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Physical properties of UV-cured films for applications to glass slimming process of display panels
전유성,공민선,이연주,강천수,한윤수 한국공업화학회 2020 한국공업화학회 연구논문 초록집 Vol.2020 No.-
Slimness and lightness are key competitive factors of consumer information technology devices that use flat panel displays, such as thin film transistor-liquid crystal display or organic light emitting diode. We prepared various UV-curable resins consisting of an urethane acrylate oligomer, an acrylate monomer, an acrylate cross-linker and a photoinitiator, and then they were cured by exposure to 365-nm UV irradiation for applications to a protection layer for glass slimming process of display. Physical properties of UV-cured films were eva luated, and the swelling ratio, cross-linking density and average molecular weight between cross-linking points in the films were also quantified.
전유성,서종성,이도경,한윤수 한국공업화학회 2020 한국공업화학회 연구논문 초록집 Vol.2020 No.-
We modified the surface of the TiO<sub>2</sub> photoelectrode using the aqueous metal nitrate solution, and investigated its effects on the performance of dye-sensitized solar cells (DSSCs). The DSSC with metal nitrate-modified photoelctrode showed an increase in the short circuit current (J<sub>sc</sub>) and the open circuit voltage (V<sub>oc</sub>), resulting in a power conversion efficiency of 9.917%, compared to that (8.925%) of reference device with pristine TiO<sub>2</sub>. The suppression of charge recombination between photo-injected electrons and triiodide (I<sub>3</sub><sup>-</sup>) ions in electrolytes was found to increase both J<sub>sc</sub> and V<sub>oc</sub> of the device with the surface-modified photoelctrode.
Fabrication and characteristics of silanized nanocarbons for applications to structural adhesives
전유성,백건욱,이동원,한윤수 한국공업화학회 2019 한국공업화학회 연구논문 초록집 Vol.2019 No.0
A structural adhesive is most often used for engineering applications where joints will typically have lap shear strengths of greater than 1MPa and, more normally, greater than 10MPa. Thus, it may undergo shock, vibration, chemical exposure, temperature excursions or many other types of potentially weakening or destructive agents, and still be bonded. In this study, adhesive composition and curing temperature were optimized, and physical properties of thermally-cured adhesives such as swelling ratio in various solvent, cross-linking density and average molecular weight between cross-linking points were investigated. In addition, silanized nanocarbons as a reinforcement of the adhesive were prepared by the reaction between functional groups in nanocarbons and hydroxyl groups in silane coupling agents.