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호텔 주방 작업환경이 주방 종사원의 직무만족 및 조직몰입에 미치는 영향에 관한 연구
함성필,손선익 한국관광학회 2008 관광학연구 Vol.32 No.5
This study examines whether kitchen work environment have an effect on the job satisfaction and the organization commitment. The 234 hotel kitchen workers were surveyed by purposive sampling and the data was analyzed to examine 2 hypotheses. Kitchen work environment factors were divided into three factors(human, physical, and safety & sanitation) in this study. Using the three factors as variables, this study analyzed participants’ job satisfaction and organization commitment. The hypothesized relationships were measured using SPSS12.0 through Multiple Regression Analysis. The results of this study indicated that 1) the hotel kitchen work environment factors were statistically significant with the job satisfaction and 2) the hotel kitchen work environment factors were partially significant with the organization commitment.
자동차 전장 부품 무연솔더 접합부의 기계적 신뢰성 평가에 관한 연구
전유재,손선익,윤준호 한국특허학회 2010 특허학연구 : 한국특허학회지 Vol.12 No.2
본 연구에서는 무연솔더(lead-free soler)로서 우수한 성질을 가지고 있는 Sn-3.0Ag-0.5Cu계 무연솔더를 이용하여 자동차 전장 부품(automotive application component)의 열충격(thermal shock) 시험 전·후의 솔더접합부의 기계적 신뢰성 평가에 대해 검토하였다. 432사이클의 열충격 시험 후 미세균열 및 접합부의 형상에는 아무런 변화가 나타나지 않았다. 하지만, 기계적 강도 값은 대체적으로 감소하는 결과를 나타내었다. QFP1과 R1 chip의 기계적 강도값은 각각 약 8%와 27%로 감소하는 것으로 나타났다. QFP1과 R1 chip의 기계적 강도 값의 차이는 솔더 접합부의 면적차이에서 비롯된 것으로 판단된다. 향후 금속간 화합물의 종류 및 두께, 파단부위의 위치 및 특성 등 을 고려하여 새로운 접합강도 비교기준을 정립할 필요가 있다고 판단된다.
Sn-3Ag-0.5Cu계 솔더를 이용한 자동차 전장 부품 접합부의 열충격 특성에 관한 연구
전유재,손선익,김도석,신영의,Jeon, Yu-Jae,Son, Sun-Ik,Kim, Do-Seok,Shin, Young-Eui 한국전기전자재료학회 2010 전기전자재료학회논문지 Vol.23 No.8
This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.
열초음파 접합 공정과 접합부의 신뢰성 평가에 관한 연구
신영의,박진석,손선익,Shin, Young-Eui,Pak, Jin-Suk,Son, Sun-Eik 한국전기전자재료학회 2009 전기전자재료학회논문지 Vol.22 No.8
In this thesis, lateral thermosonic bonding with ACFs was investigated as a process to make high reliability joints for FPD fabrication. Conditions for thermosonic and thermocompression bonding with ACFs were determined and used to make specimens in a driving test jig for testing of bond reliability by thermal shock. The results showed that thermosonic bonding temperature of $199\;^{\circ}C$ and bonding time of 1s produced bonds with good reliability. Additionally, thermosonic bonding temperature and time were reduced and thermal shock test results compared to this proposed curing condition. It is concluded that theromosonic bonding with ACFs can be effectively applied to reduce bonding temperature and time compared with that of thermocompression bonding.
이용현,이용수,권혁주,손선익,이재성 경북대학교 전자기술연구소 1992 電子技術硏究誌 Vol.13 No.1
To study charge trap density of reoxidized silicon nitroxide films, 200 Å thin oxides nitrided at 950, 1050, and 1150℃ respectively for 30 minutes were reoxidized by conventional thermal processing in dry oxygen at 950, 1050, and 1150℃ for 15, 30, 60, and 120 minutes. And subsequently composition, hydrogen contents and charge trap characteristics of the films, depending on the nitridation and reoxidation condition, were investigated. From AES depth profile, the apparent increase of nitroxide film thickness due to diffusion of oxygen was observed after reoxidation for 30 minutes. RBS analysis showed that as reoxidation proceeds, hydrogen concentration in the film decreases. Charge trap density was monitored by flat-band voltage shift under high field stress. Compared with nitroxide film, the reoxidized nitroxide films showed less charge trap concentration, less interface state generation and lower threshold voltage. The experimental results for charge trap suggest that these effects are related to the nitrogen and hydrogen contents in the nitroxide film.