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신홍식,Shin, Hong Shik 한국교통대학교 융복합기술연구소 2014 융ㆍ복합기술연구소 논문집 Vol.4 No.2
Micro fabrication technologies of aluminium have been required to satisfy many demands in technology fields. Pulsed laser beam machining can be an alternative method to accomplish the micro machining of aluminium. Pulsed laser beam can be applied to micro machining such as micro drilling and milling. Using pulsed laser beam, the machining characteristics of aluminium in micro drilling and milling were investigated according to average power, repetition rate, moving speed of spot. The laser beam machining with the optimal conditions can achieve precise micro figures. As a result, micro pattern, text and structures on aluminium surface was successfully fabricated by pulsed laser beam machining.
레이저빔 가공 인자에 따른 구리도금 미세 패터닝 특성 연구
신홍식,Shin, Hong Shik 한국교통대학교 융복합기술연구소 2015 융ㆍ복합기술연구소 논문집 Vol.5 No.2
This paper proposes a fabrication process of deposited layer with micro patterns that uses a combination of a pulsed laser beam machining and an electrodeposition. This process consists of the electrodeposition and the laser beam machining. The deposited layer on metal can be selectively eliminated by laser ablation. As a result, the deposited layer with micro patterns can be fabricated without a mask. The characteristics of the deposited layer on stainless steel were investigated according to the average power and marking speed in the pulsed laser beam machining. The optimal laser beam conditions for precise micro patterning of the deposited layer were determined. Finally, the deposited copper layer with micro text was successfully fabricated by the pulsed laser beam machining.
신홍식(Hong-Shik Shin) 한국기계가공학회 2019 한국기계가공학회지 Vol.18 No.2
Electrochemical etching is a popular process to apply metal patterning in various industries. In this study, the electrochemical etching using a patterned copper layer was proposed to fabricate multilayered structures. The process consists of electrodeposition, laser patterning, and electrochemical etching, and a repetition of this process enables the production of multilayered structures. In the fabrication of a multilayered structure, an etch factor that reflects the etched depth and pattern size should be considered. Hence, the etch factor in the electrochemical etching process using the copper layer was calculated. After the repetition process of electrochemical etching using copper layers, the surface characteristics of the workpiece were analyzed by EDS analysis and surface profilometer. As a result, multilayered structures with various shapes were successfully fabricated via electrochemical etching using copper layers.
신홍식(Hong Shik Shin),김보현(Bo Hyun Kim),김규만(Gyu Man Kim),정도관(Do Kwan Chung),주종남(Chong Nam Chu) 대한기계학회 2009 大韓機械學會論文集A Vol.33 No.5
In micro electrochemical machining(micro-ECM), it is important to measure and control the potential of a tool electrode and a workpiece electrode because electrochemical reaction rate depends on the potential of the electrodes. When the electrode potential was measured against a reference electrode, the error of measured electrode potential could be minimized by proper tool electrode design. In this paper, multi-function electrodes consisting of a tool electrode and a reference electrode was fabricated by micro fabrication techniques. The machining conditions in micro-ECM using multi-function electrodes, such as pulse voltage parameters and electrode potential, were investigated.
신홍식(Hong Shik Shin),김성룡(Sung Yong Kim) 한국생산제조학회 2015 한국생산제조학회지 Vol.24 No.1
This paper proposes a selective electrodeposition process that uses laser masking and a DC voltage. Selective electrodeposition using laser masking and a DC voltage is more efficient than that using laser masking and a pulse voltage. In other words, electrodeposition with a DC voltage allows for precise selective deposition without the limitation of the deposition region. Also, a selective electrodeposition method that uses laser masking and DC voltage can reduce the electrodeposition time. The characteristics of a copper layer deposited by laser masking and DC voltage were examined under various conditions. A selective copper layer with various micro patterns of2 μm thickness was successfully fabricated.
레이저빔을 이용한 티타늄 표면에서의 선택적 구리 전해도금
신홍식(Hong Shik Shin) 한국생산제조학회 2017 한국생산제조학회지 Vol.26 No.1
Titanium has been used in various fields due to its good corrosion and erosion resistance, and superior mechanical properties. The process for selective electro-deposition on a titanium surface using laser beam is proposed in this paper. The process consists of laser irradiation, electro-deposition, and ultrasonic cleaning. Laser irradiation can change the surface morphology of titanium. Through laser irradiation, the surface cleaning effect and a rough surface can be achieved. The surface roughness of titanium was measured according to the laser beam conditions. The characteristics of selective electro-deposition on titanium surface according to surface roughness are investigated by various analytical methods such as SEM, and EDS.
