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SiCp/Al2O3f/Al 복합재료의 온도에 따른 열팽창 특성 해석
정성욱 ( S. W Jung ),남현욱 ( H. W. Nam ),정창규 ( C. K. Jung ),한경섭 ( K. S. Han ) 한국복합재료학회 2003 Composites research Vol.16 No.1
본 연구는 보강재의 부피분율이 49%, 56%, 63%첨가된 패키징용 SiC/A1복합재료 가압주조법을 통해 개발하였다. SiC/A1복합재료는 0.8%의 무기형성제와 Al_2O_3섬유가 SiC입자에 비해 부피비 1:10의 비율로 첨가되었으며 새로이 고안된 몰드에서 제조되었다. 제조된 SiC/A1복합재료에 대해 30~300 구간에서 열팽창 계수를 측정하고, FEM수치해석과 비교하여 온도에 따른 특성을 분석하였다. 실험결과 SiC/A1복합재료의 열팽창계수는 혼합법칙, Turner모델의 중간값을 가졌으며 상온에서는 Turner모델에 가깝다가 온도가 높아질수록 혼합법칙에 가까워졌다. 이러한 특성은 모재의 소성변형 및 잔류웅력에 의한 것으로 본 연구에서 제안한 모재와 보강재 사이에 작용하는 평균웅력 차이로부터 분석이 된다.해석결과 모재의 소성변형이 시작되는 온도에서 SiC/A1복합재료의 열팽창계수가 급격히 증가하였으며, 가공 잔류웅력은 이러한 소성변형의 시작온도를 고온으로 이동시킴으로써 열팽창계수에 영향을 끼침을 밝혔다. 이러한 일련의 연구를 통해 온도에 따른 열팽창 특성은 복수입자모델에 의한 2차원 해석을 통해 성공적으로 분석됨을 보였다. This study developed SIC_p/AL_2O_3f/A1 composites for electronic packaging to which reinforcements were added with the volume fraction of 49%, 56% and 63% by the squeeze casting method. 0.8 wt.% of the inorganic binder as well as the Al_2O_3 fiber and SIC particles with the volume fraction of 1:10 were added to the composites, which were produced in the newly deigned mold. For the produced SiC/A1 composites, the CTEs (coefficients of thermal expansion) were measured from 30 to 300 and compared with the FEM numerical simulation to analyze the temperature dependent properties. The experiment showed the CTEs of SIC_p/AL_2O_3f/A1 composites that were intermediate values of those of Rule of Mixture and Turner`s Model. The CTEs were close to Turner`s Model in the room temperature and approached the Rule of Mixture as the temperature increases. These properties analyzed from the difference of the average stress acting between the matrix and the reinforcements proposed in this study.
정성욱(S.W. Jung),김용환(Y.H. Kim),남현욱(H.W. Nam),한경섭(K.S. Han) 대한기계학회 2002 대한기계학회 춘추학술대회 Vol.2002 No.5
The compressive behavior of fiber/particle hybrid metal matrix composites(MMCs) was studied. The<br/> fiber/particle hybrid MMCs were fabricated by a squeeze casting method. Al2O3 short fiber and particle were<br/> used as reinforcements and A356 aluminium alloy was used as a matrix. The fabricated MMCs were T6 heat<br/> treated, then tension and compression tests were conducted. The optical micrographs were taken to analyze the<br/> fiber orientation and the fracture behavior. Test results show that the tensile strength of the hybrid MMCs<br/> increases as the particle volume fraction increases. In compression tests, the fiber/particle hybrid MMCs<br/> shows an anisotropic behavior. The compressive strength of P-direction is much higher than that of N-direction.<br/> Microscopic observations show that major fiber breakage mode is buckling in P-direction and bending in<br/> N-direction. This is due to the difference of fiber orientation and the hybrid effects between fiber and particle.
전자패키징용 금속복합재료의 제조공정 해석 및 충격특성평가
정성욱(S . W . Jung),정창규(C . K . Jung),남현욱(H . W . Nam),한경섭(K . S . Han) 한국복합재료학회 2002 Composites research Vol.15 No.1
가압주조법을 이용하여 전자 패키징용 고부피분율 SiC_p/Al 금속복합재료를 제조하였다. SiC_p 예비성형체를 제조하기 위하여 예비성형체 금형을 고안하였으며, Al_2O_3r섬유 보강재를 SiC_p입자 보강재의 1/10비율로 첨가하고, 무기 성형제 (SiO_2)를 0.8% 이하로 사용하여 49∼70 vol.% 의 예비성형체 제작에 성공하였다. 제조된 고부피분율 예비성형체로 금속용탕을 원활히 침투시키기 위해 온도, 가압력 등의 제조조건을 정하였으며, 이러한 새로이 고안된 금형조건을 FEM 열전도 해석에 도입하여 금속복합재료 제조시 몰드 내부에서 발생하는 온도변화를 분석하였다. 제조된 금속복합재료에 대해서는 충격특성 및 열팽창계수 특성평가를 실시하였다. 본 연구를 통해 제조된 금속복합재료의 충격흡수 에너지는 0.2∼0.3J, 열팽창계수는 8∼10ppm/℃, 밀도는 2.9∼3.0g/㎤로 나타나 패키징 재료로서 적합한 특징을 가진 복합재료가 성공적으로 개발되었음을 확인하였다. This study developed fabrication process of SiC_p/Al metal matrix composites as electronic packaging materials by squeeze casting method. The SiC_p preform were fabricated in newly designed preform mold using about 0.8% of inorganic binder(SiO_2) and 5 vol.% of Al_2O_3 fiber. To infiltrate the molten metal into the preform, fabrication condition such as the temperature and the pressure were selected. Applying the fabrication conditions, heat transfer analysis were preformed using finite element method and thus analyzed the temperature distribution and cooling characteristic during the squeeze casting. For the fabricated composites, impact toughness and thermal expansion coefficient were measured. The metal matrix composites developed in this study have 0.2∼0.3 J impact toughness, 8∼10 ppm/℃ thermal expansion coefficient and 2.9∼3.0g/㎤ density which is appropriate properties for electronic packaging application.
전자 패키징용 금속복합재료의 제조공정 해석 및 충격특성 평가
정성욱(S.W. Jung),정창규(C.K. Jung),남현욱(H.W. Nam),한경섭(K.S. Han) 대한기계학회 2002 대한기계학회 춘추학술대회 Vol.2002 No.5
This study developed fabrication process of SiCp/Al metal matrix composites as electronic packaging<br/> materials by squeeze casting method. The SiCp preform were fabricated in newly designed preform mold using<br/> about 0.8 % of inorganic binder(SiO2) and 5 vol.% of Al2O3 fiber. To infiltrate the molten metal into the<br/> preform, fabrication condition such as the temperature and the pressure were selected. Applying the fabrication<br/> conditions, heat transfer analysis were preformed using finite element method and thus analyzed the<br/> temperature distribution and cooling characteristic during the squeeze casting. For the fabricated composites,<br/> impact toughness and thermal expansion coefficient were measured. The metal matrix composites developed in<br/> this study have 0.2∼0.3 J impact toughness, 8∼10 ppm/℃ thermal expansion coefficient and 2.9∼3.0g/㎤