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정펄스 및 역펄스 방법을 이용하여 구리 전해도금 시 전착층의 표면 형상과 고유저항에 미치는 효과
우태균,박일송,설경원,Woo, Tae-Gyu,Park, Il-Song,Seol, Kyeong-Won 한국재료학회 2007 한국재료학회지 Vol.17 No.1
Recently, requirement for the ultra thin copper foil increases with smaller and miniaturized electronic components. In this study, we evaluated the surface morphology, crystal phase ana surface roughness of the copper film electrodeposited by pulse method without using additives. Homogeneous and dense copper crystals were formed on the titanium substrate, and the optimum condition was 25% duty cycle. Moreover, the surface roughness(Ra), $0.295{\mu}m$, is the smallest value in this condition. It is thought that this copper foil is good for electromigration inhibition due to the preferential crystal growth of Cu (111)
Seed 금속의 종류와 두께에 따른 구리 전착층의 표면형상에 미치는 영향
우태규,박일송,설경원,Woo, Tae-Gyu,Park, Il-Song,Seol, Kyeong-Won 한국재료학회 2007 한국재료학회지 Vol.17 No.5
This study aimed to investigate the effects of the seed layer with copper electroplating on the surface morphology of copper foil. Three kinds of seed metal such as platinum, palladium, Pt-Pd alloy were used in this study. Electrodeposition was carried out with the constant current density of 200 $mA/cm^2$ for 68 seconds. Electrochemical experiments, in conjunction with SEM, XRD, AFM and four-point probe, were performed to characterize the morphology and mechanical characteristics of copper foil. Large particles were observed on the surface of the copper deposition layer when a copper foil was electroplated on the 130 nm thickness of Pd, Pt-Pd seed layer. However, a homogeneous surface, low resistivity was obtained when the 260 nm thickness of Pt, Pt-Pd alloy seed layer was used. The minimum value of resistivity was 2.216 ${\mu}{\Omega}-cm$ at the 260 nm thickness of Pt-Pd seed layer.
구리 전해도금 시 표면형상과 기계적 특성에 미치는 HEC효과
우태규,박일송,이현우,설경원,Woo, Tae-Gyu,Park, Il-Song,Lee, Hyun-Woo,Seol, Kyeong-Won 한국재료학회 2006 한국재료학회지 Vol.16 No.11
The purpose of this study is to identify the effect of additives and composition on copper surface morphology and mechanical characteristics by copper electrodeposition. Additives such as hydroxy ethyl cellulose(HEC), chloride ion were used in this study. Electrochemical experiments allied to SEM, XRD, AFM and four- point probe were performed to characterize the morphology and mechanical characters of copper in the presence of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 200 mA/$cm^2$ for 68 seconds with 2 ppm of HEC. The minimum value of surface roughness(Rms) was 107.6 nm. It is copper foil is good for electromigration inhibition due to preferential crystal growth of Cu (111) deposited in the electrolyte containing chloride ions(10 ppm) and HEC(1 ppm).
정전류 방법을 이용하여 구리 전해도금 시 첨가제와 전류밀도 효과
우태규 ( Tae Gyu Woo ),설경원 ( Kyeong Won Seol ),이현우 ( Hyun Woo Lee ),박일송 ( Il Song Park ),윤영민 ( Young Min Yoon ),윤정모 ( Jeong Mo Yoon ),우경녕 ( Kyeong Nyong Woo ) 대한금속재료학회 ( 구 대한금속학회 ) 2006 대한금속·재료학회지 Vol.44 No.8
The purpose of this study is to identify the effect of additives and current density on initial copper nucleation and growth during copper electrodeposition. Additives such as chloride ions, arabic gum were used in this study. An EG&G PAR model 273A potentiostat/galvanostat connected to a microcomputer with the M270 software was used for the electrochemical tests. Electrochemical experiments allied to SEM and image analysis were performed to characterize the nucleation and growth of copper in the presence of additives. In the higher current density, the copper foil had more uniform crystal size, higher surface covering and less needles shape crystals compared to lower current density. In the production of electrodeposited copper foil, grain size of the copper foil can be controlled by adding appropriate combination of additives.
전해도금 시 아라비아 검과 염소이온이 구리 핵생성과 성장에 미치는 효과
우태규 ( Tae Gyu Woo ),설경원 ( Kyeong Won Seol ),이현우 ( Hyun Woo Lee ),박일송 ( Il Song Park ),오동진 ( Dong Jin Oh ),권오종 ( O Jong Kwon ) 대한금속재료학회 ( 구 대한금속학회 ) 2006 대한금속·재료학회지 Vol.44 No.7
The purpose of this study is to identify the effect of additives amount and composition rate on initial copper nucleation and growth during copper electrodeposition. Additives such as arabic gum, chloride ion were used in this study. In the production of electrodeposited copper foil, the surface roughness and crystal size of copper was able to be controlled by using appropriate combination of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 500 mA/㎠ for 50 seconds with 1.5 ppm of gum arabic and 15 ppm of chloride ion. The minimum value of surface roughness was 0.195 ㎛. The addition of chloride ions (5 ppm~20 ppm) showed more effect on reducing the surface roughness compared with the case adding gum arabic only in the electrolyte.
