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이재설,박태형,Lee, Jae-Seol,Park, Tae-Hyoung 제어로봇시스템학회 2015 제어·로봇·시스템학회 논문지 Vol.21 No.10
The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.
DEA-Window 분석 및 Malmquist 생산성지수를 사용한 우편집중국 효율성 및 생산성 변화 분석
이재설(Jae Seol Lee),고현우(Hyun-Woo Goh) 한국산업경영시스템학회 2009 한국산업경영시스템학회지 Vol.32 No.4
The purpose if this paper is to analyze the 24 mail center's efficiency and productivity changes from first quarter to fourth quarter of 2008 using window analysis and Malmquist productivity index Row views of window analysis results make it possible to determine trends and/or observed behavior with the same data set, and column views to examine the stability of results across different data sets malmquist productivity indexes greater than unity translate into improvements in productivity, and less than unity mean deterioration in performance over time The results of this study suggest that DEA models under dynamic situations such as window analysis and Malmquist productivity index enable us to comprehend the efficiency and productivity changes over time and to show the direction of improvements
이재설(Jae-Seol Lee),박태형(Tae-Hyoung Park) 제어로봇시스템학회 2015 제어·로봇·시스템학회 논문지 Vol.18 No.12
The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.
원자현미경 활용을 위한 하이드로젤 탐침의 마모 특성 분석 및 재생
이재설(Jae Seol Lee),송정기(Jungki Song),이정철(Jungchul Lee) 대한기계학회 2015 대한기계학회 춘추학술대회 Vol.2015 No.11
In this paper, we integrated hydrogel-poly(ethylene glycol) diacrylate nanotips on silicon cantilevers. This hydrogel nanotips were used in atomic force microscope for topographical imaging. Due to the soft material property, hydrogel can be worn while it scans a hard substrate. For maintaining the performance of hydrogel nanotips, wear characteristics were analyzed with harsh imaging conditions. Worn nanotips did not make high-resolution topographical images, so we propose novel method to regenerating hydrogel nanotips as countermeasure of wear. Hydrogel nanotip can make the silicon cantilever reusable by tip regeneration.