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김재근,김재명,Kim, Jae-Geun,Kim, Jae-Myeong 한국전자통신연구원 1989 전자통신 Vol.11 No.2
본고에서는 현대 디지틀 전송 분야에서 널리 이용되고 있는 여러가지 전송 방식별 원리 및 특징 등에 대해 고찰하였고, 이를 통해 최근 들어 대두된 동기식 전송기술이 차지하는 위치를 조명해 보았다. 또한 동기식 전송기술의 출현 배경, 망의 기능 및 특징 등의 분석과 함께 발전 전망등을 살펴봄으로써 동기식 다중 전송망과 관련된 전반적인 기술성, 경제성, 방식의 효율성을 제시하였다.
김재근,이성경,Kim, Jae-Geun,Lee, Seong-Gyeong 한국전자통신연구원 1992 전자통신 Vol.14 No.2
본 고에서는 향후 전송망의 기반을 이룰 SDH(Synchronous Digital Hierarchy) 기본 동기식 다중기술의 원리, 특징 등을 살펴보고, 이의 국내.외적인 연구개발 동향을 조사하여 기술한다. 또한 향후 SDH전송과 관련하는 국제적인 표준화, 기술개발 방향, 그리고 망구축 방향 등을 예측하여 제시한다.
김재근,Kim, Jae-Geun 한국전자통신연구원 1992 전자통신 Vol.14 No.2
본고에서는 광대역 multi-media 서비스를 제공하는 ATM(Asynchrous Transfer Mode) 기본 B-ISDN 전송망의 실현에 바탕을 두고, ATM 프로토콜 및 전달망의 구조 측면에서 ATM 신호경로의 설정과 이의 OAM(Operations, Administration and Maintenance) 방법,SDH(Synchronous Digital Hierachy) 기본 ATM 전송로의 구성, 그리고 관련 전송망 요소들에 대해 제시한다. 또한 기존 PDH(Plesiochronous Digital Hierarchy) 기본망으로부터 SDH-ATM 망으로, 그리고 기존 서비스 전용망으로부터 B-ISDN 으로의 진화전략을 전송망 측면에서 고찰한다.
김재근,이선왕,김호진,홍계원,이희균,Kim, Jae-Geun,Lee, Sun-Wang,Kim, Ho-Jin,Hong, Gye-Won,Lee, Hee-Gyoun 한국초전도학회 2006 Progress in superconductivity Vol.7 No.2
Nickel and nickel-tungsten alloy were electroplated on a cold rolled and heat treated copper(Cu) substrate. 4 mm-thick high purity commercial grade Cu was rolled to various thicknesses of 50, 70, 100 and 150 micron. High reduction ratio of 30% was applied down to 150 micron. Rolled texture was converted into cube texture via high temperature heat treatment at $400-800^{\circ}C$. Grain size of Cu was about 50 micron which is much smaller compared to >300 micron for the Cu prepared using smaller reduction pass of 5%. 1.5 km-long 150 micron Cu was fabricated with a rolling speed of 33 m/min and texture of Cu was uniform along length. Abnormal grain growth and non-cube texture appeared for the specimen anneal above $900^{\circ}C$. 1-10 micron thick Ni and Ni-W film was electroplated onto an annealed cube-textured Cu or directly on a cold rolled Cu. Both specimens were annealed and the degree of texture was measured. For electroplating of Ni on annealed Cu, Ni layer duplicated the cube-texture of Cu substrate and the FWHM of in plane XRD measurement for annealed Cu layer and electroplated layer was $9.9^{\circ}\;and\;13.4^{\irc}$, respectively. But the FWHM of in plane XRD measurement of the specimen which electroplated Ni directly on cold rolled Cu was $8.6^{\circ}$, which is better texture than that of nickel electroplated on annealed Cu and it might be caused by the suppression of secondary recrystallization and abnormal grain growth of Cu at high temperature above $900^{\circ}C$ by electroplated nickel.
분사열분해 CVD 법으로 증착된 YBCO 박막의 특성에 미치는 기판 온도의 영향
김재근,홍석관,유석구,조한우,김병주,안지현,홍계원,이희균,Kim, Jae-Geun,Hong, Suk-Kwan,Yu, Seok-Koo,Cho, Han-Woo,Kim, Byung-Joo,Ahn, Ji-Hyun,Hong, Gye-Won,Lee, Hee-Gyoun 한국초전도학회 2007 Progress in superconductivity Vol.9 No.1
YBCO films have been synthesized using a spray pyrolysis method. We used nitrates of Y, Ba, Cu as precursors. Deposition was made on $LaAlO_3$ (100) single crystal substrate by spraying the mist of aqueous precursor solution generated by a concentric nozzle. The distance between concentric nozzle and substrate was 15 cm. C-axis oriented films were obtained at deposition temperature of $740{\sim}800^{\circ}C$ and working pressure of 20 Torr. Oxygen partial pressure was 3 Torr and substrate was transported with the speed ranging from 0.23 cm/min to 0.7 cm/min by reel to reel. Scanning electron microscope (SEM) and X-ray diffraction (XRD) observation revealed that films are smooth and highly textured with (001) planes parallel to substrate. Highest critical current density (Jc) was $1.38\;MA/cm^2$ at 77K and self-field for the film with a thickness of $0.5\;{\mu}m$ prepared at a substrate temperature of $780^{\circ}C$ and $PO_2\;=3\;Torr$. The effect of temperature on the microstructure and YBCO phase formation will be discussed.