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Manufacturing of GaAs MMICs for Wireless Communications Applications
Wu-Jing Ho,Joe Liu,Hengchang Chou,Chan Shin Wu,Tsung Chi Tsai,Wei Der Chang,Frank Chou,Yu-Chi Wang 대한전자공학회 2006 Journal of semiconductor technology and science Vol.6 No.3
Two major processing technologies of GaAs HBT and pHEMT have been released in production at Win Semiconductors corp. to address the strong demands of power amplifiers and switches for both handset and WLAN communications markets. Excellent performance with low processing cost and die shrinkage features is reported from the manufactured MMICs. With the stringent tighter manufacturing quality control WIN has successfully become one of the major pure open foundry house to serve the communication industries. The advancing of both technologies to include E/D-pHEMTs and BiHEMTs likes for multifunctional integration of PA, LNA, switch and logics is also highlighted.
Manufacturing of GaAs MMICs for Wireless Communications Applications
Ho, Wu-Jing,Liu, Joe,Chou, Hengchang,Wu, Chan Shin,Tsai, Tsung Chi,Chang, Wei Der,Chou, Frank,Wang, Yu-Chi The Institute of Electronics and Information Engin 2006 Journal of semiconductor technology and science Vol.6 No.3
Two major processing technologies of GaAs HBT and pHEMT have been released in production at Win Semiconductors corp. to address the strong demands of power amplifiers and switches for both handset and WLAN communications markets. Excellent performance with low processing cost and die shrinkage features is reported from the manufactured MMICs. With the stringent tighter manufacturing quality control WIN has successfully become one of the major pure open foundry house to serve the communication industries. The advancing of both technologies to include E/D-pHEMTs and BiHEMTs likes for multifunctional integration of PA, LNA, switch and logics is also highlighted.