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      • 카드뮴이 뇌혈관 내피세포에서의 $PGE^2$ 및 COX-2 발현에 미치는 영향

        박동현,김영채,문창규,정이숙,백은주,문창현,이수환,Park Dong-Hyun,Kim Young-Chae,Moon Chang-Kiu,Jung Yi-Sook,Baik Eun-Joo,Moon Chang-Hyun,Lee Soo-Hwan 환경독성보건학회 2006 환경독성보건학회지 Vol.21 No.3

        In order to get insight into the mechanism of cadmium (Cd)-induced brain injury, we investigated the effects of Cd on the induction of COX-2 in bEnd.3 mouse brain endothelial cells. Cd induced COX-2 expression and $PGE_2$ release, which were attenuated by thiol-reducing antioxidant N-acetylcysteine (NAC) indicating oxidative components might contribute to these events. Indeed, Cd increased cellular reactive oxygen species (ROS) level and DNA binding activity of nuclear factor-kB (NF-kB), an oxidative stress sensitive transcription factor. Cd-induced $PGE_2$ production and COX-2 expression were significantly attenuated by Bay 11 7082, a specific inhibitor of NF-kB and by SB203580, a specific inhibitor of p38 mitogen activated protein kinase (MAPK). These data suggest that Cd induces COX-2 expression through activation of NF-kB and p38 MAPK, the oxidative stress-sensitive signaling molecules, in brain endothelial cells.

      • KCI등재

        <서평> Die Menschen der Bibel: Ein illustriertes Lexikon der Heiligen Schrift

        박동현 (재)대한성서공회 성경원문연구소 2015 성경원문연구 Vol.- No.36

        This Book can be regarded as an adapted translation of Who is Who in the Bible? An Illustrated Biographical Dictionary(The Reader’s Digest Association, 1994) which contains more than 500 biographical articles on men/women, gods, and angels in the Bible including the apocryphal books. The German translation, omitting 41 articles from the English original, has gained a new clothing particularly by changing most of about 200 illustrating materials(oilpaintings, aquarelles, frescos, altarpieces, pictures in the books, icon images, carpet pictures, wood engravings, copperplate engravings, enamel paintings, mosaics, and so on) with better ones. Each article of the lexicon consists of the name of the person treated, the transliteration of his/her name in the original language(s), explaining the meaning of his/her name, evaluating of the person in the biblical traditon, summarizing the biblical stories about him/her sometimes with useful informations not only on the historical, geographical, and cultural backgrounds, but also on the history of interpretation, influence, and reception. This illustrated biographical dictionary seems to be edited for the ordinary people who are interested in the life of men/women in the Bible. Throughout the whole book the biblical texts are retold on the basis of well-balanced exegetical and theological interpretations so easily and vividly that readers could feel as if they were hearing a storyteller recounting 400 individual stories of life. A great advantage from this book lies in the abundant illustrated materials, which can afford readers to take a glance at the history of Western Biblical Art. Other extra-biblical materials help them to understand the biblical stories on wider dimensions. Pastors and teachers can make good use of them. Some mistakes need to be corrected. For example, in the Article on Paul the First Epistle to the Thessalonians is falsely said to be the first written book of the Old(!) Testament(p. 315). Moreover, it would be better if the articles on the gods and angels could be gathered and put at the end of the book as appendices. In any case, the German Bible Society has succeeded in notably upgrading of a book originally published in a somewhat old fashion for the modern people. Now readers can understand better than before how God has been using various kinds of people to fulfill his own will in the human history.

