Simulation and design of EMI shielding performance of smart adhesives for mobile applications = Simulation and design of EMI shielding performance of smart adhesives for mobile applications

다국어 초록 (Multilingual Abstract)

Recently, the widespread use of mobile devices and wireless networks has created a hostile electromagnetic environment for integrated circuits (ICs) and even the human body. The electromagnetic radiation from ICs with very small feature sizes may induce undesirable electromagnetic coupling between data paths, which results in the unintentional electromagnetic field that can cause undesirable currents and various disturbances. Such disturbances can cause either temporary malfunctions or even permanent damage of the recently developed electronic devices that operate at hundreds of MHz with harmonic noise emissions in the GHz region. In particular, highly integrated electronic systems can result in very complex issues around radio frequency noise in the near-field magnetic field that cannot be removed with conventional shields and grounding techniques, because of the noise signal reflected from the highly conductive shields. In our study, we have investigated EMI shieding characteristics of smart adhesive materials for mobile applications by predicting and designing shielding performance through numerical analysis on a transmmision line in a predominantly magnetic field.