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Development of bonded wafer Inspection System using optimization
Sajadieh.S.M.Mehdi,Si-Eun Yang,Chang-Woo Ban,Hyo-Suk Ahn,Dong-Young Jang,Young-Hwan Lim,Seok-kee Hong 한국생산제조학회 2009 한국공작기계학회 추계학술대회논문집 Vol.2009 No.-
Out of several critical issues, particles as well as bonded surface contamination are matters of great concerns, when considering wafer bonding in MEMS and Semiconductor fabrication technology. This study aims at reporting the development of a bonded wafer inspection system, by analyzing transmittance deviations and the changes of the intensity caused by the defect thickness. In this method, laser beam transmission is utilized to detect the exact location of defect in bonded wafer. To this end, optical design software is used while Monte-Carlo (MC) simulation approach was applied. Four parameters are considered to have more influences on irradiance distribution (uniformity) and defect detection accuracy in the system, namely; distance between each adjacent laser source, distance between laser source and diffuser, distance between diffuser and SOI wafer, and diffuser type. Using design of experiments, all produced data from screening were analyzed and optimized solution for the best irradiance distribution and detection accuracy was achieved. Implementation of the system has been done by comparing DOE optimized result with experiment result and ensuring the detection accuracy.
Development of Wafer Bond Integrity Inspection System Based on Laser Transmittance
Jang, Dong-Young,Ahn, Hyo-Sok,Mehdi, Sajadieh.S.M.,Lim, Young-Hwan,Hong, Seok-Kee The Korean Microelectronics and Packaging Society 2010 마이크로전자 및 패키징학회지 Vol.17 No.2
Among several critical topics in semiconductor fabrication technology, particles in addition to bonded surface contaminations are issues of great concerns. This study reports the development of a system which inspects wafer bond integrity by analyzing laser beam transmittance deviations and the variations of the intensity caused by the defect thickness. Since the speckling phenomenon exists inherently as long as the laser is used as an optical source and it degrades the inspection accuracy, speckle contrast is another obstacle to be conquered in this system. Consequently speckle contrast reduction methods were reviewed and among the all remedies have been established in the past 30 years the most adaptable solution for inline inspection system is applied. Simulation and subsequently design of experiments has been utilized to discover the best solution to improve irradiance distribution and detection accuracy. Comparison between simulation and experimental results has been done and it confirms an outstanding detection accuracy achievement. Bonded wafer inspection system has been developed and it is ready to be implemented in FAB in the near future.