공정시스템 , 이동현상 , 화학공정안전 : 반도체칩 봉지재용 에폭시 몰딩 컴파운드의 점도거동 = Process System Engineering , Transport Phenomena , Process Safety : Viscosity Behaviors of Epoxy Molding Compound for the Semiconductor Microchip Encapsulant

다국어 초록 (Multilingual Abstract)

The viscosity of epoxy molding compound(EMC) for the encapsulation of semiconductor chip has been measured using a parallel plate rheometer and a specially designed slit rheometer. The viscosity of EMC at low temperature and low shear rate has been determined with a parallel plate rheometer, while that at high temperature and high shear rate has been determined with the slit rheometer. The experimental results of the parallel plate rheometer revealed that the modified Cox-Merz relation was more suitable for the characterization of viscosity behavior of EMC than the Cox-Merz relation. The viscosity data measured using the specially designed slit rheometer at high temperature and shear rate exhibited a good agreement with the fitted values calculated using the Cross-Macosko equation. The Cross-Macosko equation and Kamal equation determined by the slit rheometer and differential scanning calorimeter(DSC), respectively, made a good prediction in spiral flow length of EMC.