Low-voltage electrophoretic deposition of polyetherimide through quarternization and re-imidization reactions

다국어 초록 (Multilingual Abstract)

The electrophoretic deposition (EPD) process successfully applied for the deposition of quarternized polyetherimide (q-PEI) emulsion on the Cu surface in the relatively low voltage range of 2~7 V. Allowing the rheological movement of q-PEI suspension drops to move to the cathode, this voltage level allowed q-PEI (or PEI) coating to be in the thickness range in a few micrometers within 300 sec. The coating thickness increased with the applied voltages and seemed to reach a plateau with time seemingly allowing a stable control of EPD operating conditions. The low-voltage in EPD minimized the violent water electrolysis or gas evolution, and subsequently the quality of the deposited PEI layer was excellent with the RMS roughness in 15~35 nm. The thermally transformation of q-PEI to PEI was confirmed using FT-IR. Based on the electro-rheological theory of suspension drops under electrical potential, the key operation parameters of EPD, i.e., deposition time and applied voltage, were thoroughly investigated by measuring the thickness,surface roughness, and cross-section images of specimens. This work demonstrated that the low-voltage EPD could minimize the gas evolution rates and, thus, provide a high-quality PEI coating on metal surfaces without pinholes, voids, or delaminated areas within a reasonable span of EPD processing time.

참고문헌 (Reference)

1 Jeong, J., "Solution processed SiNxCyOz thin films thermally transformed from silicon oxide/melamine hybrid system" 539 : 294-302, 2013

2 Krevelen, D.W., "Properties of Polymers" Elsevier 1994

3 Krevelen, D.W., "Properties of Polymers" Elsevier 2009

4 Allen, "Process for electrophoretic deposition of polymer"

5 Schafheutle, M.A., "Polyesters and their use as additives in coating compositions"

6 Buchwalter, S.L., "Electrophoretic deposition of polyimide: Electrocoating on the cathode" 407 : 154-167, 1989

7 Qariouh, H., "Electrophoretic deposition of polyetherimide from an aqueous emulsion: optimisation of some deposition parameters" 48 : 1183-1192, 1999

8 Omer, O., "Electrophoretic deposition of materials" 29 : 327-352, 1999

9 Sarkar, P., "Electrophoretic deposition (EPD): Mechanisms, Kinetics, and application to ceramics" 79 : 1987-2002, 2005

10 Zlata., K., "Electrochemistry of polymer deposition" 119 : 149-165, 1973

11 Yong-Sung Eom, "Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder" 한국전자통신연구원 32 (32): 414-421, 2010

12 Noh, B.I., "Effects of number of reflows on the mechanical and electrical properties of BGA package" 14 : 1375-1378, 2006

13 Ferrari, B., "EPD kinetics: A review" 30 : 1069-, 2010

14 Baek, J.W., "Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a lowmelting point solder" 87 : 1968-1972, 2010

15 Neirinck, B., "Aqueous electrophoretic deposition in asymmetric AC fields (ACEPD)" 11 : 57-60, 2009

16 Besra, L., "A review on fundamentals and applications of electrophoretic deposition (EPD)" 52 : 1-61, 2007