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LED 칩 제조용 사파이어 웨이퍼 절단을 위한 내부 레이저 스크라이빙 가공 특성 분석
송기혁(Song, Ki-Hyeok),조용규(Cho, Yong-Kyu),김병찬(Kim, Byung-Chan),강동성(Kang, Dong-Seong),조명우(Cho, Meyong-Woo),김종수(Kim, Jong-Soo),유병소(Ryu, Byung-So) 한국산학기술학회 2015 한국산학기술학회논문지 Vol.16 No.9
스크라이빙 공정은 LED 칩 생성을 위한 절단 공정으로 칩의 특성 및 생산량을 결정하는 중요한 공정이다. 기존의 기계적 방식 및 레이저 방식의 스크라이빙 공정은 칩의 열 변형 및 강도 저하, 절단 영역의 제한 등의 문제점이 있다. 이러한 문제를 해결하기 위해 웨이퍼 내부에 공극을 생성하여 자가 균열을 유도하는 내부 레이저 스크라이빙 공정이 연구되고 있으 나 LED 칩 제작을 위한 사파이어 웨이퍼의 절단에 대한 연구는 미비한 실정이다. 본 논문은 LED 칩 제작에 사용되는 사파이 어 웨이퍼의 내부 레이저 스크라이빙 공정을 적용하기 위해 주요 가공 변수를 정립하고 가공 실험을 통하여 절단 특성을 분석함으로써 내부 레이저 스크라이빙 시스템 구축을 위한 기초 가공 조건을 확립하였다. Scribing is cutting process to determine production amount and characteristic of LED chip. So it is an important process for fabrication of LED chip. Mechanical process and conventional scribing process with laser source has several problems such as thermal deformation, decreasing of material strength and limitation of cutting region. To solve these problems, internal laser scribing process that generates void in wafer and derives self-crack has been researched. However, studies of sapphire wafer cutting by internal laser scribing process for fabrication of LED chip are still insufficient. In this paper, cutting parameters were determined to apply internal laser scribing process for sapphire wafer for fabrication of LED chip. Then, foundation of cutting condition was established to set up internal laser scribing system through investigation of cutting characteristics by several experiments.
Ultra-Precise Polishing of Mica Glass Ceramics Using MR Fluids and Nano Abrasives
백시영,송기혁,김기범,김병찬,강동성,홍광표,Beak, Si-Young,Song, Ki-Hyeok,Kim, Ki-Beom,Kim, Byung-Chan,Kang, Dong-Sung,Hong, Kwang-Pyo The Korean Society of Manufacturing Process Engine 2017 한국기계가공학회지 Vol.16 No.5
Mica-glass ceramics has features such as micro-sized crystals, high strength, chemical resistance, semitransparent optical properties, etc. Due to its superior material properties, mica glass ceramics have increasing applications in dental and medical components, insulation boards, chemical devices, etc. In many applications, especially for dental and medical components, ultra-precise polishing is required. However, it is known to be a very difficult-to-grind material because of its high hardness and brittle properties. Thus, in this study, a newly developed ultra-precise polishing method is applied to obtain nano-level surface roughness of the mica glass ceramics using magnetorheological (MR) fluids and nano abrasives. Nano-sized ceria particles were used for the polishing of the mica glass ceramics. A series of experiments were performed under various polishing conditions, and the results were analyzed. A very fine surface roughness of Ra=6.127 nm could be obtained.
반도체 Sub-Fab 용 웨지 마운트 레벨러(Wdge Mount Leveler)의 마찰과 응력에 관한 연구
민경호,송기혁,홍광표,Min, Kyung-Ho,Song, Ki-Hyeok,Hong, Kwang-Pyo 한국금형공학회 2017 한국금형공학회지 Vol.11 No.2
Semiconductor equipment manufacturers desire to enhance efficiency of Sub Fab to increase semiconductor productivity. For this reason, Sub Fab equipment manufacturers are developing Integrated System that combined modules with multiple facilities. Integrated System is required to apply Mount Leveler of Wedge Type in compliance with weight increase compared with existing single equipment and product shape change. This thesis analyzes main design variables of components of Wedge Mount Leveler and carries out structure analysis using ANSYS, finite element analysis program Analysis shows that main design variables of components of Wedge Mount Leveler has self-locking condition by friction force of Wedge and adjusting bolt. Each friction force hinges upon Wedge angle and Friction Coefficient of contact surface and upon the thread angle and Friction Coefficient of contact surface. Also, as a result of carrying out structure analysis of Wedge Mount Leveler, deflection and stress appears in different depending on the height of the level.
MR Fluid Polishing을 이용한 Co-Cr-Mo alloy의 초정밀 연마 방법
신봉철,김병찬,송기혁,조명우,Shin, Bong-Cheol,Kim, Byung-Chan,Song, Ki-Hyeok,Cho, Myeong-Woo 한국금형공학회 2017 한국금형공학회지 Vol.11 No.3
In general, metallic bio-materials is more widely used in solid tissue like bone or tooth than flexible tissue such as skin or muscle. Especially, Cobalt Chrome Molybdenum(Co-Cr-Mo), which is used in tooth surgery, has a great corrosion resistance. Because this bio-material is non-toxic in human body, and has a bio-compatibility that the vital reaction is not occurred with tissue in body. However the chemical reaction is occurred by fatal matter that deteriorate the property of material surface in conventional polishing, and it can affect to fatal disease in human body or decrease the material properties such as hardness, yield strength or bio-compatibility. This surface in poor condition can cause development of corrosion or bacteria. In this study, MR fluid polishing is used to minimize the scratch, pit or surface flaws generated in conventional polishing. Surface roughness is measured according to the polishing condition to obtain fine surface condition.
