The continuous scaling of transistors has led to unprecedented challenges for interconnect technologies. Conventional barriers fail when thinned below 4 nm; therefore, novel materials and back‐end‐of‐line (BEOL) compatible synthesis are urgently...
http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
https://www.riss.kr/link?id=O113284968
2019년
-
2196-7350
SCOPUS;SCIE
학술저널
n/a-n/a [※수록면이 p5 이하이면, Review, Columns, Editor's Note, Abstract 등일 경우가 있습니다.]
0
상세조회0
다운로드다국어 초록 (Multilingual Abstract)
The continuous scaling of transistors has led to unprecedented challenges for interconnect technologies. Conventional barriers fail when thinned below 4 nm; therefore, novel materials and back‐end‐of‐line (BEOL) compatible synthesis are urgently...
The continuous scaling of transistors has led to unprecedented challenges for interconnect technologies. Conventional barriers fail when thinned below 4 nm; therefore, novel materials and back‐end‐of‐line (BEOL) compatible synthesis are urgently needed. 2D transition metal dichalcogenides present a unique opportunity for addressing the scaling of interconnects. Here, nanometer thick Nb‐incorporated MoS2 is successfully synthesized at BEOL compatible temperatures and their abilities of blocking Cu atom diffusion are investigated. Nb incorporation of MoS2 is systematically studied at 450 °C and its growth dynamics is compared with those carried out at high temperatures. The addition of a few percent Nb in MoS2 enhances breakdown time by more than 100×, reaching a failure time >12 500 s under the electric field of 7 MV cm−1. These results suggest that integration of Nb‐incorporated MoS2 in electronic technologies is a promising route for the sub‐5 nm technology node.
In this work, MoS2 thin film synthesized at 450 °C by metal organic chemical vapor deposition is consistently studied. Complementary characterizations are utilized to understand MoS2 thin film microstructure and its impact on copper diffusion barrier performance. A powder‐based doping method is demonstrated with the purpose of incorporating niobium atoms throughout the MoS2 film to better qualify for being copper diffusion barrier.
Masthead: (Adv. Mater. Interfaces 22/2019)