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작업자 무영향도출수준(worker-DNEL)의 사업장 적용을 위한 평가 연구
윤영희 ( Young Hee Yoon ),이석원 ( Seok Won Lee ),정현희 ( Hyun Hee Jung ),김관식 ( Kwan Sick Kim ) 한국산업위생학회 2013 한국산업보건학회지 Vol.23 No.1
OObbjjeeccttiivveess: The purpose of this study is to calculate the worker-DNEL (Derived No Effect Level) values using the REACH guidance and compare the calculated DNELs with existing Korea occupational exposure limits (KOELs) for evaluation of the applicability of the worker-DNELs as provisional occupational exposure limits for chemicals that are not established KOELs in the workplace. MMeetthhooddss: The worker-DNELs for 46 chemicals among 113 hazardous substance requiring management were calculated using the REACH guidance, and a paired t-test was performed to see if there is any statistical difference between two lists (worker- DNELs vs KOELs). The ratios of KOELs over worker-DNELs were also calculated to compare the overall levels of two lists using the geometric means method. RReessuullttss: The calculated worker-DNELs for 46 chemicals ranged from 0.001 to 329 mg/m3 (GM= 6.9, GSD = 10.8), and appeared to be a significant difference between the worker-DNELs and the KOELs (p < 0.01). In addition, the ratios of KOELs over worker- DNELs ranged from 0.3 to 394 times (GM = 10.2, GSD = 3.9), indicating that the worker-DNELs were, on average, 27 times lower than the KOELs. CCoonncclluussiioonnss: Therefore, the study results show that the calculated worker-DNELs can be applied and used as provisional occupational exposure limits in the workplace in order to reduce worker exposures to chemicals and health risks, and manage potential worker exposures based on the precautionary principle through comprehensive chemical risk assessment.
자율신경 기능 이상을 동반한 Guillain-Barre 증후군 1례
김동웅,신선호,조권일,신학수,한명아,최진영,최우정,양재훈,정용준,김관식,Kim, Dong-Ung,Shin, Sun-Ho,Cho, Gwon-Il,Shin, Hak-Su,Han, Myung-A,Choi, Jin-Young,Choi, Woo-Jung,Yang, Jae-Hun,Chung, Yong-Jun,Kim, Kwan-Sick 대한한방내과학회 2001 大韓韓方內科學會誌 Vol.22 No.3
Guillain-Barre syndrome, or acute inflammatory demyelinating Polyradiculoneuropathy, is frequently accompanied by cardiac and autonomic dysfunction. We report a patient who had tachycardia, orthostatic hypotension, hypertension, pronounced blood pressure fluctuations, abnormal sweating, constipation and urinary frequency as well as qudriparesis. We thought that the GBS was incurred by Damp-Heat, used Heat-Clearing and Dampness-Transforming decoction(Chongjoo-tang) in the early stage. In the later stage, fortifying the Spleen and Boosting Qi plus Supplementing the Kidney decoction(Palmultang+chongawon) was used to remove low back pain and boost recovery. The patient reached the nadir 14 days after onset. He became bed-bound and autonomic dysfunction was very severe. From 3rd week, abnormalities of autonomic function and paresis impoved gradually and he could walk above 5m without walker or equivalent support at the 5th week after onset.
반도체 웨이퍼 제조공정 클린룸 구조, 공기조화 및 오염제어시스템
최광민 ( Kwang Min Choi ),이지은 ( Ji Eun Lee ),조귀영 ( Kwi Young Cho ),김관식 ( Kwan Sick Kim ),조수헌 ( Soo Hun Cho ) 한국산업보건학회 2015 한국산업보건학회지 Vol.25 No.2
Objectives: The purpose of this study was to examine clean room(C/R) structure, air conditioning and contamination control systems and to provide basic information for identifying a correlation between the semiconductor work environment and workers`` disease. Methods: This study was conducted at 200 mm and 300 mm semiconductor wafer fabrication facilities. The C/R structure and air conditioning method were investigated using basic engineering data from documentation for C/R construction. Furthermore, contamination parameters such as airborne particles, temperature, humidity, acids, ammonia, organic compounds, and vibration in the C/R were based on the International Technology Roadmap for Semiconductors(ITRS). The properties of contamination control systems and the current status of monitoring of various contaminants in the C/R were investigated. Results: 200 mm and 300 mm wafer fabrication facilities were divided into fab(C/R) and sub fab(Plenum), and fab, clean sub fab and facility sub fab, respectively. Fresh air(FA) is supplied in the plenum or clean sub fab by the outdoor air handling unit system which purifies outdoor air. FA supply or contaminated indoor air ventilation rates in the 200 mm and 300 mm wafer fabrication facilities are approximately 10-25%. Furthermore, semiconductor clean rooms strictly controlled airborne particles(≤ 1,000 #/ft³), temperature(23±0.5℃), humidity(45±5%), air velocity(0.4 m/s), air change(60-80 cycles/hr), vibration(≤ 1 cm/s²), and differential pressure(atmospheric pressure + 1.0-2.5 mmH2O) through air handling and contamination control systems. In addition, acids, alkali and ozone are managed at less than internal criteria by chemical filters. Conclusions: Semiconductor clean rooms can be a pleasant environment for workers as well as semiconductor devices. However, based on the precautionary principle, it may be necessary to continuously improve semiconductor processes and the work environment.
반도체 작업환경 내 부산물로 생성되는 실리카 입자의 크기, 형상 및 결정 구조
최광민 ( Kwang Min Choi ),여진희 ( Jin Hee Yeo ),정명구 ( Myung Koo Jung ),김관식 ( Kwan Sick Kim ),조수헌 ( Soo Hun Cho ) 한국산업보건학회 2015 한국산업보건학회지 Vol.25 No.1
Objectives: This study aimed to elucidate the physicochemical properties of silica powder and airborne particles as by-products generated from fabrication processes to reduce unknown risk factors in the semiconductor manufacturing work environment. Materials and Methods: Sampling was conducted at 200 mm and 300 mm semiconductor wafer fabrication facilities. Thirty-two powder and airborne by-product samples, diffusion(10), chemical vapor deposition(10), chemical mechanical polishing(5), clean(5), etch process(2), were collected from inner chamber parts from process and 1st scrubber equipment during maintenance and process operation. The chemical composition, size, shape, and crystal structure of silica by-product particles were determined by using scanning electron microscopy and transmission electron microscopy techniques equipped with energy dispersive spectroscopy, and x-ray diffractometry. Results: All powder and airborne particle samples were composed of oxygen(O) and silicon(Si), which means silica particle. The by-product particles were nearly spherical SiO2 and the particle size ranged 25 nm to 50 μm, and most of the particles were usually agglomerated within a particle size range from approximately 25 nm to 500 nm. In addition, the crystal structure of the silica powder particles was found to be an amorphous silica. Conclusions: The silica by-product particles generated from the semiconductor manufacturing processes are amorphous SiO2, which is considered a less toxic form. These results should provide useful information for alternative strategies to improve the work environment and workers‘ health.