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MinJeong Kim,SungGon Kim,HyoJeong Kim,HoChan Kim,JiHeh Park,KwangSeok Park,DukKi Lee,WonTan Byun,CheolMin Kim 대한신경정신의학회 2008 PSYCHIATRY INVESTIGATION Vol.5 No.3
Objective-The Penn Alcohol Craving Scale (PACS) is a stronger predictor of subsequent drinking and relapse of alcohol dependence that can be administered more quickly and easily than other craving scales. The goal of this study was to develop the Korean version of the Penn Alcohol Craving Scale (PACS-K). Methods-To examine the psychometric properties of the PACS-K, responses were chosen from 80 patients admitted to a treatment facility for alcohol dependence. Results-The PACS-K possesses good psychometric properties, as assessed by Cronbach’s α estimates (Cronbach’s α=0.91). The test-retest reliability of the PACS-K showed high correlation (p<0.01) when the retest interval was 1 day. When the validity of the PACS-K was investigated using correlation analysis with two other craving scales (the Obsessive Compulsive Drinking Scale (OCDS) and the Visual Analogue Scale (VAS), high correlations were obtained between total PACS scores and total OCDS scores, and between total PACS scores and VAS scores (p<0.01, respectively). Conclusion-The PACS-K is a reliable and valid measure of alcohol cravings, and it could be useful for predicting which individuals are at risk for subsequent relapse.
Kim, Kyung-Ho,Um, Doo-Seung,Lee, Hochan,Lim, Seongdong,Chang, Joonyeon,Koo, Hyun Cheol,Oh, Min-Wook,Ko, Hyunhyub,Kim, Hyung-jun American Chemical Society 2013 ACS NANO Vol.7 No.10
<P>We demonstrate gate-controlled spin-orbit interaction (SOI) in InAs high-electron mobility transistor (HEMT) structures transferred epitaxially onto Si substrates. Successful epitaxial transfer of the multilayered structure after separation from an original substrate ensures that the InAs HEMT maintains a robust bonding interface and crystalline quality with a high electron mobility of 46200 cm<SUP>2</SUP>/(V s) at 77 K. Furthermore, Shubnikov-de Haas (SdH) oscillation analysis reveals that a Rashba SOI parameter (α) can be manipulated using a gate electric field for the purpose of spin field-effect transistor operation. An important finding is that the α value increases by about 30% in the InAs HEMT structure that has been transferred when compared to the as-grown structure. First-principles calculations indicate that the main causes of the large improvement in α are the bonding of the InAs HEMT active layers to a SiO<SUB>2</SUB> insulating layer with a large band gap and the strain relaxation of the InAs channel layer during epitaxial transfer. The experimental results presented in this study offer a technological platform for the integration of III–V heterostructures onto Si substrates, permitting the spintronic devices to merge with standard Si circuitry and technology.</P><P><B>Graphic Abstract</B> <IMG SRC='http://pubs.acs.org/appl/literatum/publisher/achs/journals/content/ancac3/2013/ancac3.2013.7.issue-10/nn403715p/production/images/medium/nn-2013-03715p_0006.gif'></P><P><A href='http://pubs.acs.org/doi/suppl/10.1021/nn403715p'>ACS Electronic Supporting Info</A></P>
Hofmeister anionic effects on hydration electric fields around water and peptide.
Kim, Heejae,Lee, Hochan,Lee, Gayeon,Kim, Haeyoung,Cho, Minhaeng American Institute of Physics 2012 The Journal of chemical physics Vol.136 No.12
<P>Specific ion effects on water dynamics and local solvation structure around a peptide are important in understanding the Hofmeister series of ions and their effects on protein stability in aqueous solution. Water dynamics is essentially governed by local hydrogen-bonding interactions with surrounding water molecules producing hydration electric field on each water molecule. Here, we show that the hydration electric field on the OD bond of HOD molecule in water can be directly estimated by measuring its OD stretch infrared (IR) radiation frequency shift upon increasing ion concentration. For a variety of electrolyte solutions containing Hofmeister anions, we measured the OD stretch IR bands and estimated the hydration electric field on the OD bond to be about a hundred MV?cm with standard deviation of tens of MV?cm. As anion concentration increases from 1 to 6 M, the hydration electric field on the OD bond decreases by about 10%, indicating that the local H-bond network is partially broken by dissolved ions. However, the measured hydration electric fields on the OD bond and its fluctuation amplitudes for varying anions are rather independent on whether the anion is a kosmotrope or a chaotrope. To further examine the Hofmeister effects on H-bond solvation structure around a peptide bond, we examined the amide I' and II' mode frequencies of N-methylacetamide in various electrolyte D(2)O solutions. It is found that the two amide vibrational frequencies are not affected by ions, indicating that the H-bond solvation structure in the vicinity of a peptide remains the same irrespective of the concentration and character of ions. The present experimental results suggest that the Hofmeister anionic effects are not caused by direct electrostatic interactions of ions with peptide bond or water molecules in its first solvation shell. Furthermore, even though the H-bond network of water is affected by ions, thus induced change of local hydration electric field on the OD bond of HOD is not in good correlation with the well-known Hofmeister series. We anticipate that the present experimental results provide an important clue about the Hofmeister effect on protein structure and present a discussion on possible alternative mechanisms.</P>
Scheduling and process planning for multiple material stereolithography
Kim, Hochan,Choi, Jae-Won,Wicker, Ryan Emerald Group Publishing Limited 2010 RAPID PROTOTYPING JOURNAL Vol.16 No.4
<B>Purpose</B> - To operate a multiple material stereolithography (MMSL) system, a material build schedule is required. The purpose of this paper is to describe a scheduling and process-planning software system developed for MMSL and designed to minimize the number of material changeovers by using low-viscosity resins that do not require sweeping. <B>Design/methodology/approach</B> - This paper employs the concept of using low-viscosity resins that do not require sweeping to minimize the number of material changeovers required in MMSL fabrication. A scheduling and process-planning software system specific to MMSL is introduced that implements four simple rules. Two rules are used to select the material to be built in the current layer, and two rules are used to determine at which layer a material changeover is required. The schedule for the material to be built depends on the material properties stored in a user-defined materials library. The developed algorithm produces sliced loop data for each material using the predetermined layer thickness from an input CAD model, and the four rules are applied at each layer. The algorithm then determines the build order for each material, the material-specific number of layers to be built, and whether or not sweeping is required. Output data from the program are the scheduling and process-planning report and the partitioned computer-aided design models to be built before changing a material according to the process planning. Two examples of the algorithm applied to multiple material parts are provided. <B>Findings</B> - The MMSL scheduling and process-planning software system is developed using Microsoft Visual C++7.0. For verification, a simple demonstration is conducted on a two material part where the process plan could be easily determined through intuition. A more complex multiple material part is also tested that consisted of four subparts. Several cases of resin assignment are tested showing that the ultimate scheduling and process planning vary significantly depending on the material combinations and specifications. These examples demonstrate that the strategy, method, and software developed in this paper can be successfully applied to prepare for MMSL fabrication. <B>Research limitations/implications</B> - Although the software system is demonstrated on two multiple material parts, more extensive work will be performed in the future on fabricating multiple material parts using the MMSL machine. It is expected that additional rules will be developed as additional limitations of MMSL are identified. It is also anticipated that particular emphasis will be placed on building without sweeping as well as development of advanced non-contact recoating processes. <B>Originality/value</B> - As designs incorporating multiple materials increase in the future and additive manufacturing (AM) technologies advance in both building out of multiple materials and fabricating production parts, the scheduling and process-planning concepts presented here can be applied to virtually any AM technology.