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여성정신장애인 남편의 적응과정 경험에 관한 현상학적 연구
정보경 ( Bo Gyeong Jeong ),김진희 ( Jin Hee Kim ) 한국가족사회복지학회 2016 한국가족복지학 Vol.52 No.-
The purpose of this study is to explore intrinsic meaning of the experience of marriage maintenance among the spouses of the mentally disabled women using the phenomenological method of research for analysis. The researchers collected the data from October to November 2011 through the in-depth interview with 5 spouses who maintain the marital relationship with the mentally disabled women who were suffering from the chronic mental disorder for more than 5 years. The analysis using the Giorgi analysis method derived 18 subjects and 6 central meanings such as ‘the fateful task given to me’, ‘family life different from others’, ‘wall (severance) from the world that I chose’, ‘ambivalence to my wife ``, ‘my children whom I am concerned about but feel thankful to’, and ‘the efforts to protect myself’. The study result showed that the spouses of the mentally disabled women start to learn about the mental disorders that they did not know before the marriage, making endless efforts in the course of their treatment as the carers of the patients. The study result also revealed that though they are living tough lives due to heavy workload, they help their children grow well and they have positive attitude for themselves living with their wives without divorce because they know that anyone can get sick. Based on the above result, the experiences of the spouses of the mentally disabled women were established and the method of implementing the mental health social welfare for them was suggested in this study.
반도체 웨이퍼 연삭용 에어 베어링 시스템의 강성 도출 연구
박민성(Min-Seong Park),정원지(Won-Jee Chung),신성우(Sung-Woo Shin),정보경(Bo-Gyeong Jeong),송의영(Eui-Young Song),김동건(Dong-Gun Kim) 한국기계가공학회 2024 한국기계가공학회지 Vol.23 No.8
Following Coronavirus disease 2019 (COVID-19), inflation in the U.S. and the inflation reduction act (IRA) of 2022 have underscored the necessity of localizing semiconductor equipment development. In the semiconductor equipment process, the double-side grinding process in wafer manufacturing utilizes porous air bearings for precision polishing, crucial for achieving ultra-precision and high rigidity by removing minor deviations on the wafer surface. This study analyses the structure of two radial air bearings and two thrust air bearings installed on spindles used in the precision polishing of semiconductor wafers, and performs flow analysis to determine rigidity. With an air gap of 10 micrometers, eccentricity was set between 1 to 5 micrometers, and pressure variation according to eccentricity was analyzed. Axial and radial stiffness were calculated using stiffness derivation formulas. The average radial stiffness measured 245.56 N/μm, while axial stiffness measured 1247.86 N/μm. Comparison with test device results, which indicated 200 N/μm for radial stiffness and 1000 N/μm for axial stiffness, confirmed error rates validating the stiffness derivation formula: the radial error rate was 22.78%, and the axial error rate was 24.78%.