In accordance with the demand for the portability and convenience, the communications equipment is being made increasingly smaller. The miniaturization of communications equipment is that the natural convection cooling by heat sink than forced convect...
In accordance with the demand for the portability and convenience, the communications equipment is being made increasingly smaller. The miniaturization of communications equipment is that the natural convection cooling by heat sink than forced convection cooling by fan is required, and the modules electronic components have been made integration. Accordingly, the reliability of heat dissipation was the important issue. In this paper, the temperature of the modules major electronic components should be satisfied with allowable temperature. So, we suggested the design optimization for a compact communications equipment using the heat sink. A commercial CFD(computational fluid dynamics) tool icepak 14.5 are used to optimize the structure of heat dissipation.