      • KCI등재

        지하안전관리 지원을 위한 3차원 지반정보 구축 방안 연구

        박동현,장용구,최현상 한국지리정보학회 2018 한국지리정보학회지 Vol.21 No.1

        Recently, mainly in downtown, there have been frequent safety incidents in underground space like ground subsidence and land sinking. Out of diverse coping measures, the government is carrying forward the establishment of underground space integrated map. As a core element of the underground space integrated map, the 3D geotechnical information is used as major data of underground space impact assessment obliged in accordance with the 「Special Act on the Safety Control of Underground Space Safety」. The construction method of 3D geotechnical information is drawn when establishing the basic establishment plan of underground space integrated map, and the continuous construction is performed by the Integrated DB Center of National Geotechnical Information. However, it is necessary to draw concrete measures with accuracy, efficiency, and utilization. This study drew the construction plan considering the accuracy, utilization, and efficiency of 3D geotechnical information for the support of underground space safety. For this, accuracy between elevation and underground level is compared using MVS and MakeJiban which are software to construct boring information with geotechnical information in geotechnical information portal system. In the results of general analysis, the milepost-based construction of whole strata in a lump would be the most suitable in the aspect of accuracy, utilization, and efficiency. Based on the results of this study, Plan to construct 3D geotechnical information will be pursued. 최근 대도심지를 중심으로 지반침하, 지반함몰 등 지하공간에서의 안전사고가 빈번히 발생하고 있다. 이에 정부차원에서의 다양한 대응방안을 마련하고 있으며, 이의 일환으로 지하공간통합지도 구축을 추진 중에 있다. 3차원 지반정보는 지하공간통합지도의 핵심 구성요소이며, 「지하안전관리에 관한 특별법」에 따라 의무화된 지하안전영향평가의 주요 데이터로 활용된다. 3차원 지반정보의 구축 방법은 지하공간통합지도 구축 기본계획 수립 시 도출되고 국토지반정보 통합DB센터에서 지속적인 구축을 추진하고 있으나, 정확성, 효율성, 활용성을 고려한 구체적인 방안 도출이 필요한 실정이다. 본 연구에서는 지하안전관리 지원을 위해 3차원 지반정보의 정확성, 활용성, 구축 효율성을 고려한 구축 방안을 도출하고자 하였다. 이를 위해 국토지반정보 포털시스템에서 보유한 시추정보와 지반정보 구축 소프트웨어인 MVS, MakeJiban을 활용하여 표고와 지층 기반의 구축 높이 정확도를 비교하였다. 종합적인 분석결과 정확성, 활용성, 효율성 측면에서 원표고 기반의 전체 지층 일괄 구축이 가장 적합한 것으로 판단되었다. 향후, 본 연구결과를 바탕으로 일괄성 있는 3차원 지반정보 구축을 추진할 계획이다.

      • KCI등재

        온도/습도 시험, 온도 싸이클링 시험 및 고온유지 시험에 따른 Package-on-Package의 신뢰성

        박동현,오태성,Park, Donghyun,Oh, Tae Sung 한국마이크로전자및패키징학회 2016 마이크로전자 및 패키징학회지 Vol.23 No.3

        박형 package-on-package에 대해 T/H (temperature/humidity) 시험, TC (temperature cycling) 시험과 HTS(high temperature storage) 시험을 사용하여 신뢰성을 분석하였다. T/H 시험은 $85^{\circ}C/85%$의 조건으로 500시간, TC 시험은 $-40{\sim}100^{\circ}C$의 조건으로 1000회, HTS 시험은 $155^{\circ}C$의 조건으로 1,000시간 범위에서 평가하였다. 폴리이미드 써멀테이프를 사용하여 제작한 24개의 package-on-package (PoP) 시편에 대해 신뢰성 시험 전에 측정한 솔더접속 배선의 평균저항은 $0.56{\pm}0.05{\Omega}$이었으며, 24개 시편에서 모두 유사한 값이 측정되었다. 500시간까지의 T/H 시험, 1000회의 TC 시험 및 1,000시간까지의 HTS 시험후에도 솔더 접속부의 오픈 불량은 발생하지 않았다. Reliability characteristics of thin package-on-packages were evaluated using T/H (temperature/humidity) test at $85^{\circ}C/85%$ for 500 hours, TC (temperature cycling) test at $-40{\sim}100^{\circ}C$ for 1,000 cycles, and HTS (high temperature storage) test at $155^{\circ}C$ for 1,000 hours. The average resistance of the solder-bump circuitry between the top and bottom packages of 24 package-on-package (PoP) samples, which were processed using polyimide thermal tape, was $0.56{\pm}0.05{\Omega}$ and quite similar for all 24 samples. Open failure of solder joints did not occur after T/H test for 500 hours, TC test for 1,000 cycles, and HTS test for 1,000 hours, respectively.

