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PZT 세라믹 레조네이터 무연솔더 접합부의 열-기계적 피로 가속수명
홍원식,박노창,오철민,Hong, Won-Sik,Park, No-Chang,Oh, Chul-Min 한국재료학회 2009 한국재료학회지 Vol.19 No.6
In this study, we optimized Pb-free Sn/Ni plating thickness and conditions were optimized to counteract the environmental regulations, such as RoHS and ELV(End-of Life Vehicles). The $B_{10}$ life verification method was also suggested to have been successful when used with the accelerated life test(ALT) for assessing Pb-free solder joint life of piezoelectric (PZT) ceramic resonator. In order to evaluate the solder joint life, a modified Norris-Landzberg equation and a Coffin-Manson equation were utilized. Test vehicles that were composed of 2520 PZT ceramic resonator on FR-4 PCB with Sn-3.0Ag-0.5Cu for ALT were manufactured as well. Thermal shock test was conducted with 1,500 cycles from $(-40{\pm}2)^{\circ}C$ to $(120{\pm}2)^{\circ}C$, and 30 minutes dwell time at each temperature, respectively. It was discovered that the thermal shock test is a very useful method in introducing the CTE mismatch caused by thermo-mechanical stress at the solder joints. The resonance frequency of test components was measured and observed the microsection views were also observed to confirm the crack generation of the solder joints.
결정질 실리콘 태양광 모듈의 Potential Induced Degradation 진단 분석
오원욱,박노창,천성일 한국태양광발전학회 2018 한국태양광발전학회지 Vol.4 No.2
The potential induced degradation (PID) phenomenon of crystalline silicon photovoltaic (PV) modules has been often found in outdoor PV systems until recently since firstly reported in 2010. Many studies have been conducted about the mechanism and the preventive methods, but systematic diagnosis of the PID has not been applied on-site. This paper focuses on analysis of 5 categories and 10 PID diagnosis methods using the monitoring data, light current-voltage, dark current-voltage, infrared and electroluminescence. We expect to contribute to improvement of power generation through PID diagnosis and troubleshooting in PV plants.
강병준,박노창,탁성주,오원욱,Sungeun Park,김영도,이해석,김동환 대한금속·재료학회 2014 METALS AND MATERIALS International Vol.20 No.2
This paper reports a study on reducing the yield strength of Cu ribbon wire used for Si solar cellinterconnections in solar panels. Low yield strength Cu core should be used as the interconnector ribbonto minimize the fracture of Si solar cells during the tabbing process. We lowered the yield strength of Curibbon by controlling the crystallographic texture without increasing the annealing time and temperature. The crystallographic texture was controlled by lubrication in a cold rolling process. The crystallographictexture was observed by scanning electron microscopy with electron back scattered diffraction. A tensiletest was performed for the comparison of the mechanical properties of Cu with and without lubrication. Theaverage yield strength was 91.2 MPa with lubrication whereas the yield strength was 99.6 MPa withoutlubrication. The lower value of the lubricated samples seemed to be caused by the higher cube textureintensity than that of the samples without lubrication.