn around time and maintain it at high level. a system that can rapidly determine problematic processing steps is needed. The statistical process control detects abnormal process variation of key parameters. Expert systems in SPC can serve as a valuable tool to automate the analysis and interpretation of control charts. A set of IF-THEN rules was used to formalize knowledge base of special causes. This research proposes a strategy to apply expert system to SPC in semiconductor manufacturing. In analysis, the expert system accomplishes the instability detection of process parameter. In diagnosis. an engineer is supported by process analyzer program. An example has been used to demonstrate the expert system and the process analyzer.
Woo, Sungsoo,Kang, Munkyu,Yoon, Changhyeong,Yang, Taeseok Daniel,Choi, Youngwoon,Choi, Wonshik The Optical Society 2017 Optics express Vol.25 No.26
<P>Precision measurement of the morphology of macroscopic objects has played an important role in many areas including the manufacturing, navigation, and safety fields. In some applications, objects of interest are often masked by scattering and/or turbid layers such that they remain invisible for existing methodologies. Here, we present a high depth-resolution three-dimensional (3D) macroscopy working through a scattering layer. In this implementation, we combined time-gated detection with synthetic aperture imaging to enhance single-scattered waves containing the object information above the background level set by the multiple scattering. We demonstrated the 3D mapping of the macroscopic object through a 13-scattering-mean-free-path thick scattering layer, where conventional digital holographic imaging failed to work, with the depth resolution of 400 mu m and view field of 30 x 30 mm(2). Our work is expected to broaden the range of applications covered by 3D macroscopy. (C) 2017 Optical Society of America under the terms of the OSA Open Access Publishing Agreement</P>
Woojin. Yu,Sicheol Noh,Haekee Min,Munkyu Park,Hwaseon Jang,Eunhyeok Lee,Heungho Choi 대한전자공학회 2007 ITC-CSCC :International Technical Conference on Ci Vol.2007 No.7
In this study, acoustic field distribution was displayed in 3-dimension and the parameters to evaluate performance of ultrasonic probe quantitatively were proposed by using acoustic field analysis method which is used in correction and one of the methods to evaluate diagnostic ultrasound probe. Acoustic field signal was acquired with hydrophone and peakto-peak value of each point in acoustic field was extracted and displayed in 3-dimenstion. The volume of filed more than -3㏈ of the strongest acoustic pressure and symmetric value which has the center point as standard in axial and elevation direction were suggested as the parameters to evaluate ultrasonic probe. These parameters would be used to evaluate ultrasonic probe by acoustic field distribution analysis method.