피로인산동 도금용액으로부터 전기도금 된 Cu 도금층의 물성에 미치는 인가전류밀도의 영향

다국어 초록 (Multilingual Abstract)

Copper pyrophosphate baths were employed in order to study the dependencies of current efficiency, residual stress, surface morphology and microstructure of electrodeposited Cu thin layers on applied current density. The current efficiency was obtained to be more than about 90 %, independent of the applied current density. Residual stress of Cu electrodeposits was measured to be in the range of -30 ㎫ and 25 ㎫ with the increase of applied current density from 0.5 to 15 ㎃/㎠. Relatively smooth surface morphologies of the electodeposited Cu layers were obtained at an intermediate current range between 3 and 4 ㎃/㎠. The Cu electrodeposits showed FCC(111), FCC(200), and FCC(220) peaks and any preferred orientation was not observed in this study. The average crystalline size of Cu thin layers was measured to be in the range of 44∼69 ㎚.

목차 (Table of Contents)

• Abstract
• 1. 서론
• 2. 실험 방법
• 3. 결과 및 토의
• 4. 결론
• References

참고문헌 (Reference)

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