http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
Trinocular Vision System을 이용한 물체 자세정보 인식 향상방안
김종형(Jong Hyeong Kim),장경재(Kyoungjae Jang),권혁동(Hyuk-dong Kwon) 한국생산제조학회 2017 한국생산제조학회지 Vol.26 No.2
Recently, robotic bin-picking tasks have drawn considerable attention, because flexibility is required in robotic assembly tasks. Generally, stereo camera systems have been used widely for robotic bin-picking, but these have two limitations: First, computational burden for solving correspondence problem on stereo images increases calculation time. Second, errors in image processing and camera calibration reduce accuracy. Moreover, the errors in robot kinematic parameters directly affect robot gripping. In this paper, we propose a method of correcting the bin-picking error by using trinocular vision system which consists of two stereo cameras andone hand-eye camera. First, the two stereo cameras, with wide viewing angle, measure object’s pose roughly. Then, the 3rd hand-eye camera approaches the object, and corrects the previous measurement of the stereo camera system. Experimental results show usefulness of the proposed method.
김종형(Jong Hyeong Kim),Chanh D. Tr. Nguyen 제어로봇시스템학회 2013 제어·로봇·시스템학회 논문지 Vol.19 No.11
Shape recognition of solder ball bumps in a BGA (Ball Grid Array) is an important issue in flip chip bonding technology. In particular, the semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding as the density of balls has increased dramatically. The difficulty of this issue comes from specular reflection on the metal ball. Shape recognition of a metal ball is a very realproblem for computer vision systems. Specular reflection of the metal ball appears, disappears, or changes its image abruptly due to tiny movementson behalf of the viewer. This paper presents a practical shape recognition method for three dimensional (3-D) inspection of a BGA using a 5-step ring illumination device. When the ring light illuminates the balls, distinctive specularity images of the balls, which are referred to as“iso-slope contours” in this paper, are shown. By using a mathematical reflectance model, we can drive the 3-D shape information of the ball in aquantitative manner. The experimental results show the usefulness of the method for industrial application in terms of time and accuracy.
김종형(Jong Hyeong Kim),Chanh D. Tr. Nguyen 제어로봇시스템학회 2015 제어·로봇·시스템학회 논문지 Vol.21 No.12
Fast inspection of solder ball bumps in ball grid array (BGA) is an important issue in the flip chip bonding technology. Particularly, semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding, as the density of balls increase dramatically. In this paper, we describe an inspection approach of BGA balls by using 5-step ring illumination device and normalized cross-correlation (NCC) method. The images of BGA ball by the illumination device show unique and distinguishable characteristic contours by their 3-D shapes, which are called as “iso-slope contours”. Template images of reference ball samples can be produced artificially by the hybrid reflectance model and 3D data of balls. NCC values between test and template samples are very robust and reliable under well-structured condition. The 200 samples on real wafer are tested and show good practical feasibility of the proposed method.
웨이퍼 레벨 패키지 공정의 웨이퍼 크기변화에 따른 최적화 설계
김종형(Kim, Jong Hyeong),고현준(Ko, Hyun Jun),임승용(Lim, Seung Yong) 한국전시산업융합연구원 2015 한국과학예술융합학회 Vol.19 No.-
최근 반도체 산업 동향은 생산 원가의 절감을 위해 12인치(300mm) 웨이퍼를 지나 18인치(450mm) 웨이퍼로 동향이 변하고 있는 추세이다. 때문에 치수 변화에 따른 웨이퍼 레벨 패키지 공정의 박막 증착을 위한 공정의 호환성 검증이 필요시 된다. 웨이퍼 레벨패키지 기술은 웨이퍼 표면상에 회로 패키지를 형성함으로 패키지의 크기를 최소화 할 수 있는 반도체기술이다. 이러한 패키징 공정에 있어 가장 중요한 요소는 휨과 깨짐 현상이다. 우리는 12인치와 18인치의 웨이퍼에 댐의 높이 및 열 분포에 따른 열적 특성을 유한요소해석 방식을 통해 최적화 공정을 설계하려 한다. 여기서 댐이란 웨이퍼 상의 이미지 센서의 균일한 부착 및 충전물질이 넘치는 것을 방지하는 역할을 한다. 때문에 본 연구에서는 유한요소 해석을 통해 댐의 형상이 패키지의 신뢰성 성능에 끼치는 영향성을 판단하고, 3D 모델링된 패키지 모델에 대한 열적 기계적 시뮬레이션을 통해 결과를 분석하였다. Recently the wafer size migration from 12" (300 mm) to 18" (450 mm) for the industry cost reduction can be achieved. Because it requires better thin film deposition property and the larger process compatibility. Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and crack are major concerns for semiconductor manufacturing. We optimized the 12” and 18” wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.
