http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
Lee, Yongsu,Lee, Hyeonwoo,Jang, Jaeeun,Lee, Jihee,Kim, Minseo,Lee, Jaehyuk,Kim, Hyunki,Yoo, Seunghyup,Yoo, Hoi-Jun IEEE 2017 IEEE journal on emerging and selected topics in ci Vol.7 No.1
<P>A sticker-type system with hybrid integration of CMOS IC and organic optical sensors is proposed to monitor photoplethysmogram (PPG) signals. To solve problems with the previous solely organic sensor-based works, CMOS IC is implemented in 180 nm technology under 5 V/1.5 V dual power supply. The silver-wire printed planar-fashionable circuit board (P-FCB) is used to connect the CMOS IC with organic sensors. The proposed hybrid system has the five following key features: 1) Power-efficient structure of organic sensor; 2) Integrated analog front-end and digital processor; 3) Degradation compensation scheme; 4) Large parasitic elements optimized design; and 5) Motion artifact rejection scheme. The stickertype PPG monitoring system has mass of only 2g, including the batteries, and consumes only 233 mu W to operate. The PPG signal could be acquired from various body parts (finger, wrist, and neck). The peripheral oxygen saturation level (SpO(2)) extraction results are verified by comparison with a commercial sensor device.</P>
SGML 문서 관리 시스템의 데이터베이스 관리기 설계 및 구현
이원석(Wonsuk Lee),류은숙(Eunsuk Ryu),김용훈(Yonghun Kim),이상기(Sangki Lee),김현기(Hyunki Kim),이혜란(Haeran Lee),주종철(Zongchul Zhoo),이규철(Kyuchul Lee) 한국정보과학회 1997 한국정보과학회 학술발표논문집 Vol.24 No.2Ⅰ
SGML은 문서 정보를 체계적으로 조직하고, 생성하고, 전송하기 위한 문서 표준으로서 문서의 적절한 구조가 유지되도록 문서 구조를 표현하는데 사용할 수 있다. 이러한 문서 형태로 표현된 정보에서는 기존의 파일 형태의 정보에 비해 의미적인 정보의 단위를 구조(structure)로서 표현하며, 이 구조 정보를 이용해 문서의 관리 및 검색, 저장에 이용할 수 있는 장점이 있다. 본 논문에서는 SGML 문서 관리 시스템의 하부 구조로서 대량의 SGML 문서를 효율적으로 저장 및 검색, 관리할 수 있는 데이터베이스 관리기 구조의 필요 모듈들을 도출하고 각 모듈의 기능과 모듈 사이의 인터페이스 관계를 기술하였다. 또한 본 논문에서는 데이터베이스 관리기 구조의 각 모듈에 대한 구현 내용을 설명하기 위해 각 모듈간의 데이터 처리 흐름도를 기술하였으며, 구현 환경으로는 객체 지향 DBMS인 O2 DBMS를 기반으로 한다.
Kim, Minseo,Jang, Jaeeun,Kim, Hyunki,Lee, Jihee,Lee, Jaehyuck,Lee, Jiwon,Lee, Kyoung-Rog,Kim, Kwantae,Lee, Yongsu,Lee, Kyuho Jason,Yoo, Hoi-Jun IEEE 2017 IEEE journal of solid-state circuits Vol.52 No.11
<P>A wearable electrical impedance tomography (EIT) system is proposed for the portable real-time 3-D lung ventilation monitoring. It consists of two types of SoCs, active electrode (AE)-SoC and Hub-SoC, mounted on wearable belts. The 48-channel AE-SoCs are integrated on flexible printed circuit board belt, and Hub-SoC is integrated in the hub module which performs data gathering and wireless communication between an external imaging device. To get high accuracy under the variation of conductivity, the dual-mode current stimulator provides the optimal frequency for time difference-EIT and frequency difference-EIT with simultaneous 4 k-128 kHz impedance sensing. A wide dynamic range instruments amplifier is proposed to provide 94 dB of wide dynamic range impedance sensing. In addition, the 48-channel AE system with the dedicated communication and calibration is implemented to achieve 1.4-m Omega sensitivity of impedance difference in the in vivo environment. The AE-/Hub-SoCs occupy 3.2 and 1.3 mm2in 65-nm CMOS technology and consume 124 mu W and 1.1 mW with 1.2 V supply, respectively. As a result, EIT images are reconstructed with 90% of accuracy, and up to 10 frames/s real-time 3-D lung images are successfully displayed.</P>
View Planning for Occluded Region with Active Imaging System
Hyunki Lee,Hyungsuck Cho,Deokhwa Hong 제어로봇시스템학회 2010 제어로봇시스템학회 국제학술대회 논문집 Vol.2010 No.10
Nowadays, a number of 3D shape measurement methods have been developed such as stereo vision, laser structured light, and Phase Measuring Profilometry (PMP). They have many problems such as correspondence problem, 2π-ambiguity and occlusion problem. Among them, occlusion problem is common problem for 3D shape measurement and well known as difficult to solve. To solve this problem, in our previous research, active imaging system is introduced, which can change the viewing angle without changing of field-of-view (FOV), and can do the FOV with maintaining the viewing angle. And to decide the viewing direction and position, view planning algorithm is developed. The performance of our system is checked by simulation and a series of real experiments.
Hyunki Lee,김민영 제어·로봇·시스템학회 2020 International Journal of Control, Automation, and Vol.18 No.8
Typical visual placement inspection systems in semiconductor or electronics manufacturing industriesuse only highly-magnified two-dimensional imaging with controlled illumination for high accuracy. However, current semiconductor packaging technology needs more precise manufacturing processes for highly integrated semiconductor packages, in which high-precision alignment between the semiconductor die and the matched substrate is indispensable for successful electronic interconnection. To solve this problem, an advanced visual placement inspection system for 3D stacking of electronic components is proposed; it utilizes 3D profilometry and 2D telecentric optics. In addition to the introduction of the proposed system, the system calibration algorithms and the information processing algorithms for accurate positioning of the semiconductor die, as well as the implemented inspectionsystem are described in detail. To verify the system performance, a series of real experiments on newly developed flip-chip packages for high-performance computing were performed, and the results are analyzed and discussed.