      • 만성 C형 간염의 초치료를 위한 페그인터페론과 리바비린 병합요법

        박동현,이상욱,유진석,이준섭,권혜정 고신대학교(의대) 고신대학교 의과대학 학술지 2012 고신대학교 의과대학 학술지 Vol.27 No.2

        Objectives: The combination therapy with peginterferon and ribavirin has been used to treat chronic hepatitis C for several years in Korea but there is a few report about the results of the treatment. We evaluated safety and efficacy of the combination therapy with Peg-interferon and ribavirin and analyzed factors that may affect treatment Methods: Total 72 untreated chronic hepatitis C patients were administered pegylated interferon alfa-2a (180μg/week) or alfa-2b (1.5μg/kg/week) and ribavirin (800 mg/day in genotype 2, 1000-1200 mg/day in genotype 1). Duration of the treatment was 24 weeks in genotype 2 and 48 weeks in genotype 1. Response of the treatment was evaluated by rapid virologic response (RVR), early virologic response (EVR), end treatment virologic response (ETR), sustained virologic response (SVR) and adverse event. Results: The RVR, EVR, ETR, SVR were 61.8%, 82.5%, 88.9% and 80.5% retrospectively. The SVR of genotype 1 was 63.4% and non-genotype 1 was 96.7%. Genotype (Odds ratio: 14.92) was an independent predictor of the SVR. Leukocytopenia, flu-like symptoms, itching, rash and anemia were common adverse events of the combination therapy and if then we reduced dose and there was one case of cessation. Conclusions: The combination therapy with Peg-interferon and ribavirin shows efficacy to the Korean patients with chronic hepatitis C as an initial treatment. Genotypes 2 and 3 were more likely to have a sustained virologic response.

      • KCI등재

        공정 단계에 따른 박형 Package-on-Package 상부 패키지의 Warpage 특성 분석

        박동현,정동명,오태성 한국마이크로전자및패키징학회 2014 마이크로전자 및 패키징학회지 Vol.20 No.2

        Warpage of top packages to form thin package-on-packages was measured with progress of their process stepssuch as PCB substrate itself, chip bonding, and epoxy molding. The 100 μm-thick PCB substrate exhibited a warpage of136~214 μm. The specimen formed by mounting a 40 μm-thick Si chip to such a PCB using a die attach film exhibited thewarpage of 89~194 μm, which was similar to that of the PCB itself. On the other hand, the specimen fabricated by flip chipbonding of a 40 μm-thick chip to such a PCB possessed the warpage of -199~691 μm, which was significantly differentfrom the warpage of the PCB. After epoxy molding, the specimens processed by die attach bonding and flip chip bondingexhibited warpages of -79~202 μm and -117~159 μm, respectively. 박형 package-on-package의 상부 패키지에 대하여 PCB 기판, 칩본딩 및 에폭시 몰딩과 같은 공정단계 진행에따른 warpage 특성을 분석하였다. 100 μm 두께의 박형 PCB 기판 자체에서 136~214 μm 범위의 warpage가 발생하였다. 이와 같은 PCB 기판에 40 μm 두께의 박형 Si 칩을 die attach film을 사용하여 실장한 시편은 PCB 기판의 warpage와 유사한 89~194 μm의 warpage를 나타내었으나, 플립칩 공정으로 Si 칩을 PCB 기판에 실장한 시편은 PCB 기판과 큰 차이를보이는 -199~691 μm의 warpage를 나타내었다. 에폭시 몰딩한 패키지의 경우에는 DAF 실장한 시편은 -79~202 μm, 플립칩 실장한 시편은 -117~159 μm의 warpage를 나타내었다.