김종형(Jong Hyeong Kim),고경철(Kyung-chul Koh) 제어로봇시스템학회 2013 제어·로봇·시스템학회 논문지 Vol.19 No.12
A 3D visual sensing method using a laser structured beam is presented for robotic tracking applications in a simple and reliable manner. A cylindrical shaped laser structured beam is proposed to measure the pose and position of the target surface. When the proposed laser beam intersects on the surface along the target trajectory, an elliptic pattern is generated. Its ellipse parameters can be induced mathematically by the geometrical relationship of the sensor coordinate and target coordinate. The depth and orientation of the target surface are directly determined by the ellipse parameters. In particular, two discontinuous points on the ellipse pattern, induced by seam trajectory, indicate mathematically the 3D direction for robotic tracking. To investigate the performance of this method, experiments with a 6 axis robot system are conducted on two different types of seam trajectories. The results show that this method is very suitable for robot seam tracking applications due to its excellence in accuracy and efficiency.
김종형(Jong Hyeong Kim),김형직(Hyung-jik Kim),정재남(Jae Nam Jung),장동휘(Dong-hee Jang),권혁동(Hyuk-dong Kwon) 한국생산제조학회 2017 한국생산제조학회지 Vol.26 No.2
Various drones have extended application area very fast. In this paper, we define two contradictions in designing a portable-size drone by using TRIZ technique. The first is a physical contradiction between high rigidity and good portability, and the second is a technical contradiction between high stability and good portability. Through TRIZ technique, six design principles, which guide direction for optimal design, were driven. Consequently, an umbrella mechanism and design criteria were proposed for a portable-size drone. Detail design is verified through finite element method. Test results for the portable-size prototype drone show good performance, and prove its usefulness to be equivalent to a general full-size drone.
SURF, CAMSHIFT와 광류를 이용한 모바일 로봇의 객체 추종에 관한 연구
김종형(Jong Hyeong Kim),장경재(Kyung Jae Jang),임승용(Seung-Yong Lim) 한국생산제조학회 2017 한국생산제조학회지 Vol.26 No.5
This study proposed a novel tracking algorithm for a mobile robot using modified CAMSHIFT and optical flow. CAMSHIFT algorithm is vulnerable to the lighting, brightness and speed of the object because it is based on the HSV color space model. To overcome the difference of light condition, the searching window of CAMSHIFT is set by SURF algorithm. Optical flow information is used to predict the position and velocity of the fast-moving object. The CAMSHIFT searching window in an image can be adjusted quickly. Furthermore, an ultra-sonic sensor is used to calculate the distance to an object. The proposed fusion algorithm shows superior performance in terms of accuracy, speed and reliability, compared with original SURF and CAMSIFT.
김종형(Jong Hyeong Kim),박인남(In Nam Park) 한국생산제조학회 2020 한국생산제조학회지 Vol.29 No.3
As the field of automation system expands widely with technological advances, the variety of highly adaptable end effectors and their mechanical freedom become significant. Rigid gripper, initially popular, now faces new challenges in various robotic applications because its movement is limited with an inflexible mechanical configuration of the link and joint. In this paper, a flexible gripper with three pneumatic actuators is developed for handling fragile or unshaped objects. The mapping between the pneumatic actuator and air pressure has nonlinear characteristics for motion control. Furthermore, it can change slightly by a small difference in manufacturing condition. The actuators, made from silicon, are driven pneumatically with a controller of the micro-processor. We demonstrated a classic robot task of turning a fragile light bulb into a socket by the flexible gripper, which has been regarded as an arduous job for the rigid gripper.