티타늄 기지을 이용한 구리 전해도금 시 Arabic Gum 첨가제의 영향
우태규,박일송,이현우,설경원,Woo, Tae-Gyu,Park, Il-Song,Lee, Hyun-Woo,Seol, Kyeong-Won 한국재료학회 2006 한국재료학회지 Vol.16 No.12
The purpose of this study is to identify the effect of additives during copper electrodeposition. Additives such as arabic gum, chloride ions and glue were used in this study. Electrochemical experiments allied to SEM and roughness examination were performed to characterize of the copper foil in the presence of additives. In the production of electrodeposited copper foil, the surface roughness and grain size of the copper foil can be controlled by addition additives. on this study, the more uniform and hemispherical copper crystals are during the initial stages, the smaller crystal size and surface roughness of copper foil are. The surface roughness of copper foil electrodeposited at the current density of 500 $mA/cm^2$ under galvanostatic mode for 60 seconds has a minimum value of 0.136 ${\mu}$m when adding 2 ppm of arabic gum.
이현우,전우용,이오연,설경원,Lee Hyun-Woo,Jeon Woo-yong,Lee Oh-yeon,Seol Kyeong-won 한국분말야금학회 2004 한국분말재료학회지 (KPMI) Vol.11 No.5
The purpose of the present study is to determine an optimum composition using cheaper powders keeping with high performance of hard rock cutting diamond saw blade. With 50Fe-20(Cu . Sn)-30Co specimen, a part of Co was replaced by Ni(5%, 10%, and 15%, respectively). These specimens were hot pressed and sintered for predetermined time at various temperature. Sintering is performed by two different methods of temperature controlled method and specimen dimension controlled method. In order to determine the property of the sintered diamond saw blade, 3 point bending tester, X-ray diffractometer, and SEM were used. As the Co in the bond alloy was replaced by Ni, the hardness of the specimen increased. Thus the 50Fe-20(CuㆍSn)-15Co-15Ni specimen showed the maximum hardness of 104(HRB). The results of 3 point bending test showed that flexure strength decreased along with increase in Ni content. This is attributed to the formation of intermetallic compound(Ni$_{x}$Sn) determined by X-ray diffraction. The fracture surface after 3 point bending test showed that diamond was fractured in the specimen containing 0%, 5%, and 10%Ni, and the fracture occurred at the interface between diamond and matrix in the specimen containing 15%Ni. The cutting ability test showed that the abrasive property was not changed in the specimen containing 0%, 5%, and 10%Ni. The optimum composition determined in this study is 50Fe-20(CuㆍSn)-20Co-10Ni.
우태규,박일송,정광희,설경원,Woo, Tae-Gyu,Park, Il-Song,Jung, Kwang-Hee,Seol, Kyeong-Won 한국재료학회 2010 한국재료학회지 Vol.20 No.10
This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/$cm^2$. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/$cm^2$. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/$cm^2$ considering the productivity and mechanical properties of copper foil.
레이저 클래딩법을 이용한 AISI 316L 스테인리스강 내 Y<sub>2</sub>O<sub>3</sub>입자의 분산거동
박은광,홍성모,박진주,이민구,이창규,설경원,이양규,Park, Eun-Kwang,Hong, Sung-Mo,Park, Jin-Ju,Lee, Min-Ku,Rhee, Chang-Kyu,Seol, Kyeong-Won,Lee, Yang-Kyu 한국분말야금학회 2013 한국분말재료학회지 (KPMI) Vol.20 No.4
The present work investigated the dispersion behavior of $Y_2O_3$ particles into AISI 316L SS manufactured using laser cladding technology. The starting particles were produced by high energy ball milling in 10 min for prealloying, which has a trapping effect and homogeneous dispersion of $Y_2O_3$ particles, followed by laser cladding using $CO_2$ laser source. The phase and crystal structures of the cladded alloys were examined by XRD, and the cross section was characterized using SEM. The detailed microstructure was also studied through FE-TEM. The results clearly indicated that as the amount of $Y_2O_3$ increased, micro-sized defects consisted of coarse $Y_2O_3$ were increased. It was also revealed that homogeneously distributed spherical precipitates were amorphous silicon oxides containing yttrium. This study represents much to a new technology for the manufacture and maintenance of ODS alloys.