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Au 스터드 범프와 Sn-3.5Ag 솔더범프로 플립칩 본딩된 접합부의 미세조직 및 기계적 특성
이영규,고용호,유세훈,이창우,Lee, Young-Kyu,Ko, Yong-Ho,Yoo, Se-Hoon,Lee, Chang-Woo 대한용접접합학회 2011 대한용접·접합학회지 Vol.29 No.6
The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.
전쟁원칙 적용 방안 연구 : 전쟁원칙의 체계성과 重心과의 연계성을 중심으로
이영규 대전대학교 군사연구원 2006 군사학연구 Vol.12 No.-
본 논문은 전쟁원칙의 적용 방안을 전쟁원칙들 상호간에 내재하는 체계성과 클라우제비츠가 제시한 重心 개념과의 연계성을 중심으로 제시하였다