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연속 조성 확산 증착 방법을 통한 저항 온도 계수의 튜닝
박지훈 ( Ji-hun Park ),선정우 ( Jeong-woo Sun ),최우진 ( Woo-jin Choi ),진상준 ( Sang-joon Jin ),김진환 ( Jin-hwan Kim ),전동호 ( Dong-ho Jeon ),윤생수 ( Saeng-soo Yun ),천재일 ( Jae-il Chun ),임진주 ( Jin-ju Lim ),조욱 ( Wook Jo 한국전기전자재료학회 2024 전기전자재료학회논문지 Vol.37 No.3
The low-temperature coefficient of resistance (TCR) is a crucial factor in the development of space-grade resistors for temperature stability. Consequently, extensive research is underway to achieve zero TCR. In this study, resistors were deposited by co-sputtering nickel-chromium-based composite compositions, metals showing positive TCR, with SiO<sub>2</sub>, introducing negative TCR components. It was observed that achieving zero TCR is feasible by adjusting the proportion of negative TCR components in the deposited thin film resistors within certain compositions. Additionally, the correlation between TCR and deposition conditions, such as sputtering power, Ar pressure, and surface roughness, was investigated. We anticipate that these findings will contribute to the study of resistors with very low TCR, thereby enhancing the reliability of space-level resistors operating under high temperatures.