      • 근골격계 부담작업 기준을 이용한 병원 작업에 대한 평가

        박동현,기서원,최순영 대한안전경영과학회 2011 대한안전경영과학회 학술대회논문집 Vol.2011 No.11

        This study has three objectives; 1) Evaluate major jobs of hospital workers based on Criterion(Notification number 2003-24 from Ministry of Labor in Korea) for high-risk job for musculoskeletal disorders(MSDs), 2) Relate each jobs in criterion and the hospital jobs considered in this study, 3) Relate each jobs in criterion and MSDs symptoms of hospital workers. A total 141 hospital jobs was evaluated. Most hospital jobs belonged to the numbers 2(Job with repetitive motions by neck, shoulder, elbow, wrist or hand more than 2 hours a day) and 4(Job with unsupported and deviated postures by neck or back more than 2 hours a day) from criterion. Most hospital workers participated in this study thought that the numbers 1(Job with keyboard or mouse work more than 4 hours a day) and 2 from criterion were associated with their jobs. Further study for hospital jobs should be focused on breaking down quantification levels of each numbers in the criterion due to its atypical and non-repetitive job characteristics of hospital jobs.

      • KCI등재

        박형 기판을 사용한 Package-on-Package용 상부 패키지와 하부 패키지의 Warpage 분석

        박동현,신수진,안석근,오태성,Park, D.H.,Shin, S.J.,Ahn, S.G.,Oh, T.S. 한국마이크로전자및패키징학회 2015 마이크로전자 및 패키징학회지 Vol.22 No.2

        박형 package-on-package의 상부 패키지와 하부 패키지에 대하여 에폭시 몰딩 컴파운드(EMC)에 따른 warpage 특성을 분석하였다. 또한 동일한 EMC로 몰딩한 패키지들의 warpage 편차를 측정하고 박형 상부 기판과 하부 기판 자체의 warpage 편차를 측정함으로서, 박형 패키지에서 warpage 편차를 유발하는 원인을 분석하였다. 박형 기판을 사용한 상부 및 하부 패키지에서는 기판 자체의 큰 warpage 편차에 기인하여 EMC의 물성이 패키지의 warpage에 미치는 영향을 규명하는 것이 어려웠다. EMC의 몰딩 면적이 $13mm{\times}13mm$로 기판($14mm{\times}14mm$)의 대부분을 차지하는 상부 패키지에서는 온도에 따른 warpage의 변화 거동이 유사하였다. 반면에 EMC의 몰딩 면적이 $8mm{\times}8mm$인 하부 패키지의 경우에는 (+) warpage와 (-) warpage가 한 시편에 모두 존재하는 복합적인 warpage 거동에 기인하여 동일한 EMC로 몰딩한 패키지들에서도 상이한 온도-warpage 거동이 측정되었다. Warpage analysis has been performed for top and bottom packages of thin package-on-packages processed with different epoxy molding compounds (EMCs). Warpage deviation was measured for packages molded with the same EMCs and also the warpage deviations of top and bottom substrates themselves were characterized in order to identify the major factor causing the package warpage. For the top and bottom packages processed with thin substrates, the warpage deviation of the substrates was large, which made it difficult to figure out the effect of EMC properties on the package warpage. Top packages, where the molding area of $13mm{\times}13mm$ covered the most of the substrate area ($14mm{\times}14mm$), exhibited similar warpage behavior with changing the temperature. On the other hand, bottom packages, where the molding area was only $8mm{\times}8mm$, exhibited the complex warpage behavior due to simultaneous occurrence of (+) and (-) warpages on the same package. Accordingly, the bottom packages showed dissimilar temperature-warpage behavior even being processed with the same EMCs.

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