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조영래(Y. R. Cho),문제도(J. D. Mun),오재열(J. Y. Oh),정효수(H. S. Jeong) 한국진공학회(ASCT) 1995 Applied Science and Convergence Technology Vol.4 No.3
진공측정용 센서의 크기보다 더 작은 미세소자 내부의 진공도를 계산에 의해 간접적으로 구하는 방법을 제시하였다. 평판디스플레이용 진공판넬의 설계에 본 연구의 결과를 적용하는 방법에 대해 연구하였으며, 판넬의 진공도는 판넬과 배기장치의 형상에 강하게 의존하였다. Method of measuring vacuum pressure inside a microcavity was proposed using a simplified model. This could be applied to a flat panel display. The results showed that the pressure in the microcavity of the panel was strongly affected by the shape of a vacuum system.
Field Emission Display 용 진공 패키징시 진공하에서 유리 두께에 따른 유리에 걸리는 응력 및 변위(Spacer가 없는 경우)
김희수,문제도,오재열,조영래,김진상,정재은,정효수 한국마이크로전자및패키징학회 1997 하이브리드마이크로일렉트로닉스 Vol.4 No.2
Stress developed in the glass plate during vacuum packaging of an FFD (Field Emission Display) was calculated. Bending stress was derived from the bending moment of the glass plate experiencing bending in the condition of built in edge. Fracture behaviour of the glass plate was observed and the displacement at the center was also measured. Vercuum packaging experiments were carried cut on 3.7$quot; and 5.7$quot; panels. 'floe fracture behavior of the evacuated panel was explained using the bending stress which was derived on the assumption that all edges of the gins were built in.
문제도,오재열,김희수,최영환,조영래,정효수 한국마이크로전자및패키징학회 1997 Symposium on Multichip Module and Advanced Packagi Vol.1 No.1
Low temperature electrostatic bonding experiments were carried out, which can be applicable to sensor packaging. After thermally depositing Al film on Si substrate, Al-deposited Si and alkali borosilicate glass were electrostatically bonded. The thickness of deposited A1 film were 100, 500, 2000, 5000 Å and bondings without cracks were achieved at 150 ℃ with the Al films of over 1000 Å thickness.