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김래형(R. H. Kim),오명환(M. H. Oh),정윤성(Y. S. Jeong),손성만(S. M. Son),이문용(M. Y. Lee),김지훈(J. H. Kim) 한국소성·가공학회 2024 소성가공 : 한국소성가공학회지 Vol.33 No.3
Aluminum alloy sheets, compared to conventional steel sheets, face challenges in press forming due to their lower elongation. To enhance their formability, extensive research has focused on forming technologies at elevated temperatures, specifically warm forming at around 300℃ and hot forming at approximately 500℃. This study proposes that the formability of aluminum alloy sheets can be significantly enhanced using a multi-stage hot forming technique. The research also investigates whether the strength of the A6061 aluminum alloy, known for its precipitation hardening, can be maintained when formed below the precipitate solid solution temperature. In the experiments, the A6061-T6 sheet underwent heating and rapid cooling between 250 and 500℃. The mechanical properties were evaluated at each stage of the process. The findings revealed that when the initial heat treatment was below 350℃, the strength of the material remained unchanged. However, at temperatures above 400℃, there was a noticeable decrease in strength coupled with an increase in elongation. Conversely, when the secondary heat treatment was conducted at temperatures of 350℃ or lower, the strength remained comparable to that of the initial heat treated material. However, at higher temperatures, a reduction in strength and an increase in elongation were observed.
실리콘 직접 접합 / 전기화학적 식각정지를 이용한 실리콘 다이아프램의 형성과 실리콘 압력센서 제조에의 응용
주병권,하병주,김근섭,송만호,김성환,김철주,차균현,오명환 ( B . K . Ju,B . J . Ha,K . S . Kim,M . H . Song,S . H . Kim,C . J . Kim,K . H . Tchah,M . H . Oh ) 한국센서학회 1994 센서학회지 Vol.3 No.3
A new type of Si diaphragm was fabricated using Si-wafer direct bonding and two-step electrochemical etch-stopping methods. Using the new diaphragm structure in mechanical sensors, more precise control of cavity depth and diaphragm thickness was achievable. Also, the propagation of the stress, which was generated near the bonding interface, to the surface can be avoided. Finally, a piezoresistive-type Si pressure sensor was fabricated utilizing the diaphragm and a digital pressure gauge, which can display units of pressure, was realized.