3D 프린팅으로 제조한 알루미늄 합금의 크로메이트 코팅
신홍식(Hong-Shik Shin),김효태(Hyo-Tae Kim),김기승(Ki-Seung Kim),최혜윤(Hye-Yoon Choi) 한국기계가공학회 2022 한국기계가공학회지 Vol.21 No.2
The demand for metal 3D printing technology is increasing in various industries. The materials commonly used for metal 3D printing include aluminum alloys, titanium alloys, and stainless steel. In particular, for applications in the aviation and defense industry, aluminum alloy 3D printing parts are being produced. To improve the corrosion resistance in the 3D printed aluminum alloy outputs, a post-treatment process, such as chromate coating, should be applied. However, powdered materials, such as AlSi7Mg and AlSi10Mg, used for 3D printing, have a high silicon content; therefore, a suitable pretreatment is required for chromate coating. In the desmut step of the pretreatment process, the chromate coating can be formed only when a smut composed of silicon compounds or oxides is effectively removed. In this study, suitable desmut solutions for 3D printed AlSi7Mg and AlSi10Mg materials with high silicon contents were presented, and the chromate coating properties were studied accordingly. The smut removal effect was confirmed using an aqueous desmut solution composed of sulfuric, nitric, and hydrofluoric acids. Thus, a chromate coating was successfully formed. The surfaces of the aluminum alloys after desmut and chromate coating were analyzed using SEM and EDS.
신홍식 ( Hong Shik Shin ),김상선 ( Sang Sun Kim ),김병관 ( Byeong Gwan Kim ),조아영 ( A Young Cho ),이성희 ( Seong Hee Lee ),조미영 ( Me Young Cho ),조진웅 ( Jin Woong Cho ),김지웅 ( Ji Woong Kim ) 대한췌장담도학회 2015 대한췌담도학회지 Vol.20 No.3
Secondary involvement of the gallbladder by systemic lymphoma is exceedingly rare and relapsed diffuse large B cell lymphoma of the gallbladder has not been reported. A 78-year-old man was admitted to the hospital due to epigastric pain and jaundice. His past medical history was remarkable for diagnosis with diffuse large B-cell lymphoma of the ileum 5 years ago. He underwent right hemicolectomy and three cycles of adjuvant chemotherapy and had complete remission. Abdominal computed tomography showed choledocholithiasis and focal thickening at fundus of the gallbladder. The patient underwent open cholecystectomy. Pathologic examination revealed diffuse large B-cell lymphoma. We report a case of solitary, relapsed diffuse large Bcell lymphoma of the gallbladder with literature review.
Strained-Si PMOSFET에서 디지털 및 아날로그 성능의 캐리어 방향성에 대한 의존성
한인식(In-Shik Han),복정득(Jung-Deuk Bok),권혁민(Hyuk-Min Kwon),박상욱(Sang-Uk Park),정의정(Yi-Jung Jung),신홍식(Hong-Sik Shin),양승동(Seung-Dong Yang),이가원(Ga-Won Lee),이희덕(Hi-Deok Lee) 大韓電子工學會 2010 電子工學會論文誌-SD (Semiconductor and devices) Vol.47 No.8
본 논문에서는 각각 다른 캐리어 방향성을 가지는 strained-silicon PMOSFET에서 소자의 디지털 및 아날로그 성능을 비교 평가 하였다. 캐리어 방향이 〈100〉을 갖는 소자의 경우 이동도 향상에 의해서 〈110〉방향의 소자 보다 우수한 드레인 구동 전류 및 출력저항 특성을 보이지만, NBTI 신뢰성과 소자의 matching 특성은 반대로 다소 열화 됨을 확인 하였다. 따라서 나노미터급 CMOSFET에서 캐리어 방향성을 이용한 이동도 향상 기술의 적용을 위해서는 DC 성능을 비롯한 신뢰성 및 아날로 그 특성을 모두 고려하는 것이 반드시 필요하다고 할 수 있다. In this paper, comparative analysis of digital and analog performances of strained-silicon PMOSFETs with different carrier direction were performed. ID.SAT vs. ID.OFF and output resistance, Rout performances of devices with 〈100〉 carrier direction were better than those of 〈110〉 direction due to the greater carrier mobility of 〈100〉 channel direction. However, on the contrary, NBTI reliability and device matching characteristics of device with 〈100〉 carrier direction were worse than those with 〈110〉 carrier direction. Therefore, simultaneous consideration of analog and reliability characteristics as well as DC device performance is highly necessary when developing mobility enhancement technology using the different carrier direction for nano-scale CMOSFETs.