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Study on underfill/solder adhesion in flip-chip encapsulation
Lianhua, F., et al. IEEE 2002 p.473-480
A novel assembling technique for fiber collimator arrays using UV-curable adhesives
Hong, Z., et al. IEEE 2002 p.481-487
Thermal characteristics of glass-metal composition plasma display panels
Mikyoung, L. and M. Pecht IEEE 2002 p.488-494
Design and fabrication of thin film resistive heaters for hybrid optoelectronic packaging
Datta, M., et al. IEEE 2002 p.495-502
Characterization of liquid crystal polymer for high frequency system-in-a-package applications
Gang, Z., et al. IEEE 2002 p.503-508
Kwang-Lung, L. and H. Jia-Wei IEEE 2002 p.509-513
Xiaowu, Z., et al. IEEE 2002 p.514-521
Fang, Y., et al. IEEE 2002 p.522-527
Equivalent network synthesis for via holes discontinuities
Antonini, G., et al. IEEE 2002 p.528-536
The effect of solder bump pitch on the underfill flow
Wen-Bin, Y. and Y. Wen-Lin IEEE 2002 p.537-542