정성학 ( Sung Hak Chung ),송기혁 ( Ki Hyeok Song ) 한국안전학회(구 한국산업안전학회) 2016 한국안전학회지 Vol.31 No.2
The objective of this study is to evaluate the operator ``s safety for the risk assessment method of impulsive noise division. Literature reviews on the basis of the impulsive noise study, the measuring methods and procedures, based on the results of the analysis process presents a risk assessment methods. In this study, analysis of the MIL-STD-1474D, B-duration graph for the peak noise level to cross the line from the measurement results is limited by the risk retracted. It is possible to determine whether there is quick can be determined whether the risk. Measurement positions measured by the microphone is installed on the risk of applying results are so located within the tolerance impulsive noise in the measurement position can interpret subjective safety is ensured. In addition, Proportional Dose technology was the proposed by the Patterson with the risk assessment method was applied to the indoor-impulsive noise. As results of this study, results for the same value of applying the technique of Proportional Dose technology results calculated by MIL-STD-1474D methods allows 1 count once increased in comparison to the result obtained.
Ultra-Precise Polishing of Mica Glass Ceramics Using MR Fluids and Nano Abrasives
Si-Young Beak(백시영),Ki-Hyeok Song(송기혁),Ki-Beom Kim(김기범),Byung-Chan Kim(김병찬),Dong-Sung Kang(강동성),Kwang-Pyo Hong(홍광표) 한국기계가공학회 2017 한국기계가공학회지 Vol.16 No.5
Mica-glass ceramics has features such as micro-sized crystals, high strength, chemical resistance, semitransparent optical properties, etc. Due to its superior material properties, mica glass ceramics have increasing applications in dental and medical components, insulation boards, chemical devices, etc. In many applications, especially for dental and medical components, ultra-precise polishing is required. However, it is known to be a very difficult-to-grind material because of its high hardness and brittle properties. Thus, in this study, a newly developed ultra-precise polishing method is applied to obtain nano-level surface roughness of the mica glass ceramics using magnetorheological (MR) fluids and nano abrasives. Nano-sized ceria particles were used for the polishing of the mica glass ceramics. A series of experiments were performed under various polishing conditions, and the results were analyzed. A very fine surface roughness of Ra=6.127 nm could be obtained.
티타늄 합금 플랜지 볼트 성형에서의 단조력 간접 측정을 위한 열간 단조 공정 모니터링에 관한 연구
하석재,최두선,이동원,송기혁,Ha, Seok-Jae,Choi, Doo-Sun,Lee, Dong-Won,Song, Ki-Hyeok 한국금형공학회 2021 한국금형공학회지 Vol.15 No.1
The objective of this study is to introduce the new possibility of sensing technology based on inductive displacement sensors to monitor the status of wheel position in the hot forging process. In order to validate effectiveness of proposed sensing technology, the indirect forging force measurement with displacement sensor was applied into a typical closed hot forging die-set used for the manufacturing of flange bolts. The locations to implement the displacement sensor were selected carefully by simulating forming process and static structural. From the measurement results of the forging force change during one hot forging cycle, it was found that the proposed monitoring system can provide useful information to understand the detailed behaviors of die-set in the closed hot forging process.
MQL 공급시스템을 이용한 플라스틱 금형강 가공 최적화에 관한 연구
홍광표(Kwang-Pyo Hong),송기혁(Ki-Hyeok Song),이인철(In-Cheol Lee),강동성(Dong-Sung Kang),정재화(Jae-Hwa Chung),임동욱(Dong-Wook Lim),김운용(Woon-Yong Kim),백시영(Si-Young Beck) 한국기계가공학회 2017 한국기계가공학회지 Vol.16 No.6
This study manufactured a minimum quantity lubrication (MQL) supply system and identified the optimal MQL machining cutting conditions for plastic mold steel (SCM440). A series of experiments were consisted of twice. Optimal cutting conditions were derived using the Taguchi method, and cutting force variance; surface roughness; tool wear; and cutting temperature in dry, wet, and MQL machining were measured experimentally for these optimal conditions. The measured results decreased from dry to wet and MQL machining, being particularly large for dry machining due to increased cutting time. Measured MQL machining metrics were similar to those for wet machining, particularly for surface roughness, which is an index of machining quality.
LED 칩 제조용 사파이어 웨이퍼 절단을 위한 내부 레이저 스크라이빙 시스템 개발
김종수(Jong-Su Kim),유병소(Byung-So Ryu),김기범(Ki-Beom Kim),송기혁(Ki-Hyeok Song),김병찬(Byung-Chan Kim),조명우(Myeong- Woo Cho) 한국기계가공학회 2015 한국기계가공학회지 Vol.14 No.6
LED has added value as a lighting source in the illμminating industry because of its high efficiency and low power consμmption. In LED production processes, the chip cutting process, which mainly uses a scribing process with a laser has an effect on quality and productivity of LED. This scribing process causes problems like heat deformation, decreasing strength. The inner laser method, which makes a void in wafer and induces self-cracking, can overcome these problems. In this paper, cutting sapphire wafer for fabricating LED chip using the inner laser scribing process is proposed and evaluated. The aim is to settle basic experiment conditions, determine parameters of cutting, and analyze the characteristics of cutting by means of experimentation.