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반도체용 저온 열처리로의 Flat Zone 확장 및 온도편차 감소에 관한 연구
주강우,심승술,장혁,이유영,김광선 한국반도체디스플레이기술학회 2014 반도체디스플레이기술학회지 Vol.13 No.4
This paper is about the yield rate of lower temperature furnace for wafer heat-treatment. The flat-zone that the temperature in furnace has uniform distribution specific area is the significant variable to the yield rate. In this study, we researched about the ways how to widen the flat zone in the furnace using CFD. As a result, we confirmed that the characteristic of the flat-zone was changed when SCU(Super Cooling Unit) was used. We considered temperature control with above.