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신운기,박선준,이현섭,정문기,이영균,이호준,김영민,조한철,주석배,정해도,Shin, Woon-Ki,Park, Sun-Joon,Lee, Hyun-Seop,Jeong, Moon-Ki,Lee, Young-Kyun,Lee, Ho-Jun,Kim, Young-Min,Cho, Han-Chul,Joo, Suk-Bae,Jeong, Hae-Do 한국전기전자재료학회 2011 전기전자재료학회논문지 Vol.24 No.1
Copper (Cu) had been attractive material due to its superior properties comparing to other metals such as aluminum or tungsten and considered as the best metal which can replace them as an interconnect metal in integrated circuits. CMP (Chemical Mechanical Polishing) technology enabled the production of excellent local and global planarization of microelectronic materials, which allow high resolution of photolithography process. Cu CMP is a complex removal process performed by chemical reaction and mechanical abrasion, which can make defects of its own such as a scratch, particle and dishing. The abrasive particles remain on the Cu surface, and become contaminations to make device yield and performance deteriorate. To remove the particle, buffing cleaning method used in post-CMP cleaning and buffing is the one of the most effective physical cleaning process. AE(Acoustic Emission) sensor was used to detect dynamic friction during the buffing process. When polishing is started, the sensor starts to be loaded and produces an electrical charge that is directly proportional to the applied force. Cleaning efficiency of Cu surface were measured by FE-SEM and AFM during the buffing process. The experimental result showed that particles removed with buffing process, it is possible to detect the particle removal efficiency through obtained signal by the AE sensor.
임용관(IM Yong-gwan),정해도(JEONG Hae-do),정성일(CHUNG Sung-il),박선준(PARK Sun-jun) 대한기계학회 2003 대한기계학회 춘추학술대회 Vol.2003 No.11
Rapid prototyping(RP) has been used for design verification and proto sample or mold manufacturing. Many RP systems have been introduced into the market during the past 15 years. However, until now, the systems have used mainly for external physical models (mono function), and have the basic but critical limitation of one material on one stage (mono material). To overcome the limitations of mono-material and mono-function of conventional RP systems, the concept of Functional Prototype Development (FPD) is newly proposed in this paper. FPD provides the necessary prototype functions such as mechanical, optical, chemical and electrical properties in order to meet the broad requirements of the industry. The paper illustrates the representative achievements of electronic components such as the multi-layer printed circuit board(MLB). Experimental results demonstrate that FPD has great potential applied to broad industrial uses and that it will be a powerful tool in the near future.