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Duoplasmatron Ion Source를 이용한 Parylene과 Al의 접착력 향상에 관한 연구
최성창,Choi, Sung-Chang 한국진공학회 2012 Applied Science and Convergence Technology Vol.21 No.2
Poly-Monochloro-Para-Xylylene (Parylene-C)과 알루미늄 박막과의 접착력을 향상시키기 위하여 Duoplasmatron 이온원을 이용하여 발생시킨 아르곤 이온과 산소 이온을 Parylene-C 표면에 각각 조사하였다. 이온조사 시 이온에너지는 1 kV로 고정하였고 이온조사량은 $5{\times}10^{14}$에서 $1{\times}10^{17}/cm^2$까지 변화시켰다. 아르곤 이온과 산소 이온을 조사한 Parylene-C 박막의 물과의 접촉각은 초기 $78^{\circ}$에서 각각 $17^{\circ}$와 $9^{\circ}$까지 감소하였다. X선 광전자 스펙트럼을 이용하여 Parylene-C 표면에 이온빔 조사에 의하여 친수성 그룹이 형성되었음을 알 수 있었으며, 이 친수성 그룹들은 C-O 결합, C=O 결합 그리고 (C=O)-O 결합에 의한 것임을 알 수 있었다. Al 박막과 ${O_2}^+$ 이온에 의해 표면 개질된 Parylene-C 박막과의 접착력을 평가하기 위하여 cross cut tape test를 실시한 결과 접착력은 이온조사량이 증가할수록 향상됨을 알 수 있었다. In order to improve the adhesion between poly-monochloro-para-xylylene (Parylene-C) film and Aluminum thin film, the surface of Parylene-C film was irradiated by ${O_2}^+$ and $Ar^+$ ion beam generated by duoplamatron ion source. The ion dose of $Ar^+$ and ${O_2}^+$ was changed from $5{\times}10^{14}$ to $1{\times}10^{17}/cm^2$ and the ion beam energy was 1 kV. Contact angles of water on Parylene-C modified by $Ar^+$ and ${O_2}^+$ ion irradiation decreased from $78^{\circ}$ to around $17^{\circ}$, and $9^{\circ}$, respectively. X-ray photoelectron spectroscopy analysis shows that the hydrophilic groups were formed on the surface of Parylene-C by chemical reaction between the unstable chains induced by the ion irradiation and oxygen ions or residual oxygen gas. The hydrophilic groups were identified as C-O bond, C=O bond and (C=O)-O bond. The cross cut tape test which was applied to characterize the adhesion between Al thin film and Parylene-C film modified by ${O_2}^+$ ions irradiation shows that the adhesion strength was improved as increasing ion dose.
이온 보존 반응법에 의하여 표면처리된 Polyimide(PI) 표면과 구리박막의 접착력 향상
최성창,석진우,최원국,손용배,정형진,고석근 한국마이크로전자및패키징학회 1997 하이브리드마이크로일렉트로닉스 Vol.4 No.1
Polyimide films are modified by Ar^+ion beam at 1 kV in an oxygen environments. Amounts of ions changed from 5 x 10^(15) to 1 x 10^(17) ions /㎠ and amounts of blowing oxygen from 0 to 8 sccm ml /min. The wettabilities and the surface free energies of modified polyimide were measured by a contact angle meter and the chemical state of the modified polyimide surface was measured by x-ray photoelectron spectroscopy. The wetting angles between water and polyimide films modified by Ar^+ ion without oxygen blowing decrease from 67 to 40 degrees and surface free energies increase from 46 to 64 dyne /㎠. The wetting angle of polyimide films modified by Ar^+ ion in an oxygen environments decrease to 12 degree and surface free energy increase to 72 dyne /㎠. Polyimide surface was modified with various gas environments and ions. Lowest wetting angle was obtained by oxygen ion irradiation in an oxygen gas environment and its value was 8°. In the case of polyimide film modified by Ar^+ ions in an oxygen environment, the wetting angle increase up to 65° when it kept in air and that increase up to 46° when it kept in water after 110 hour. In the case of polyimide film modified by O^+ ions in an oxygen environment, however, the wetting angle of polyimide film dose not increase. From the x-ray photoelectron analysis, it is found that the chemical bonds between polyimide components are severed by ion irradiation and hydrophilic groups such as (C=O)-(ON)-, COH and (C=O)-C are formed by the reaction between newly formed radicals and blowing oxygen. I t was found that the adhesion between Cu and polyimide modified by ion assisted reaction was improved, and the main reason of the enhanced adhesion is due to the reaction between Cu and C-O groups formed by ion assisted reaction on the polyimide surface.